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SLC NAND Flash

SLC Nand Flash

Product Supplier Key Features
SLC NAND Flash Winbond Electronics
  • 46nm SLC NAND technology in Winbond’s 12” Fab
  • 1Gb/2Gb/4Gb/8Gb (on 46nm) available, 4Gb (on 32nm)
  • 3V power supply
  • Continuous 52MB/s Read Data Throughput ideal for Code-Shadowing applications
  • Backward-compatible with SpiNOR Instruction Set with some additional commands
  • Low pin-count SpiNOR packages (SOIC-16, WSON-8, TFBGA-24) & MCP options
  • On Chip 1-Bit ECC correction and Bad Block Management for data integrity
  • Automotive and Industrial certified

    SLC NAND Flash Overview: https://www.winbond.com/hq/product/code-storage-flash-memory/slc-nand-flash/?__locale=en
Design-In Support

Serial NOR Flash

Serial NOR Flash

Product Supplier Key Features
W25Q Serial NOR Flash Family Winbond Electronics
  • 2Gbit to 512Kbit superset compatible with 25X
    • SPI, Dual-SPI, Quad-SPI and QPI (for many devices)
    • Uniform 4KB, 32KB & 64KB erase
    • Erase and Program Suspend/Resume
    • Quad Page Program
    • Security: Lock-down, ID#, OTP registers
    • Serial Flash Discoverable Parameters (SFDP)
  • Automotive and Industrial certified
  • High Performance
    • 104MHz Clock, 416MHz Quad-SPI (50MB/S)
    • Fast-boot or execute code (XIP) from SPI
  • Voltage & Package Options
    • 3V (2.7~3.6V), 2.5V (2.3~3.6V) and 1.8V (1.65~1.95V)
    • Space saving packages: 8-pin SOIC, WSON, VSOP, USON, WLCSP, 16-pin SOIC, 24-ball TFBGA
    • Known Good Die (KGD) wafers
Design-In Support Data Sheet

MCP

MCP

Product Supplier Key Features
NAND Based MCP Winbond Electronics Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on the PCB (Printed Circuit Board). This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications. NAND Based MCP Overview: https://www.winbond.com/hq/product/code-storage-flash-memory/nand-based-mcp/?__locale=en

Hyper RAM

Hyper RAM

Product Supplier Key Features
Hyper RAM Winbond Electronics Compared to traditional PSRAM, HyperRAM® has more throughout and smaller form factor size than PSRAM does. Hyper RAM Overview: https://www.winbond.com/hq/product/mobile-dram/hyperram/?__locale=en

Serial NAND Flash

Serial NAND Flash

Product Supplier Key Features
Seriell NAND Flash Winbond Electronics NAND Flash memory requires a controller to manage functions like detecting and correcting errors in some memory locations, managing memory blocks with errors, and relocating locations with errors to new locations that are error-free. These Serial NAND family of products have built-in ECC (Error Correcting Code that detects and corrects errors) and offer contiguous good memory (bad block management), and hence off loads these functions from the controller. Typically in most systems, code stored in flash, is transferred to DRAM for faster execution of code with the processor. This is known as code shadowing. System designers are always looking for products that can transfer the code very quickly from flash to DRAM. Winbond’s “continuous read” functionality transfers the contents of NAND very quickly to the DRAM. Seriell NAND Flash Overview: https://www.winbond.com/hq/product/code-storage-flash-memory/serial-nand-flash/?__locale=en

Wi-Fi Bluetooth Kombi Module

XBee Cellular

XBee Cellular Modems

Product Supplier Key Features
Digi XBee Cellular 3G Digi International
  • FCC/IC, PTCRB, and AT&T certified – eliminates certification
    costs and risks
  • Transparent and API modes simplify software integration
  • Low-power modes for battery powered applications
  • Integrated MicroPython programmability enables custom scripting directly on the modem
  • Enhanced with Digi TrustFence® security framework
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support

8-Bit Microcontroller

8-Bit 8051 Flash

Product Supplier Key Features
Holtek Standard 8051 Holtek Semiconductor
  • Internal clock 3.68MHz
  • 64K programming memory
  • All common interfaces SPI/I2C/UART/ADC, temperature sensor, I/Os,
  • 4 x 16-bit timer
Design-In Support
Nuvoton 8051 series Nuvoton Technology
  • Pin-compatible with traditional 12T 8051
  • 4T/6T/12T 8051 processor
  • Max frequency of 40MHz
  • Up to 128kB of flash memory, 2kB SRAM
  • Operating at 2.4V to 5.5V
  • Operating temperature: -40℃ to 85℃
  • Connectivity: UART, SPI, I²C
  • ADC with up to 8 channels, 10-bit resolution, up to 96kSPS
  • Provides 22.1184MHz internal oscillator (1% accuracy at 25℃, 5V)
  • Data flash configurable and high immunity (8KV ESD, 4KV EFT)
Design-In Support

8-Bit Flash

Product Supplier Key Features
Holtek Flash Holtek Semiconductor Cost-Effective Flash MCUs with EEPROM
  • Proprietary architecture to further decrease costs
  • Internal clock up to 16MHz
  • Fully integrated internal oscillator requires no external components
  • Up to 64K flash
  • Up to 0.5us instruction cycle with 8MHz system clock
Design-In Support

8-Bit OTP

Product Supplier Key Features
Holtek OTP Holtek Semiconductor Cost-Effective MCUs with EEPROM
  • Proprietary architecture to further decrease costs
  • Internal clock up to 12MHz
  • Fully integrated internal oscillator requires no external components
  • Up to 64K flash
  • Up to 0.5us instruction cycle with 8MHz system clock
Design-In Support

32-Bit ARM Cortex Mx Microcontroller

ARM Cortex M0 MCUs

Product Supplier Key Features
ARM Cortex M0 MCUs Nuvoton Technology
  • Max frequency of 72 MHz
  • Up to 128KB of flash memory, 20KB SRAM
  • Operating at 1.8 ~ 3.6V; 2.5V ~ 5.5V
  • Operating Temperature -40? ~ 105?
  • Connectivity: CAN, LIN, USB, ISO-7816-3, LCD, UART, SPI, I²C
  • ADC, up to 16 channels, 12-bit resolution
ARM Cortex-M0 MCUs Nuvoton Technology
  • Max. frequency of 72MHz
  • Up to 128kB of flash memory, 20kB SRAM
  • Operating at 1.8V to 3.6V; 2.5V to 5.5V
  • Operating temperature range: -40℃ to +105℃
  • Connectivity: CAN, LIN, USB, ISO-7816-3, LCD, UART, SPI, I²C
  • ADC with up to 16 channels, 12-bit resolution
Design-In Support

ARM Cortex M3 MCUs

Product Supplier Key Features
HT32 Holtek Semiconductor General Purpose MCUs
  • Cost-Effective MCU
  • Up to 256K Flash
  • Up to 32K SRAM
  • System clock up to 72MHz
  • CRC: CCITT CRC-16 and Ethernet CRC-32
  • I2S (Inter-IC Sound)
  • Master or Slave mode
  • Mono or stereo
  • 8 / 16 / 24 / 32-bit sample size
  • 8 x 32-bit Tx & Rx FIFO with PDMA supported
  • EBI (External Bus Interface)
  • High Speed Bus, up to 36MB/s
  • With programmable timing and interfaces
  • Supports a wide range of devices such as SRAM / NOR Flash / LCD
Design-In Support Data Sheet

ARM Cortex M4 MCUs

Product Supplier Key Features
ARM Cortex M4 MCUs Nuvoton Technology
  • Max frequency of 100 MHz
  • Up to 2MB of flash memory, 128KB SRAM
  • Operating at 2.5V ~ 5.5V
  • Operating Temperature -40? ~ 105?
  • Connectivity: Ethernet, SD-Host, CAN, LIN, USB OTG, USB Device, ISO-7816-3, UART, SPI, I²C
  • ADC, up to 16 channels, 12-bit resolution
ARM Cortex-M4 MCUs Nuvoton Technology
  • Max. frequency of 100MHz
  • Up to 2MB of flash memory, 128kB SRAM
  • Operating at 2.5V to 5.5V
  • Operating temperature range: -40℃ to +105℃
  • Connectivity: Ethernet, SD-Host, CAN, LIN, USB OTG, USB Device, ISO-7816-3, UART, SPI, I²C
  • ADC with up to 16 channels, 12-bit resolution
Design-In Support

ARM Cortex M0+ MCUs

Product Supplier Key Features
ARM Cortex-M0+ MCUs Holtek Semiconductor
  •  Power
  • Lowest active 150μA/MHz
  • Idle 2μA
  • Performance
    • 2 - 10x higher than 8/16-Bit MCU
  • Flash
    • Full range from 16KB to 128KB Flash
  • Device
    • Up to 8 products, 20 devices pin-to-pin compatible
  • Ecosystem
    • Rich development resources, tools ans solutions
Design-In Support More Info Data Sheet

32-Bit ARM Microprocessor - System on Chip (SoC)

Digi ARM9 Microprocessor Solutions

Product Supplier Key Features
NS9215 Digi International
  • 32-bit system-on-chip with ARM926EJ-S core
  • Integrated 10/100 Mbit Ethernet MAC
  • On-chip high-performance encryption engine
  • Power management and rich set of interfaces
  • Industrial operating temperature
  • Speed Grades: 75/150MHz
  • 4 KB I-cache / 4 KB D-cache
  • Process: 0.18μ CMOS
  • Up to 108 GPIOs
  • 265-pin BGA
  • 15 x 15 mm
  • 12-bit ADC
Data Sheet Design-In Support
NS9210 Digi International
  • 32-bit system-on-chip with ARM926EJ-S core
  • Integrated 10/100 Mbit Ethernet MAC
  • On-chip high-performance encryption engine
  • Power management and rich set of interfaces
  • Drop-in replacement option for NS7520 designs
  • Speed grades: 75/150MHz
  • 4 KB I-cache / 4 KB D-cache
  • Process: 0.18μ CMOS
  • Up to 54 GPIOs
  • 177-pin BGA
  • 13 x 13 mm
Data Sheet Design-In Support

System on Modules (SoM)

Digi Connect Core Modules

Product Supplier Key Features
Digi CC6 UL SoM Digi International  
  • Secure, connected, highly cost-effective system-on-module
    • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
    • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Stamp-sized and flexible Digi SMTplus form factor
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.2 option
  • Integrated dual 10/100 Ethernet connectivity
  • Dedicated on-module security + authentication controller
  • Unique ultra-low power and wake-up state management
  • Turnkey embedded Linux software platform with Digi
    TrustFence™ embedded device security framework
  • Long-term availability and 5-year warranty
Data Sheet Design-In Support
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454 MHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Running Linux or Android
  • Up To 256MB Flash and RAM
  • Single/dual 10/100 Mbit/s Ethernet
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature range
Data Sheet Design-In Support

Digi Connect Modules

Product Supplier Key Features
Digi ConnectCore 6 SOM Digi International  
  • Scalable Cortex-A9 multi-core performance
  • Independent Cortex-M0+/Cortex-M4 Microcontroller
  • Assist™ subsystem
  • Cost-effective, reliable, low-profile surface-mount module form factor
  • Pre-certified 802.11a/b/g/n and Bluetooth 4.0
  • Smart Power Management Architecture with PMIC
  • Android, Yocto Project Linux and Windows Embedded
  • Compact software platform support
  • Reliable design with IEC 60068 and HALT verification
  • Designed for long-term availability
Data Sheet Design-In Support
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support

PremierWave Modules

Product Supplier Key Features
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Micro SOM Snapdragon Modules

Product Supplier Key Features
Inforce SOM 6601 Inforce Computing ◾Snapdragon™ 820, Quad-core Kryo™ ARMv8 ISA CPU 64-bit @2.2GHz/1.6GHz
◾Adreno™ 530 GPU, Hexagon™ 680 DSP and dual integrated ISPs
◾4K Ultra video with H.265 HEVC playback @4K60 and receiver @4K60
◾4GB PoP LPDDR4 and 64GB UFS
◾Wi-Fi 802.11ac, BT 4.2 LE and GPS Connectivity
◾Dual MIPI-CSI, Dual MIPI-DSI, USB 3.0, USB 2.0, PCIe, SDC, 12x BLSPs, 8x GPIO, HDMI and expandibility
◾Fastest time to market
◾Product-ready & tested
◾Seamless industry / RF certification
◾Standard Software – Android and Linux
Data Sheet Design-In Support
Inforce SOM 6401 Inforce Computing ◾Snapdragon™ 600E, Quad-core Krait 300 CPU @1.7GHz
◾Adreno™ 320 GPU, Hexagon™ DSP, and Integrated ISP
◾FullHD H.264 playback and capture @1080p
◾Dual MIPI-CSI, Dual MIPI-DSI, Micro HDMI, 2x USB2.0 (host), 1x USB2.0 (OTG), PCIe, and expansion header
◾2GB LPDDR2 and 4GB eMMC (Upgradable to 32GB eMMC) Wi-Fi/BT/GbE/GPS connectivity
◾Fastest time to market
◾Product-ready & tested
◾Seamless industry / RF certification
◾Standard Software – Android and Linux
◾10 years supply guarantee
Data Sheet Design-In Support
Inforce SOM 6301 Inforce Computing ◾Snapdragon™ 410E, Quad-core ARM® Cortex® A53 64-bit @1.2GHz
◾Adreno™ 306 GPU, Hexagon™ DSP, and Integrated ISP
◾H.264 playback and capture @1080p, H.265 playback @720p, HD Audio 5.1
◾1GB LPDDR3, 8GB eMMC, MicroSD
◾Wi-Fi 802.11 b/g/n, BT 4.1 LE, GPS
◾4-lane DSI to HDMI, 2x USB2.0 (Host), micro USB2.0, and expansion header
◾Fastest time to market
◾RF certification
◾Standard software – Android and Linux
◾10-year supply guarantee
Data Sheet Design-In Support

802.15.4, 868MHz, Mesh technologies, ZigBee

BT Mesh

Product Supplier Key Features
CSR Mesh Qualcomm
  • Simple direct control & config from a Smartphone to a device from anywhere in the network
  • No access hubs, routers or other devices
  • No single point of failure
  • Proven BT Smart Technology
    • Co-exists well with WiFi
    • Neither interfere with each other
  • Secure and robust
  • Protected against eavesdroppers and man-in-middle attacks
  • Three carrier channels
  • Extends the reach of BT Smart beyond 1 radio link
  • Flood mesh algorithm
  • CSR Mesh will extend beyond lighting
  • Home/ building/ industrial automation, proximity, asset tracking coming in future releases
Design-In Support

XBee 802.15.4 Modules

Product Supplier Key Features
XBee 802.15.4 Digi International
  • 4 different antenna options (wire, PCB, U.fl, RPSMA)
  • 2,4GHz for worldwide employment
  • 900MHz for longe range deployment
  • Low power sleep mode
  • Industrial temperature range (-40°C to +85°C)
Data Sheet Design-In Support
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

XBee Digi Mesh Modules

Product Supplier Key Features
XBee Digi Mesh Digi International
  • 2,4GHz for worldwide employment
  • Multiple antenna options
  • Simple deployment and growth
  • Outdoor line-of-sight range up to 1 mile
  • Digi Mesh peer-to-peer mesh networking protocol
  • Self-healing and discovery for network stability
  • Sleeping router supported for longer battery life
  • No configuration needed for out-of-box RF communications
  • Ready to be used with ConnectPort X gateways
Data Sheet Design-In Support

ZigBee Embedded Modules

Product Supplier Key Features
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

XBee Cellular

Product Supplier Key Features
Digi XBee Cellular 3G Digi International
  • FCC/IC, PTCRB, and AT&T certified – eliminates certification
    costs and risks
  • Transparent and API modes simplify software integration
  • Low-power modes for battery powered applications
  • Integrated MicroPython programmability enables custom scripting directly on the modem
  • Enhanced with Digi TrustFence® security framework
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support

Antenna solutions

Antennas for Cellular and LTE

Product Supplier Key Features
flexiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
flexiiANT Antenova

• 824-960MHz / 1710-2170MHz
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 680 - 2700 Mhz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• GSM850 / 900 / 1800 / 1900/ WCDMA
• M2M and IoT requirements

Design-In Support Data Sheet

Antennas for Bluetooth, Wi-Fi, ZigBee

Product Supplier Key Features
flexiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• Swivel/SMD mounting
• M2M and IoT requirements

Design-In Support Data Sheet
ceriiANT Antenova

• 2.4-2.5 GHz
• Extremely compact antennas
• Highly efficient
• SMD mounting

Design-In Support Data Sheet

Antennas for GNSS: GPS, GLONASS, Beidou, Galileo

Product Supplier Key Features
Zenon Antenova
  • REFLECTOR Technology
  • Antenna for 2.4GHz applications
  • Bluetooth, Wi-Fi, ZigBee, ISM
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Robusta Antenova
  • REFLECTOR Technology
  • Antenna for GNSS applications
  • GPS, GLONASS, Beidou and Galileo
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Latona Antenova
  • Antenna for LP-WAN applications. Including NB-IOT, LoRa, SigFox, ISM and Weightless-P
  • Frequency bands from 791- 960MHz
  • Maintains high performance on device: DFI (Designed for Integration)
  • Corner placement to save space
  • Low profile innovative design
  • Supplied on Tape and Reel
  • Automotive temperature rating.
Data Sheet Design-In Support
Grandis Antenova
  • Antenna for ISM 868 and 915 MHz applications including LoRa, SigFox, and
    Weightless-P
  • Frequency bands from 863 - 928MHz
  • Maintains high performance on device: DFI (Designed for Integration)
  • Corner placement to save space
  • Low profile innovative design
  • SMD mounting
  • Supplied in Tape and Reel
  • Automotive temperature rating
Data Sheet Design-In Support

Antennas for Wireless M2M

Product Supplier Key Features
Zenon Antenova
  • REFLECTOR Technology
  • Antenna for 2.4GHz applications
  • Bluetooth, Wi-Fi, ZigBee, ISM
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Antennas Antenova
  • Antennas for a wide range of uses:
    • Bluetooth
    • WiFi
    • ZigBee
    • GNSS
    • Cellular
  • Various Frequencies and Dimension
  • Please refer to PDF for more information

Audio ADC

Audio ADCs

Product Supplier Key Features
AK5388 AKM - Asahi Kasei Microdevices
  • 24-bit, 216kHz sampling 4-channel A/D converter for high-end audio systems
  • Uses AKM’s Enhanced dual bit architecture, enabling it to realize high accuracy and low cost
  • 120dB dynamic range/ 110dB S/(N+D)
  • Digital filter with modified FIR architecture minimizing group delay while maintaining excellent linear phase response
  • Available in 44pin LQFP package
Data Sheet More Info Design-In Support
AK5730 AKM - Asahi Kasei Microdevices
  • 4-channel ADC withMIc amplifier & diagnostics
  • Supports Line and Microphone inputs, making it ideal for microphone array applications
  • TDM audio format makes it easy to connect with DSP
  • Perfectly suited for car audio applications
Data Sheet More Info Design-In Support
AK5720 AKM - Asahi Kasei Microdevices
  • 2 channel 24-bit ADC w, TDM, Mic amp & short group delay
  • Includes an Input Gain Amplifier, making it suitable for microphone applications
  • Single-ended analog signal input, eliminating the need for external filters
  • Housed in a space-saving 16-pin TSSOP package
Data Sheet More Info Design-In Support

Premium 32bit ADCs

Product Supplier Key Features
AK557x AKM - Asahi Kasei Microdevices
  • With support for: 2,4,6 or 8 channels
  • High Sampling Rate? PCM 768kHz max
  • Ultra Low Power? 1/2 of current market level
  • WW No1 SNR? 127dB
  • THD+N: -110dB
  • WW Minimum Latency 5/fs
  • VELVET SOUND & Selectable 5 Sound Colors
  • 2 to 8 channel
AK5558 AKM - Asahi Kasei Microdevices

● Number of Channel: 6ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 261mW
● Package: 64-pin QFN (9mm x 9mm)

Design-In Support Data Sheet
AK5556 AKM - Asahi Kasei Microdevices

● Number of Channel: 6ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 206mW
● Package: 64-pin QFN (9mm x 9mm)

Design-In Support Data Sheet
AK5554 AKM - Asahi Kasei Microdevices

● Number of Channel: 4ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 140mW
● Package: 48-pin QFN (7mm x 7mm)

Design-In Support Data Sheet
AK5552 AKM - Asahi Kasei Microdevices

● Number of Channel: 2ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 83mW
● Package: 48-pin QFN (7mm x 7mm)

Design-In Support Data Sheet
AK5578 AKM - Asahi Kasei Microdevices
  • S/(N+D): 112 dB
  • Sampling Rate: 8 kHz-768 kHz
  • Input: Full Differential Inputs
  • Internal Filter: Four types of LPF, Digital HPF
  • Power Supply: 4.75-5.25 V (Analog), 1.7-1.98 V or 3.0-3.6 V (Digital)
  • Output Format:
    • PCM mode: 24/32-bit MSB justified, I2S or TDM
    • DSD mode: DSD Native 64, 128, 256
    • Maximized Slot Efficiency in TDM Mode by Optimal Data Placed Mode
  • Cascade TDM I/F:
    • TDM512: fs= 48 kHz
    • TDM256: fs= 96 kHz or 48 kHz
    • TDM128: fs= 192 kHz, 96 kHz or 48 kHz
  • Operation Mode: Master Mode & Slave Mode
  • Detection Function: Input Overflow Flag
  • Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting is also available)
  • Power Consumption: 536 mW (@AVDD= 5.0 V, TVDD= 3.3 V, fs= 48 kHz)
  • Package: 64-pin QFN
Data Sheet Design-In Support
AK5576 AKM - Asahi Kasei Microdevices
  • S/(N+D): 110dB
  • Sampling Rate: 8kHz to 768kHz
  • Full Differential Inputs
  • 32Bit Digital Filter
    • Sharp Roll-Off Filter
    • Slow Roll-Off Filter
    • Short Delay Sharp Roll-Off Filter
    • Short Delay Slow Roll-Off Filter
  • DR, S/N: 120dB (Mono Mode: 123dB)
  • Digital HPF
  • Power Supply: 4.75~ 5.25V(Analog), 1.7~1.98V or 3.0 to 3.6V(Digital)
  • Output Format: 24/32bit MSB justified, I2S or TDM
  • Cascade TDM I/F: 16ch/48kHz, 8ch/96kHz, 4ch/192kHz
  • DSD (64fs, 128fs, 256fs) Output Data
  • Master & Slave Modes
  • Overflow Flag
  • 3-wire Serial and I2C μP I/F
  • Power Consumption: 452.9 mW (@AVDD=5.0V, TVDD=3.3V, fs=48kHz)
  • Package: 64-pin QFN
Data Sheet Design-In Support
AK5574 AKM - Asahi Kasei Microdevices
  • S/(N+D): 110dB
  • Sampling Rate: 8kHz to 768kHz
  • Full Differential Inputs
  • 32Bit Digital Filter
    • Sharp Roll-Off Filter
    • Slow Roll-Off Filter
    • Short Delay Sharp Roll-Off Filter
    • Short Delay Slow Roll-Off Filter
  • DR, S/N: 120dB (Mono Mode: 123dB)
  • Digital HPF
  • Power Supply: 4.75~ 5.25V(Analog), 1.7~1.98V or 3.0 to 3.6V(Digital)
  • Output Format: 24/32bit MSB justified, I2S or TDM
  • Cascade TDM I/F: 16ch/48kHz, 8ch/96kHz, 4ch/192kHz
  • DSD (64fs, 128fs, 256fs) Output Data
  • Master & Slave Modes
  • Overflow Flag
  • 3-wire Serial and I2C μP I/F
  • Power Consumption: 302.2mW (@AVDD=5.0V, TVDD=3.3V, fs=48kHz)
  • Package: 48-pin QFN
Data Sheet Design-In Support
AK5572 AKM - Asahi Kasei Microdevices
  • S/(N+D): 112 dB
  • Sampling Rate: 8 kHz - 768 kHz
  • Input: Full Differential Inputs
  • DR: 121 dB (2-to-1 mode: 124 dB)
  • S/N: 121 dB (2-to-1 mode: 124 dB)
  • Internal Filter: Four types of LPF, Digital HPF
  • Power Supply: 4.75-5.25 V (Analog), 1.7-1.98 V or 3.0-3.6 V (Digital)
  • Output Format
    • PCM mode: 24/32-bit MSB justified, I2S or TDM
    • DSD mode: DSD Native 64, 128, 256
  • Maximized Slot Efficiency in TDM Mode by Optimal Data Placed Mode
  • Cascade TDM I/F:
    • TDM512: fs= 48 kHz
    • TDM256: fs= 96 kHz or 48 kHz
  • TDM126: fs= 192 kHz, 96 kHz or 48 kHz
  • Operation Mode: Master Mode & Slave Mode
  • Detection Function: Input Overflow Flag
  • Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting is also available)
  • Power Consumption: 148 mW (@AVDD= 5.0 V, TVDD= 3.3 V, fs= 48 kHz)
  • Package: 48-pin QFN
Data Sheet Design-In Support
AK5397 AKM - Asahi Kasei Microdevices
  • Thoroughly engineered for highest sound quality
  • Achieves wide dynamic range and wide bandwidth, while keeping superior distortion characteristics
  • 127dB dynamic range
  • Maximum Sampling Frequency/Resolution:
  • PCM768kHz/32-bit
  • Ideal for professional studio equipment
  • 3 type of digital sound color filters
Data Sheet More Info Design-In Support

Audio Amplifier

Class D Amplifier

Product Supplier Key Features
NAU8224 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 3,1W output power
  • Chip enables pin with extremely low standby current and fast start-up time of 3,4ms
  • Ideal for the portable applications of battery drive, as it has advanced features like 87 dB PSRR, 91% efficiency, ultra low quiescent current (i.e. 2,1mA at 3,7V for 2 channels) and superior EMI performance
  • Gain can be selected from 24dB to -62dB (plus mute) by using 2 wire interface and GS pin
Data Sheet Design-In Support
NAU8223 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 3,1W output powe
  • Chip enable pin with extremely low standby current and fast start-up time of 3,4 ms
  • Ideal for the portable applications of battery drive, as it has advanced features like 87 dB PSRR, 91% efficiency, ultra low quiescent current (i.e. 2,1mA at 3,7V for 2 channels) and superior EMI performance
  • Five selectable gain settings (0 dB, 6 dB, 12 dB, 18 dB and 24 dB)
Data Sheet Design-In Support

DDFA - Direct Digital Feedback Amplifier

Product Supplier Key Features
CSRA6601 & CSRA6600 Qualcomm
  • Outstanding sound quality
  • Typical power levels from 25W to 100W into 8Ω
  • THD+N0.004%
  • Dynamic range 120dB
  • Residual output noise <60µVrms
  • High efficiency Class D architecture
  • Compatible with digital sources
  • On chip DSP resources
  • Platform solutions with CSR wireless and DSP products
CSRA6601:
  • Digital modulator
  • 8 channels
  • Signal processing
  • Digital feedback processing
  • System analysis
CSRA6600:
  • Analogue feedback processor
  • Analogue error processing
  • Digital error conversion
Design-In Support

Headphone

Product Supplier Key Features
AK4201 AKM - Asahi Kasei Microdevices
  • Audio stereo cap-less headphone amplifier
  • Eliminates the need for large DC-blocking capacitors with a built-in Charge-pump circuit
  • 100dB PSRR (Power Supply Rejection Ratio) is achieved by a built-in regulator
  • 2 Vrms outputs available with excellent linearity when used as a lineout amplifier
  • Available in tiny 12-pin USON (2,2mm x 2,9mm), saving board space, cost, and reducing component height
Data Sheet More Info Design-In Support
ISD8102/8104 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 2Wrms output power
  • Device includes output current limiting, chip enable, low standby current and excellent pop-and-click suppression
  • Internal device gain: 20dB (with external resistors any lesser amount possible)
Data Sheet Design-In Support

Audio Codecs

High Feature Low Power Audio CODECs

Product Supplier Key Features
AK4951 AKM - Asahi Kasei Microdevices
  • Includes microphone, headphone and speaker amplifiers
  • Supports sampling frequency from 8kHz to 48kHz
  • Thanks to a automatic wind noise reduction filter and a high performance digital ALC (automatic level control) circuit it can record with high-quality sound regardless of whether indoors or outdoors
  • Available in a small 32-pin QFN (AK4951EN) and a 32-pin BGA (AK4951EG) package saving mounting area on the board
Data Sheet More Info Design-In Support
AK4958 AKM - Asahi Kasei Microdevices
  • Includes Microphone & speaker amplifiers
  • Suitable for portable application with recording/playback function
  • Integrated one channel composite In/Out video amplifier
  • Available in a small 32-pin BGA (AK4958EG) or a 25-pin CSP (AK4958ECB) package saving mounting area on the board
Data Sheet More Info Design-In Support
AK4961 AKM - Asahi Kasei Microdevices
  • High sound fidelity for high resolution audio
  • Advanced recording features during video recording
  • Industry proven hands free processing capability
  • Industry leading level performance of THD+N (-99dB) and 110dB dynamic range
  • Includes AKM’s DSP core that enables:
    • Various kinds of voice processing such as voice wakeup
    • Dual mic Tx noise suppression
    • Rx noise suppression
    • Echo cancellation
    • Hands free functions
  • Five audio I/F and SLIMbus I/F
Data Sheet More Info Design-In Support

Multi-Channel Audio CODECs

Product Supplier Key Features
AK4611/12/13/14 AKM - Asahi Kasei Microdevices
  • Single chip 24-bit audio CODEC that includes:
    • 4 to 6 channel 24-bit ADC
    • 8 to 12 channel 24-bit DAC
  • ADC/DAC with Enhanced Dual Bit architecture/Advanced Multi-Bit architecture enabling very low noise performance
  • Fabricated on a low power process, the AK4611 operates off of a +3.3 V analog supply and a +1.8 V digital supply
  • Supports both single-ended and differential inputs and outputs
  • Available in an 80-pin LQFP package
Data Sheet More Info Design-In Support
AK4627/29 AKM - Asahi Kasei Microdevices
  • Single chip audio CODEC with a sampling rate of up to 96kHz
  • 4 channel 24-bit ADC
  • 6 channel or 8 channel 24-bit DAC
  • ADC/DAC with Enhanced Dual Bit architecture/Advanced Multi-Bit architecture enabling very low noise performance
  • Supports both single-ended and differential inputs and outputs
  • Available in a 48-pin LQFP package.
Data Sheet More Info Design-In Support

Software Codecs

Product Supplier Key Features
aptX - High Quality Audio Codec Qualcomm
  • Outstanding Bluetooth® Stereo audio quality
  • Audio bandwidth matching CD performance
  • Compression ratio: 4:1
  • Audio Format: 16-bit, 44,1 kHz (CD-Quality)
  • Data Rates: 352 kbps
  • Frequency Response: 10 Hz to 22 kHz
  • Algorithmic Delay:
    • Dynamic Range: 16-bit: >92 dB
    • THD+N: -68,8 dB
Design-In Support

Stereo Audio CODECs

Product Supplier Key Features
AK4621 AKM - Asahi Kasei Microdevices
  • High performance 192kHz 24-bit CODEC
  • On-board ADC with a high dynamic range due to AKM’s Enhanced Dual-Bit architecture
  • DAC with AKM’s Advanced Multi-Bit architecture that achieves low out-of-band noise and high jitter tolerance through the use of Switched Capacitor Filter (SCF) technology
Data Sheet More Info Design-In Support
AK4558 AKM - Asahi Kasei Microdevices
  • Low voltage 32-bit 216kHz CODEC
  • Includes newly developed 32-bit Digital Filter achieving short group delay and high quality sound
  • Features “OSR-Doubler” technology - making it capable of supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Single-ended analog inputs and outputs to minimize pin count and external filtering requirements
  • Housed in a very small 28-pin QFN - ideal for space-sensitive applications
Data Sheet More Info Design-In Support
AK4556 AKM - Asahi Kasei Microdevices
  • Low voltage 24-bit 192 kHz CODEC
  • Very high dynamic performance to power supply voltage ratio : -103dB SNR for ADC / 106dB SNR for DAC
  • Supports sampling rates up to 216kHz
  • Reduces jitter sensitivity by using an integrated switched-capacitor filter
  • Single-ended analog inputs and outputs to minimize pin count and external filtering requirements
  • Packaged in a very small 20-pin TSSOP - ideal for space-sensitive applications
Data Sheet More Info Design-In Support

Audio DAC

32bit Premium DACs

Product Supplier Key Features
AK4497 AKM - Asahi Kasei Microdevices
  • DR, S/N: 128dB (Mono mode: 131dB)
  • THD+N: -116dB
  • Sampling Rate8kHz to 768kHz
  • DSD Input: Max: 22.4MHz
  • Sound Color
    • 32-bit 8-fold Digital Filters
    • Short Delay Sharp Roll-off, GD=6.25/fs
    • Short Delay Slow Roll-off, GD=5.3/fs
    • Sharp Roll-off
    • Slow Roll-off
    • Super Slow Roll-off
    • Low-dispersion Short Delay
  • Resolution: 32BIT
  • Number of ChanneL: 2ch
  • Input Method: Full Differential Input
  • VELVET SOUND Technology
  • Low-distortion technology
  • OSRD (Over Sampling Ratio Doubler) technology
  • Power Consumption: 346mW
  • Power Supply
    • Analog: 4.75 to 5.25V
    • Digital: 1.7 to 3.6V
  • Operation Temperature: -40~85°C
  • Package: 64-pin TQFP (10mm x 10mm)
     
Data Sheet More Info Design-In Support
AK4454/6/8 AKM - Asahi Kasei Microdevices 32-bit 4 channel / 6 channel / 8 channel Premium DACs
  • DR, S/N: 115dB
  • Industry best low distortion characteristics
  • Digital input supports PCM inputs up to 768kHz and an 11.2MHz DSD
  • New “OSR-Doubler” technology - supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Five types of 32-bit digital filters
  • THD+N: -107dB
Data Sheet More Info Design-In Support
AK4452 AKM - Asahi Kasei Microdevices
  • DR, S/N: 115dB
  • Industry best low distortion characteristics
  • Digital input supports PCM inputs up to 768kHz and an 11,2MHz DSD
  • New “OSR-Doubler” technology - supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Five types of 32-bit digital filters
  • THD+N: -107dB
Data Sheet More Info Design-In Support
AK4414 AKM - Asahi Kasei Microdevices
  • DR, S/N: 120dB (Stereo mode: 123dB)
  • 128x Over sampling
  • Sampling rate: 30kHz to 216kHz
  • 32-bit 8x digital filter
    • Ripple: ±0.005dB, Attenuation: 80dB
    • High quality sound short delay option; GD=7/fs and GD=5.5/fs
    • Sharp roll-off filter
    • Slow roll-off filter
  • High tolerance to clock jitter
  • Low distortion differential output
  • DSD data input
  • Digital De-emphasis for 32, 44.1, 48kHz sampling
  • Soft mute
  • Digital attenuator (255 levels and 0.5dB step)
  • Stereo mode
  • THD+N: -107dB
  • I/F Format: 24/32-bit MSB justified, 16/20/24/32-bit LSB justified, I2S, DSD, TDM
  • Power supply: DVDD=AVDD=2.7V to 3.6V, VDD1/2=4.75V to 5.25V
  • Digital input level: CMOS
  • Package: 44pin LQFP
Data Sheet More Info Design-In Support
AK4495EQ AKM - Asahi Kasei Microdevices
  • SNR:123 / 120 dB
  • Internal 32-bit digital filter, layout & pin arrangement optimised for unprecedented sound quality
  • Maximum sampling frequency: PCM768kHz/32-bit
  • Maximum bitrate: DSD128 (5,6MHz)
  • THD+N: -101dB
  • 5 types of sound color digital filters
Data Sheet More Info Design-In Support
AK4490 AKM - Asahi Kasei Microdevices
  • SNR:120dB
  • Digital input supports PCM inputs up to 768kHz and DSD input of 2,8MHz / 5,6MHz  / 11,2MHz
  • Internal 32-bit Digital Filter optimized for unprecedented sound quality
  • Maximum sampling frequency: PCM768kHz/ 32-bit
  • Maximum bitrate: DSD256 (11,2MHz)
  • THD+N: -112dB
  • 5 types of sound color digital filters
Data Sheet More Info Design-In Support

Low power DACs

Product Supplier Key Features
AK4376 AKM - Asahi Kasei Microdevices
  • DAC:
    • 32-bit Advanced Audio Stereo D/A Converter
    • 4 types of Digital Filter for Sound Color Selection
  • Headphone Amplifier
    • Ground-referenced Class-G Stereo Headphone-Amp
    • THD+N: 106dB S/N: 125dB
  • Digital Audio Interface Sampling Rate: Maximum 384kHz
  • Low Jitter PLL
  • Crystal Oscillator
  • Microcomputer Interface: I2C (400kHz)
  • Power Supply: Analog: 1.7 ~ 1.9V Digital: 1.65 ~ 3.6V
  • Operation Temperature Range: -40 ~ 85°C
  • Package: 36-pin CSP, 2.74 x 2.56 mm
Data Sheet Design-In Support
AK4375 AKM - Asahi Kasei Microdevices
  • Ground-referenced headphone amplifier
  • Newly developed 32-bit digital filters for better sound quality, achieving low distortion characteristics and wide dynamic range
  • Jitter cleaner with a built-in SRC and a X’tal
  • Available in a 36-pin CSP package, utilizing less board space than competitive offerings
Data Sheet More Info Design-In Support

Audio Sample Rate Converter

Sample rate converter

Product Supplier Key Features
AK4133 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 110dB (A-weighted, Typ.)
  • 2 channels Input/Output
  • Asynchronous Sample Rate Converter
  • PCM
    • Input Sample Rate Range (FSI): 8k ~ 192kHz
    • Output Sample Rate (FSO): 44.1kHz, 48kHz
  • Input to Output Sample Rate Ratio: FSO/FSI= 44.1/192~6
  • THD+N: Up to -100dB
  • I/F format: MSB justified, I2S compatible
  • Oscillator for Internal Operation Clock
  • Clock for Master Mode: 128/256/512fso
  • Soft Mute Function
  • Power Supply: DVDD= 3.0 ~ 3.6V or 1.7 ~ 1.9V(LDO OFF Mode)
  • Operating Temperature: -40 ~ +105°C
Data Sheet Design-In Support
AK4132 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 100dB (A-weighted, Typ.)
  • 2 channels Input/Output
  • Asynchronous Sample Rate Converter
  • PCM:
    • Input Sample Rate Range (FSI): 8k ~ 96kHz
    • Output Sample Rate (FSO): 44.1kHz, 48kHz
  • Input to Output Sample Rate Ratio: FSO/FSI = 44.1/96 ~ 6
  • THD+N: Up to -90dB
  • I/F format: MSB justified, I2S compatible
  • Oscillator for Internal Operation Clock
  • Clock for Master mode: 256fso
  • Power Supply: DVDD= 3.0 ~ 3.6V or 1.7 ~ 1.9V (LDO OFF Mode)
  • Operating Temperature: -40 ~ +105ºC
Data Sheet Design-In Support
AK4137 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 188dB (A-weighted)
  • 2 channels input/output
  • Asynchronous sample rate converter with internal oscillator
  • PCM
    • Input sample rate range (FSI): 8kHz to 768kHz
    • Output sample rate range (FSO): 8kHz to768kHz
  • DSD
    • Input sample rate range (FSI): 2,8224MHz to 11,2896MHz
    • Output Sample rate range (FSO): 2,8224MHz to 11,2896MHz
  • Input to Output Sample Rate Ratio: FSO/FSI = 1/6 ~ 24
  • THD+N: up to -150dB
  • PCM/DSD converter
  • Operating temperature: Ta= -40°C to +105°C
Data Sheet More Info Design-In Support
AK4136 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 140 dB (A-weighted)
  • 2 channels input/output
  • Asynchronous Sample Rate Converter with internal oscillator
  • PCM:
    • Input sample rate range(FSI): 8kHz to 384kHz
    • Output sample rate range(FSO): 8kHz to 384kHz
  • Input to output sample rate ratio: FSO/FSI = 1/6 ~ 12
  • THD+N: up to -130dB
  • Operating temperature: Ta= -40°C to +105°C
Data Sheet More Info Design-In Support

Bluetooth Smart

Bluetooth Smart ICs

BT Smart ICs

Product Supplier Key Features
CSR102x Platform Qualcomm
  • Bluetooth 4.1 low energy radio with direct single-ended 50Ω antenna connection
  • 16-bit microprocessor with 80Kbytes RAM
  • 256 KB Internal Flash memory (some package variants)
  • 64 KB One-time Programmable (OTP) memory
  • Hardware G.722 CODEC
  • Multiple links (up to 4)
  • Integrated Bluetooth 4.2 qualified stack* (*Qualification pending)
  • I2S and I2C interfaces
  • Multiple links (up to 4)
  • SPI interface for external flash memory
Design-In Support More Info
CSR101x Platform Qualcomm
  • On-Chip Application
    • 16MHz 16bit Apps processor
    • Full stack and 50kB application on chip
  • Advanced Power Management
    • Direct battery connection
    • 900nA standby, 16mA peak
  • Powerful Software Development Kit
    • SDK includes many example applications, profiles and services
  • Low Cost PCB
    • Single or double sided
    • 50Ohm direct antenna connection
  • Optimized Peripherals
    • Direct serial interfaces
  • External SPI Flash or EEPROM
  • Up to 32 GPIOs
More Info Design-In Support Solution

Bluetooth Smart Modules

BT Smart Modules

Product Supplier Key Features
BC118
  • Features: iBeacon, Mesh or Custom functionality
  • Low power consumption
  • Up to 50m range
  • Transparent and command mode
  • Over the Air Secure firmware upgrade
  • UART, I2C, analog and GPIO interfaces
  • Certification: Bluetooth, FCC, CE and IC
  • Cable replacement: secure reliable data transfer
  • Can run as standalone or controlled by a host
  • Commands can be sent by App to control BC118
  • Transparent mode for I2C and UART
  • iBeacon or proximity for Android
  • Audio over BLE ready
Data Sheet More Info Design-In Support
BTM101 Flairmicro
  • Antenna included
  • External antenna option
  • Easy integration
    • Software support by Atlantik Elektronik
    • Use of development kits
  • High data rate (module to module) of 160kBit/s
  • CSR1010 based
    • +7.5dBm Tx power, -92.5dBm sensitivity
    • Support of BLE profiles ATT, GATT, SMP, L2CAP, GAP
  • QDL/EP – Qualified Design Listing
  • Interfaces
    • UART host interface
    • Debug SPI host interface
    • 10bits ADC
    • 12 digital PIOs
    • 3 analog AIOs
Design-In Support Solution

Bluetooth Smart Software and APPs

Product Supplier Key Features
Software and APPs Qualcomm
  • Atlantik Standard Software
  • Atlantik Lighting Software
  • Atlantik Customized Software
  • Atlantik Apps
  • CSR Mesh
Design-In Support More Info

Bluetooth Smart Ready

Bluetooth Audio ICs

BT Automotive ICs

Product Supplier Key Features
CSR8350 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • 80MIPS DSP
  • On-Chip SBC Encoder/ decoder
  • aptX decoder
  • Dual Mic CVC
  • A2DP decode
  • 2 ADCs
  • Dual I2S/ PCM interface
  • UART and USB
  • BGA
Design-In Support

BT ROM Stereo ICs

Product Supplier Key Features
CSR8635 Qualcomm
  • BT4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (Stereo Line-In)
  • iOS battery status monitor
  • Advanced multi-point (2xHFP, 2x A2DP)
  • 6th generation 1-mic CVC
  • Targeted for Mid-Tier 2-mic stereo headsets
Design-In Support
CSR8630 Qualcomm
  • BT4.0
  • A2DP1.2 and AVRCP1.4
  • Wired audio (Stereo Line-In)
  • Advanced multi-point (2x A2DP)
  • Targeted for entry stereo music speaker
Design-In Support
CSR8645 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired Audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • aptX Codec for high-quality audio
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
Design-In Support
CSR8640 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
  • Pin compatible with CSR8645
Design-In Support

BT Flash ICs

Product Supplier Key Features
CSR8675 Qualcomm
  • BT4.1
  • 16Mb eFlash and up to 64Mb external serial flash
  • 120 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 2 x I2S interface
  • 16 GPIOs
  • USB 3.3V regulator
  • BGA, pin compatible with CSR8670
Design-In Support
CSR8670 Qualcomm
  • BT 4.0
  • 16Mb eFlash and up to 64Mb external serial flash
  • 80 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 1 x I2S interface
  • 14 GPIOs
  • USB 3.3V regulator
  • BGA and WL-CSP
Design-In Support

BT ROM Mono ICs

Product Supplier Key Features
CSR8615 Qualcomm
  • BT4.0
  • 1-mic mono
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • Wired Audio (Stereo Line-in)
  • HD Voice
  • Advanced Multi-point (2xHFP, 2xA2DP)
  • iOS battery status monitor
  • 6th generation CVC
  • For Mid-Tier 1-mic mono headsets, mono speakers/ speakerphones
Design-In Support
CSR8605 Qualcomm
  • BT 4.0
  • Mono A2DP sink
  • A2DP1.2 and AVRCP1.0
  • Wired audio (Mono Line-in)
  • Best suited for entry-level mono Music speakers
Design-In Support

Bluetooth Audio Stacks

Product Supplier Key Features
Melody
  • Support for both Bluetooth 4.0 as well as multiple classic Bluetooth profiles.
    • Supported profiles: HFP, A2DP1.2, AVRCP1.4, PBAP, SPP1.0, IAP
  • Compatibility with 90% of Bluetooth modules
  • Can be controlled over the air via UART or GPIO interfaces
  • Connection to all mobile platforms: Android, iOS, Windows Mobile and Blackberry
  • Melody supports aptX, AAC, SBC and MP3
  • Small memory footprint: 8Mbits
  • Highly flexible and customizable to your demands
Design-In Support
wSync Flairmicro
  • Support of BT 4.0 & BT 2.1+EDR
  • Profiles: HFP (HF/AG), AVRCP, A2DP, DUN, OPP, SPP, MAP, PBAP, PAN
  • Phonebook download via AT commands or OPP
  • Full-duplex voice calls, built-in AEC and noise suppression functions
  • Runs on different hardware platforms with various CPU architectures such as ARM/MIPS
  • UART data transfer interface and simple schematics
  • Works best with Flairmicro HCI modules
Design-In Support

Bluetooth Connectivity ICs

BT Connectivity Automotive ICs

Product Supplier Key Features
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support

BT Connectivity Flash ICs

Product Supplier Key Features
CSRB5348 (BC8-Ext) Qualcomm
  • BT4.1
    • Dual-Mode Bluetooth and Bluetooth Smart
  • Low Power
    • Deep Sleep 80µA
  • On Chip Application
    • With external quad-SPI flash interface
    • xIDE based SDK
  • Extensive Array of Input/ Outputs
    • Fully configurable
    • Direct HID streaming to minimize latency
  • Low eBOM
  • Optional charging support
Design-In Support

BT Connectivity ROM ICs

Product Supplier Key Features
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support
CSR8510 Qualcomm
  • BT4.0 HCI ROM
  • USB
  • CSP
Design-In Support
CSR8811 Qualcomm
  • BT 4.0 HCI ROM
  • UART
  • CSP, QFN
Design-In Support

Bluetooth Connectivity Modules

BT Connect Core Modules

Product Supplier Key Features
Digi CC6 UL SoM Digi International  
  • Secure, connected, highly cost-effective system-on-module
    • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
    • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Stamp-sized and flexible Digi SMTplus form factor
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.2 option
  • Integrated dual 10/100 Ethernet connectivity
  • Dedicated on-module security + authentication controller
  • Unique ultra-low power and wake-up state management
  • Turnkey embedded Linux software platform with Digi
    TrustFence™ embedded device security framework
  • Long-term availability and 5-year warranty
Data Sheet Design-In Support
ConnectCard Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40 to 85°C operating temperature
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

BT Connectivity Modules

Product Supplier Key Features
BTM808 Flairmicro
  • Bluetooth 4.0 module
  • Based on AEC-Q100 CSR8311
  • HCI / High speed UART and USB interface
  • PCM/I2S digital audio interface
  • EEPROM
  • 20.0 x 14.4 x 2.3mm
BTM403 Flairmicro
  • Bluetooth v2.1+EDR, Class 1&2 module
  • HCI / UART interface
  • SPP Master & Slave support
  • Easy-to-use AT command interface
  • 35.3 × 14.0 × 2.5mm
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Bluetooth Connectivity Stacks

Product Supplier Key Features
MiniStack
  • Support of Dual Mode BT
  • Fully Bluetooth qualified –no further re-test required
  • Small footprint (as low as 26k flash and 3k RAM)
  • Ported on Atmel, STM32, Microchip and TI processors
  • Simple API with example source code application
  • Support of:
    • HID, HFP-AG, HFP-HF, A2DP, AVRCP, SPP
    • IAP/ IAP2 profiles
    • All BLE profiles
    • Multiple connections
  • Available in Windows7 and Linux evaluation form
More Info Design-In Support

Bluetooth/ Wi-Fi Combos

BT/ Wi-Fi Combo ICs

Product Supplier Key Features
BX Serie Sierra Wireless   • Wi-Fi 802.11 b/g/n at 2.4GHz, 1x1 SISO
• Dual-mode simultaneous Bluetooth Low Energy 4.2 and Classic Bluetooth with backwards compatibility
• Hostless module with regulatory certifications and integrated antenna (BX3105) for easy integration (BX3100 has connection for an external antenna)
• Embedded TCP/IP and Bluetooth Stacks with simple UART interface
• Supports multiple connections to external Codecs with UART, I2S, I2C, and SPI interfaces
• Secure boot and value-add firmware with FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep the connectivity optimized and secure
• Future-proof common flexible form factor (CF3®) enables the flexibility and scalability in designs, even across cellular technologies
Design-In Support Design-In Support Data Sheet
QCA9377 Qualcomm
  • 1x1 802.11ac + Bluetooth 4.2 in a single SoC
  • Supports Bluetooth 4.2 + HS, Bluetooth lowenergy and is backward compatible withBluetooth 1.x and 2.x
  • Single regulated 3.3V supply operation
  • Integrated RF Front End, single ended design
  • Offloading for minimal host utilization
  • Low-density parity check (LDPC)encoding/decoding
  • STBC, MU-MIMO, Transmit Beam-forming
  • 1.5KB OTP to eliminate an external flash
  • 256-QAM in 2.4GHz
  • Enhanced Coexistence Bluetooth and LTE;concurrent operation
  • PCB friendly: WLP to go on 4-L FR4non-HDI PCB
  • Provides a 48MHz reference clock
  • 1216KB RAM and 448KB ROM for Wi-Fi
  • 192KB RAM and 672KB ROM for Bluetooth
Design-In Support Data Sheet
WUBQ-159ACN(BT) SparkLAN
  • Qualcomm Atheros QCA9377-7
    ● Antenna: PCB Printed Antenna or 1xU.FL connector, 1
    ● Data Rates: allows link speeds up to 433Mbps
    ● Support Win7/8.1/10
Data Sheet Design-In Support
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

Wi-Fi/ BT Combo Modules

Product Supplier Key Features
WNFQ-255ACN(BT) SparkLAN
  • Standard: 802.11ac/b/g/n
  • Interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Chipset: Qualcomm Atheros QCA6174
  • Antenna: 2 x IPEX MHF4 connector, 2T2R
  • Concurrent Wi-Fi and BT co-existence
  • Data rate up to 867Mbps (MCS9)
  • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
  • Support Win7/Win8.1
Data Sheet Design-In Support

Bluetooth Audio Modules

BT Audio Modules

Product Supplier Key Features
BC127
  • Dual Mode: Bluetooth and Bluetooth Low Energy (BLE)
  • Backwards compatible with 1.1, 2.0, 2.1 + EDR and 3.0
  • Embedded Bluetooth Protocol Stack
  • Supports HFP, A2DP Sync, AVRCP, PBAP
  • Supports HFP-Ag and A2DP Source for Transmit
  • Supports IAP1/IAP2 profiles for connection to iOS devices
  • Supports aptX, (inc. Low latency), aac, sbs and mp3 codecs
  • Simple UART and GPIO interface for command and control
  • Connects to external Codecs with I2S, PCM and
  • Input and Ouput can be Digital
  • Small form factor (11.8mm x 18mm)
Design-In Support Data Sheet
BTM501 Flairmicro
  • Bluetooth v2.1+EDR, Class 2 module
  • Embedded Bluetooth Protocol Stack
  • Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc.
  • UART and USB programming and data IF
  • Microphone / speaker interface
  • Supports aptX
  • 23.24 mm x 11,94 mm x 2.00 mm
Design-In Support
BC127
  • BT4.0 Dual Mode
  • Embedded Bluetooth Protocol Stack
  • Supports HFP, A2DP Sync, AVRCP, PBAP, MAP, SPP
  • Supports HFP-AG and A2DP Source for Transmit
  • Supports IAP1/IAP2 profiles
  • Supports aptX
  • Simple UART and GPIO interfaces for command and control
  • Small form factor (11.8 mm x 18 mm)
Data Sheet Design-In Support
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Connect Core Modules

Product Supplier Key Features
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

Cellular

LTE/GSM/GPRS/UMTS/HSPA Modems

GSM/GPRS

Product Supplier Key Features
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band
M95 Quectel
  • 42-pin LCC
  • 19.9 x 23.6 x 2.65 mm
  • Quad-band
  • 3G migration
More Info Data Sheet Design-In Support
M66 Quectel
  • 44-pin LCC
  • 17.7 × 15.8 × 2.3 mm
  • Quad-band
More Info Data Sheet Design-In Support

UMTS/HSPA

Product Supplier Key Features
UG96 Quectel
  • Penta-band UMTS/HSPA
  • compatibility with Quectel UG95 & M95
  • 7.2Mbps DL / 5.76Mbps UL
  • 22.5 × 26.5 × 2.2mm
Data Sheet Design-In Support
UC20 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC20 Quectel
  • 112-pin LCC
  • 32.0 x 29.0 x 2.5 mm
  • 14.4M DL / 5.76M UL
  • -E/ -A / -G
  • UMTS / HSPA+
  • GPS/GNSS
  • M10 upgrade (ext.)
Data Sheet Design-In Support
UC15 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC15 Quectel
  • 108-pin LCC
  • 29.0 x 29.0 x 2.5 mm
  • 3.6M DL / 384K UL
  • -E/ -A
  • UMTS / HSDPA
  • M10 upgrade
More Info Data Sheet Design-In Support
UG95 Quectel
  • 102-pin LGC
  • 23.6 x 19.9 x 2.2 mm
  • 7.2M DL / 5.76M UL
  • -E/ -A
  • UMTS / HSPA
  • M95 upgrade
More Info Data Sheet Design-In Support

LTE/UMTS/HSPA

Product Supplier Key Features
EG06 Quectel
  • Compact-sized multi-band NB-IoT module
  • Ultra-low power consumption
  • Super high sensitivity
  • LCC package makes it easy for large volume manufacturing
  • Compatible with Quectel GSM/GPRS module, easy for future
    upgrading
  • Embedded with abundant Internet service protocols
  • Fast time-to-market: Reference designs, evaluation tools and timely technical support
    minimize design-in time and development efforts
Design-In Support Data Sheet

Router-, Gateway-Solutions

ConnectPort X family

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Industrial Router

Product Supplier Key Features
LR54 Digi International
  • Cat 6 LTE-Advanced speed (300Mbps)
  • Dual 2.4 and 5GHz radios, with 802.11ac
  • Global LTE network support: Offers software selectable 3G/4G LTE
  • Patented SureLink™ connection
  • PCI-certified Digi Remote Manager®, IPsec VPN firewall, and 256-bit AES encryption as well as the new Digi TrustFence™ Device Security Framework
  • Operate between -20°C to +70° C
  • Remote device management
Design-In Support Data Sheet
WR 44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing / IP30
WR 44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
WR 41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 11 family Digi International
  • 1 x Ethernet port
  • Cellular 2.5G/3G/4G
  • Dual SIM
  • Plastic housing
  • Digi Device Cloud ready
WR31 Digi International
  • 2 x Ethernet port
  • 1 x RS232/422/486 port
  • Din-Rail mounting
  • Hazardous (CLASS 1 DIV 2)
  • Aluminum Enclosure (IP30)
Data Sheet Design-In Support
WR44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
Data Sheet Design-In Support
WR44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing / IP30
Data Sheet Design-In Support
WR41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR11 family Digi International
  • 1 x Ethernet port
  • Cellular LTE/HSPA+ with 3G and 2G fallback
  • 2 SIM Slots
  • XT variant comes with metal housing
  • XT variant with screw-down SIM cover
  • Digi Remote Manager
  • Power Input 5VDC
Data Sheet Design-In Support

GSM/GPRS/UMTS/HSPA Modems

Product Supplier Key Features
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band

Clock & Timing

Clock Distributions - Buffers

Product Supplier Key Features
AK8181D AKM - Asahi Kasei Microdevices 3.3V LVPECL 1:4 Clock Fanout Buffer
  • Four differential 3.3V LVPECL outputs
  • Selectable differential PCLK0p/n or LVPECL clock inputs
  • Operating temperature range: -40℃ to +85℃
  • Package: 20-pin TSSOP (Pb free)
Data Sheet More Info Design-In Support
AK8180E AKM - Asahi Kasei Microdevices 2.5V, 3.3V LVCMOS 1:18 Clock Fanout Buffer
  • 18 LVCMOS outputs enable to drive up to 36 clock lines
  • LVCMOS/LVTTL input
  • Operating temperature range: -40℃ to +85℃
  • Package: 32-pin LQFP (Pb free)
  • Pin compatible with CY29942, MPC942C
Data Sheet More Info Design-In Support
AK8122 AKM - Asahi Kasei Microdevices Differential Zero Delay Clock Buffer
  • Phase Locked Loop (PLL)
  • Operational frequency range: 160MHz to 400MHz
  • Output delay: -30 ±100 ps
  • Operating temperature range: -40℃ to +85℃
  • Package: 8-pin MSOP (lead free)
Data Sheet More Info Design-In Support

ICs for crystal oscillator - XO, TCXO, VCXO

Product Supplier Key Features
AK2147 AKM - Asahi Kasei Microdevices XO (X'tal oscillator) IC
  • Exceptional high stability
  • Oscillator and output characteristics are adjustable using an internal EEPROM
Design-In Support
AK2175 AKM - Asahi Kasei Microdevices TCXO (Temperature compensated X'tal oscillator) IC
  • Exceptional high stability
Design-In Support
AK2160A AKM - Asahi Kasei Microdevices VCXO (Voltage controlled X'tal oscillator) IC
  • Oscillator and output characteristics are adjustable using an internal EEPROM
Design-In Support
AK2148/49 AKM - Asahi Kasei Microdevices
  • For small size / low noise / low power XO
Design-In Support

Low Jitter, programmable, multi Clock components

Product Supplier Key Features
AK8160 AKM - Asahi Kasei Microdevices Multi Clock Generator for PCI-Express
  • PLL with spread spectrum (SS) function
  • Output high quality differential 100MHz as PCI Express clock and 25MHz as reference simultaneous
  • Low current consumption: 31mA typical
  • Automotive qualified version (AK8160BV2) available
Data Sheet More Info Design-In Support
AK8140A AKM - Asahi Kasei Microdevices Programmable Multi Clock Generator
  • In-system programmability
  • Serial programmable register via I2C interface
  • High accuracy clock generator
  • Flexible Input clock source
  • Operating temperature range: -40℃ to +85℃
  • Package: 24-pin ETSSOP (lead free)
Data Sheet More Info Design-In Support
AK8116 AKM - Asahi Kasei Microdevices Single clock generator IC with an integrated PLL
  • Low jitter performance: 15ps (typical) period, 1 σ
  • Low current consumption: 3,8mA (typical)
  • Operating temperature range: -20℃ to +85℃
  • Package: 6-pin SON (lead-free)
Data Sheet More Info Design-In Support
AK8186B AKM - Asahi Kasei Microdevices Multi Output Clock Generator with Integrated 2.0GHz VCO
  • Low phase noise PLL : RMS jitter < 300 fs
  • On-chip VCO tunes from 1.75GHz to 2.25GHz
  • External VCO/VCXO to 500MHz optional
  • 1 differential or 2 single-ended inputs
Data Sheet More Info Design-In Support

Circuit Protection

Circuit Protection

Product Supplier Key Features
Fuses & PTC Resettable devices Bel Fuse
  • Brick Miniature Surface Mount Fuses
  • Chip SMT Fuses
  • Ultra Low Profile SMT PTC Resettable devices
  • PTC Resettable devices
  • PTC Radial Leaded Resettable devices
  • 250 / 277 Volt Radial Fuse
  • 600 Volt Radial Fuse
  • 5 x 15 mm Axial Leaded Fuses
  • 3 x 7 mm Axial Lead Micro Fuse
  • Glas or Ceramic Fuses
More Info Design-In Support

DAB, DAB+

DAB/ DAB+ (Digital Audio Broadcasting)

Frontend and Baseband ICs

Product Supplier Key Features
PNxxxx family PnP Network Technologies
  • DAB 1.0/1.5/2.0/2.5
  • DRM Back-End
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support
PNSxxxx family PnP Network Technologies
  • Supports: DAB, DAB+, T-DMB, FM-RDS, DRM & HD
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

WWR (World Wide Radio)

WWR

Product Supplier Key Features
PAIOS family PnP Network Technologies
  • Supports:
    • DAB/DAB+/DMB-A
    • DRM/DRM+
    • AM/FM
    • HD radio
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

DC-DC Power Converters

DC-DC Power Converters

Product Supplier Key Features
Non Isolated Converter Bel Fuse Largest selection of non-isolated DC-DC converters in the OEM Embedded Power industry:
  • Micro SIP series 12Vin/ 10A max. output
  • Power SIP series 12Vin/ 90A max. output
  • Voltage regulator module 150A max. output
  • Bobcat series (Surface &vertical) 30A max. output
  • Tunable loop series 50A max. output
  • Power block series 30A max. output
  • Custom designs
Design-In Support
Isolated Brick Converter Bel Fuse Broad line of single output isolated DC-DC Power Converters:
  • Full isolated brick converter 48 Vin/ 700W max. output
  • 1/2 isolated brick converter 48 Vin/ 600W max. output
  • 1/4 isolated brick converter 48 Vin/ 400W max. output
  • 1/8 isolated brick converter 48 Vin/ 144W max. output
  • 1/16 isolated brick converter 24 Vin or 48 Vin/ 60W max. output
  • Custom designs
Design-In Support

DRAM

DDR SDRAM

Product Supplier Key Features
W94 Family Winbond Electronics
  • 32Mb to 256Mb densities
  • Voltage: 2.4V to 2.7V or 2.5V±0.2V
  • Speed: DDR-500 / DDR-400 / DDR-333
  • Automotive and industrial certified
Design-In Support

DDR2 SDRAM

Product Supplier Key Features
W97 Family Winbond Electronics
  • 256Mb to 4GB densities
  • Voltage: 1.8V±0.1V
  • Speed: 1066 / 800 / 667Mbps
  • Automotive and industrial certified
Design-In Support

DDR3 SDRAM

Product Supplier Key Features
W6 Family Winbond Electronics
  • 512Mb to 4GB densities
  • Speed: 1866 / 1600 / 1333Mbps
  • Automotive and industrial certified
Design-In Support

SDRAM

Product Supplier Key Features
W98 Family Winbond Electronics
  • 16Mb to 256MB densities
  • Voltage: 3.3V±0.3V and 2.7V to 3.6V
  • Speed: 143 / 166 / 200MHz
  • Automotive and industrial certified
Design-In Support

DSPs

Hands free & ECNR

Product Supplier Key Features
AK7738VQ AKM - Asahi Kasei Microdevices
  • Two stereo ADCs, one monaural ADC, two stereo 32-bit DACs and four asynchronous stereo SRCs
  • Flexible serial interface is available with twelve input and twelve output channels
  • Can provide signals to a class-D amplifier and receive input data from external digital audio sources
  • Easy composition of a multichannel system with an external DAC
Data Sheet More Info Design-In Support
AK7755EN AKM - Asahi Kasei Microdevices
  • Includes a mono ADC, a stereo audio CODEC, a MIC pre-amplifier, a line-out amplifier and digital audio I/F
  • Programmable for user requirements such as high performance hands free function and acoustic effects
  • Available in a space saving small 36-pin QFN package
Data Sheet More Info Design-In Support
AK7736BVQ AKM - Asahi Kasei Microdevices
  • Integrated 2 channel SRC
  • Includes internal memories for digital audio processing
  • High accuracy IIR/FIR filter performance
  • Can operate with hands-free software by AKM or other sound processing software
Data Sheet More Info Design-In Support

Audio DSP & Hands free

Product Supplier Key Features
AK7601 AKM - Asahi Kasei Microdevices
  • Integrated audio CODEC (3 channel ADC, 6 channel DAC) and delay line memory
  • Analog inputs support quasi-differential/single-ended inputs with 4:1 stereo selector
  • Digital inputs supports 3:1 input selector with asynchronous Sample Rate Converter (SRC)
  • 6-channel DAC integrates full-range digital volume control and achieves 102dB with single end outputs
  • Adjustable delay memory control
    • Maximum delay time:
      • Lch 18ms, Rch 18ms (for 1 stereo input / 3 stereo outputs)
  • Delay resolution: 1/fs
  • Operating temperature: -40°C to 85°C
Data Sheet More Info Design-In Support
AK7738VQ AKM - Asahi Kasei Microdevices
  • Two stereo ADCs, one monaural ADC, two stereo 32-bit DACs and four asynchronous stereo SRCs
  • Flexible serial interface is available with twelve input and twelve output channels
  • Can provide signals to a class-D amplifier and receive input data from external digital audio sources
  • Easy composition of a multichannel system with an external DAC
Data Sheet More Info Design-In Support

Sound Enhancement - Audio MAXX

Product Supplier Key Features
NPCP215x Nuvoton Technology
  • Improves audio quality for low-performance speakers
  • System-level BOM savings
  • Stereo or Stereo + Sub-woofer operation
  • I2C controlled
  • 24-bit accuracy
  • MaxxAudio® algorithms
  • Audio input: up to four I2S or Synchronous Serial Interface (SSI) inputs
  • Audio output:
    • Up to three I2S or SSI outputs
    • Class-D Power output up to 2 x 20W
    • 2.1 way power output up to 2 x 10W + 20W (internal generation of sub-woofer)
  • 100dB SNR
  • Typical power efficiency of 90%
  • Various protection sensors
  • Several General-Purpose digital signals available to the application (GPIOs)
  • Logic supply of 3.3V and Power supply up to 26.4V
  • 7 x 7 mm, 48-pin Quad Flat No-Lead (QFN) package
Data Sheet Design-In Support

Speech Recognition

Product Supplier Key Features
ISD9160 Nuvoton Technology
  • Audio SOC chip corder & recognition
  • REC/Playback
    • 60sec at 16kbps
  • Embedded flash
  • Class D
  • ISP (in system programming) Cortex-M0 up to 50MHz
  • Compression ADPCM, PCM
  • Voice sensor:
    • Speaker independent 90% accuracy
    • Personal defined commands 97% accuracy
Data Sheet Design-In Support

Ethernet & Wi-Fi Communication

Embedded Serial to Ethernet/Wi-Fi Modules

Rabbit MiniCore Modules

Product Supplier Key Features
MiniCore RCM5600W Series Digi International
  • Rabbit® 5000 running at 74 MHz
  • 802.11b/g wireless modules and pin-compatible with MiniCore 10/100 Ethernet
  • High Security: SSL and AES.
  • 1 MB of internal RAM for program storage
  • Up to 4 MB of serial Flash for datalogging or web page storage
  • Up to 32 GPIO lines and 6 serial ports
  • Dynamic C, an ANSI C compatible development environment
  • Certified to meet FCC and other international regulatory requirements
RabbitCore RCM6600W Digi International
  • Rabbit 6000 running up to 180 MHz
  • Integrated 802.11b/g and 10/100 Ethernet - up to 4Mflash, 1MB SRAM
  • 4 A/D inputs 12-bit resolution
  • Clock speed up to 180 MHz
  • Up to 35 GPIO line and 6 serial ports, PWM, RTC
  • Lightweight web server for monitoring and control & ZigBee and GPS/3G cellular connectivity support
Data Sheet Design-In Support
MiniCore RCM6700 Series Digi International
  • Rabbit® 6000 running at up to 200MHz
  • 10/100 Ethernet and pin-compatible with MiniCore 802.11b/g wireless modules
  • 1MB of internal RAM for program storage
  • Up to 4MB of serial flash for data logging or web page storage
  • Provides up to 6 serial ports, configurable I/O and control features such as PWM
  • Flexible interface module, FIM which extends peripheral connectivity like CANbus, 1-Wire and SD/SDIO
  • Dynamic C, is an ANSI C compatible development environment
Data Sheet Design-In Support

xPico Modules

Product Supplier Key Features
XPico 200 Lantronix
  • 802.11a/b/g/n WLAN, entweder mit integrierter Antenne, oder mit zwei U.FL-Anschlüssen
  • Ein 10/100 Mbps Ethernet MAC (RMII)
  • USB 2.0 high Speed Schnittstelle  (Host- oder Devicemodus)
  • Eine TTL-UART-Schnittstelle mit RTS / CTS
  • Eine Master / Slave-SDIO-Schnittstelle
  • Eine SPI-Schnittstelle (nur Master-Modus, 24 MHz)
  • Bis zu 10 konfigurierbare GPIO-Pins
  • 3,3-V-Stromanschluss und Logik-IO
  • Interner Reset-Schaltkreis
  • Integrierte wake up / shutdown Logik  für Sleep / Standby 
Design-In Support Data Sheet
Lantronix xPico Lantronix
  • Based on the DSTni-EX enhanced 16-bit x86 architecture
  • 10/100 Mb ethernet (external magnetics & RJ45)
  • 2 Serial RS232, up to 920kbps
  • 8 GPIO (modem signals)
  • Extended temperature range: -40°C to +85°C
  • 256-bit AES encryption
  • SNMP, Telnet, Serial, Internal Web Server, and Microsoft Windows based utilitys for configuration
  • Input voltage: 3.3 VDC
  • Size: 24 mm (L) x 16.5 mm (W) x 5.64 mm (H)
  • Weight: 2.5 g
  • 5-Year limited warranty
Data Sheet Design-In Support
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support

Xport Modules

Product Supplier Key Features
Lantronix xPort & xPort Pro Lantronix
  • DSTni-EX chip at 26MHz, 48MHz and 88MHz
  • 10/100MB Ethernet (external magnetics & RJ45)
  • Serial RS232, up to 920kbps
  • 3 GPIO (modem signals, flow control)
  • Extended temperature range: -40°C to +85°C
  • 256-bit AES encryption
  • ModBus ASCII/TCP or RTU/TCP
  • Up to 16MB RAM, 16MB flash
  • Plug & Play or EVOS (xPort Pro), Linux development kit
  • SSH & SSL encryption for serial tunnel
  • SNMP V2c, MIB II support
Design-In Support Data Sheet

Digi Connect Modules

Product Supplier Key Features
Digi ConnectCore 6 SOM Digi International  
  • Scalable Cortex-A9 multi-core performance
  • Independent Cortex-M0+/Cortex-M4 Microcontroller
  • Assist™ subsystem
  • Cost-effective, reliable, low-profile surface-mount module form factor
  • Pre-certified 802.11a/b/g/n and Bluetooth 4.0
  • Smart Power Management Architecture with PMIC
  • Android, Yocto Project Linux and Windows Embedded
  • Compact software platform support
  • Reliable design with IEC 60068 and HALT verification
  • Designed for long-term availability
Data Sheet Design-In Support
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support

WI-Port Modules

Product Supplier Key Features
Wi-Port Lantronix
  • Lantronix DSTni-EX 186 CPU
  • 802.11b/g
  • Host Interface UART (921kbps)
  • Full TCP/IP stack, web server and Windows deployment software
  • 1 x U.FL connector
  • Lantronix SmartRoam technology provides seamless mobile connectivity and improved reliability
  • Temperature Range -40°C to +70°C
  • Ethernet-WLAN Bridging possible
  • Bulletproof wireless security with IEEE 802.11i-PSK, WPA-PSK, TKIP
Data Sheet Design-In Support

PremierWave Modules

Product Supplier Key Features
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Embedded Serial to Wi-Fi Modules

Product Supplier Key Features
MiniCore RCM5600W Series Digi International
  • Rabbit® 5000 running at 74 MHz
  • 802.11b/g wireless modules and pin-compatible with MiniCore 10/100 Ethernet
  • High Security: SSL and AES.
  • 1 MB of internal RAM for program storage
  • Up to 4 MB of serial Flash for datalogging or web page storage
  • Up to 32 GPIO lines and 6 serial ports
  • Dynamic C, an ANSI C compatible development environment
  • Certified to meet FCC and other international regulatory requirements
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Ethernet Mag Jack, Jacks & Plugs, Magnetics

Ethernet Jacks, Plugs & Cable Assemblies

Product Supplier Key Features
Ethernet Jacks, Plugs & Cable Assemblies Bel Fuse
  • Single port right angle modular jacks
  • Single port Vertical / 45° modular jacks
  • ARJ45 jack & plugs
  • MRJ21 cable assemblies
  • RJ point five cable assemblies and connectors
  • Harmonica jacks
  • Stacked jacks
  • Large Dia CAT6a plugs
  • Fiber optic cable assy
More Info Design-In Support

Ethernet MagJacks

Product Supplier Key Features
MagJacks Bel Fuse
  • Single, multi-port & USB Combo RJ-45 connectors
  • 10/100BT, 1GBT, 10GBT, PoE & PoE Plus
  • W & w/o LEDs and bi-color
  • Vertical mount packaging
  • Low profile & micro height versions
  • IR reflow compatible, 230°C @ 90 sec
  • Surge protection for GR1089 intra-building & ESD
  • Extended temperature range: -40°C to +85°C
Data Sheet Design-In Support

LAN Magnetics

Product Supplier Key Features
LAN Magnetics Bel Fuse
  • 10/100BT, 1GBT, 10GBT
  • PoE & PoE plus
  • Single, dual & quad port (as standard)
  • Extended temperature range -40°C to +85°C
  • Turn ratio: 1:1 Tx/Rx & alternatives
  • Standard & low profile package
  • Through Hole & SMT variants
Design-In Support

SFP Transceiver

Product Supplier Key Features
SFP Transceiver Bel Fuse
  • Designed with Broadcom’s BCM54616S chipset
  • Complies with IEEE 802.3, 802.3u & 802.3ab
  • 10/100/1000Base-T, 1000Base-X to 1000Base-T
  • 10/100/1000Base-T SyncE
  • SGMII compliant and/or GBIC compliant
  • Extended temperature range -40°C to +85°C
More Info Design-In Support

Router-, Gateway-Solutions

Industrial Routers

Product Supplier Key Features
WR31 Digi International
  • 2 x Ethernet port
  • 1 x RS232/422/486 port
  • Din-Rail mounting
  • Hazardous (CLASS 1 DIV 2)
  • Aluminum Enclosure (IP30)
Data Sheet Design-In Support
WR44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
Data Sheet Design-In Support
WR44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing / IP30
Data Sheet Design-In Support
WR41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR11 family Digi International
  • 1 x Ethernet port
  • Cellular LTE/HSPA+ with 3G and 2G fallback
  • 2 SIM Slots
  • XT variant comes with metal housing
  • XT variant with screw-down SIM cover
  • Digi Remote Manager
  • Power Input 5VDC
Data Sheet Design-In Support

ConnectPort X Family

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Router-, Hub-, Gateway-Solutions

Product Supplier Key Features
LR54 Digi International
  • Cat 6 LTE-Advanced speed (300Mbps)
  • Dual 2.4 and 5GHz radios, with 802.11ac
  • Global LTE network support: Offers software selectable 3G/4G LTE
  • Patented SureLink™ connection
  • PCI-certified Digi Remote Manager®, IPsec VPN firewall, and 256-bit AES encryption as well as the new Digi TrustFence™ Device Security Framework
  • Operate between -20°C to +70° C
  • Remote device management
Design-In Support Data Sheet

Fingerprint Sensor & Modules

Embedded Fingerprint Module

Product Supplier Key Features
Fingerprint Embedded Module (GTM Series) Holtek Semiconductor
  • Single chip fingerprint recognition module
  • Complete integrated algorithms for learn, login and erase functions
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin optical sensor
  • 1:1 verification and 1:N identification
  • Downloadable sensor fingerprint image
  • Fingerprint templates can be read / written to module
  • UART communication protocol for interfacing to external master MCU
  • Easy fingerprint recognition product integration
Data Sheet Design-In Support

Fingerprint Sensor

Product Supplier Key Features
Fingerprint Sensor Module (GT Series) Holtek Semiconductor
  • Single chip fingerprint recognition sensors
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin profile
  • Internal I2C interface for parameter setting
  • High C/P Ratio
  • CCIR601 Interface
  • Special surface design can accommodate dry fingers
  • Static electricity resistant durable design
  • Resists 2D non-genuine fingerprints for higher safety coefficients
Data Sheet Design-In Support

USB Fingerprint Module

Product Supplier Key Features
Fingerprint USB Module (GTU Series) Holtek Semiconductor
  • High dpi and low image distortion
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin optical sensor
  • Static electricity resistant durable design
  • Downloadable sensor fingerprint image
  • Easy fingerprint recognition product integration
  • USB 2.0 Full Speed Interface for convenient interfacing to external MCU or PC
  • Volume production with high quality based on NB CAM manufacturing procedure
  • Provides Software Development Kit and Application Programming Interface
Data Sheet Design-In Support

GPS, Glonass, Galileo & Beidou

GNSS Modules

RADIONOVA Antenna Modules

Product Supplier Key Features
M10578-A3 Antenova
  • Mediatek MT3333
  • 13.8 x 9.5 x 1.8 mm
  • GNSS module
  • Bandwith: 50MHz
  • External antenna support
  • Host interface: UART
  • CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet
M10578-A2 Antenova
  • Mediatek MT3337-E
  • 13.8 x 9.5 x 1.8 mm
  • GPS module
  • Bandwith: 30MHz
  • External antenna support
  • Host interface: UART, CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet

Lxx series (MTK based)

Product Supplier Key Features
L70(-R) Quectel
  • L70(-R)
  • MT3329
  • 10 x 10 mm
  • GPS module
Data Sheet Design-In Support
L80 Quectel
  • L80
  • MT3329
  • 16 x 16 mm
  • GPS antenna module
Data Sheet Design-In Support
L76 Quectel
  • MT3333
  • 10 x 10 mm
  • GNSS module
Data Sheet More Info Design-In Support

SiRFstarV Multi-GNSS platform

SiRFstarV e, ea

Product Supplier Key Features
SiRFstarV 5ea Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130 dBm)
  • Hot start
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10 Hz propagated
  • SiRFdrive support
Design-In Support
SiRFstarV 5e Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130dBm)
  • Hot start
  • Sensitivity
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10Hz propagated
Design-In Support

I/O Controller, Hardware Monitor, Security ICs

Hardware Monitors

Product Supplier Key Features
NCT7XXX Series Nuvoton Technology
  • Provides accurate voltage and temperature monitoring via Nuvoton’s SMART FAN™ IV fan control algorithms and advanced system protection mechanisms
  • Internal 10-bit ADC converts monitored temperature with ±1℃ accuracy.
  • Can monitor up to 5 temperature channels and 20 analog voltage inputs simultaneously.
  • Fan monitoring and conrol functions make possible an easy implementation of quiet cooling solutions with maximum safety and flexibility
  • System interface: SMBus
  • Operating voltage: 3.3V
Data Sheet Design-In Support

Super I/O, eSIO, GPIO expander

Product Supplier Key Features
NCT66/67, NCT51/55, W83627 Nuvoton Technology
  • Up to 6 UARTs
  • LQFP48/64/128
  • Port 80
  • LPC interface, (eSPI interface)
  • Parallel Port, Hardware Monitor
  • Operating temperature range: -40℃ to 85℃
Design-In Support

Trusted Platform Module

Product Supplier Key Features
NPCTXXX Series Nuvoton Technology
  • Single-chip TPM solution (TSSOP28 & QFN32)
  • Various host interfaces (LPC, SPI (3,3 V & 1,8 V) & I2C/ TIS, CRB and NV-MMIO)
  • At least 16K/24K bytes NV storage (TPM1.2/2.0) (Extended life time (32Mio writes))
  • Five secured GPIOs (dedicated physical presence pin)
  • EK certification support
  • Field upgrade support
  • TCG compliance (TPM 1.2 & future TPM 2.0)
  • FIPS 140-2/3
  • Common criteria (CC) EAL4+
  • Security and Attack countermeasures
Design-In Support

GPIO Expander

Product Supplier Key Features
W83L60XXX Series, NCT5955Y, NCT5605Y Nuvoton Technology
  • This series allows the easy addition of multiple GPIO capabillities over standard SMBus interface
  • These devices include strappable address setting, input interrupts, LED, BEEP functions
  • Supply voltage: 2,3V to 5.5V
  • Up to 16 GPIOs
  • Interface: SMBus/I²C
Design-In Support

Level Shift Ics

Product Supplier Key Features
NCT59XXX Series Nuvoton Technology
  • GTL to TTL series:
    • Bi-directional level shifting between buses operation at TTL and GTL voltage levels
    • Operation voltage: 0.5V to 6.0V
    • Inputs: 4/ Outputs: 4
    • Operating temperature range: -40℃ to +85℃
    • TSSOP14 package
  • I²C series:
    • Provides the ability to interface a variety of devices with different operating voltages on the same I²C
    • High ESD protection and speeds are supported
    • SMBus Repeater, SMBus up to 1MHz
    • Operation voltage: 0.8V to 5.5V / 2.2V to 5.5V
    • Inputs: 1/ outputs: 1
    • Operating temperature range: -40℃ to +85℃
    • MSOP8 package
Design-In Support

Interconnect & Magnetics

Ethernet Jacks, Plugs & Cable Assemblies

Powerline Solution

Product Supplier Key Features
Powerline Solutions Bel Fuse
  • Based on Qualcomm Atheros AR6400/AR1400 chipsets
  • Supports HomePlug AV standard (200Mbps)
  • MII (Host & PHY) interface
  • Supports 1024/256/64/16/8-QAM, QPSK, BPSK & ROBO modulation
  • 128-bit AES link encryption
  • Supports IGMP managed multicast sessions
  • Vertical or horizontal mounting
  • Green standard compliant
  • Extended temperature range: -40°C to +85°C
Design-In Support

Ethernet MagJacks

Product Supplier Key Features
MagJacks Bel Fuse
  • Single, multi-port & USB Combo RJ-45 connectors
  • 10/100BT, 1GBT, 10GBT, PoE & PoE Plus
  • W & w/o LEDs and bi-color
  • Vertical mount packaging
  • Low profile & micro height versions
  • IR reflow compatible, 230°C @ 90 sec
  • Surge protection for GR1089 intra-building & ESD
  • Extended temperature range: -40°C to +85°C
Data Sheet Design-In Support

LAN Magnetics

Product Supplier Key Features
LAN Magnetics Bel Fuse
  • 10/100BT, 1GBT, 10GBT
  • PoE & PoE plus
  • Single, dual & quad port (as standard)
  • Extended temperature range -40°C to +85°C
  • Turn ratio: 1:1 Tx/Rx & alternatives
  • Standard & low profile package
  • Through Hole & SMT variants
Design-In Support

SFP Transceiver

Product Supplier Key Features
SFP Transceiver Bel Fuse
  • Designed with Broadcom’s BCM54616S chipset
  • Complies with IEEE 802.3, 802.3u & 802.3ab
  • 10/100/1000Base-T, 1000Base-X to 1000Base-T
  • 10/100/1000Base-T SyncE
  • SGMII compliant and/or GBIC compliant
  • Extended temperature range -40°C to +85°C
More Info Design-In Support

Magnetic Sensors

Current Sensors

Product Supplier Key Features
CQ-3 Series AKM - Asahi Kasei Microdevices
  • Current Sensor in SMD package
  • High isolation voltage: 3.0kV (50/60Hz, 60sec)
  • Compliant to safety standards of IEC/UL-60950 and UL-508
  • Ultra-fast response time: 0.5 μsec (typ.)
  • Low variation and low temperature drift of sensitivity and zero-current output voltage
  • No output hysteresis
  • Low noise output: 0.7 to 2.7 mVrms (depending on variant)
  • Bi-directional type
  • 5V single power supply
  • Ratiometric output
  • Halogen free
Design-In Support

Hall Effect Ics

Product Supplier Key Features
EZ Series AKM - Asahi Kasei Microdevices
  • InAs Hybrid
  • Latch & Unipolar versions available
  • Many variants
  • Suitable for automotive applications
Design-In Support
EW Series AKM - Asahi Kasei Microdevices
  • InSb Hybrid
  • Latch & Uni-/Omnipolar versions available
  • Many variants
Design-In Support
AK/EM Series AKM - Asahi Kasei Microdevices
  • Si Monolithic
  • Latch & Uni-/Omnipolar versions available
  • Many variants
  • Suitable for automotive applications
Design-In Support

Hall Elements

Product Supplier Key Features
HW / HS series AKM - Asahi Kasei Microdevices
  • InSb (Ultra Sensitivity?
  • Ultra-high sensitivity
  • Best suited to motor drivers, lift position detection, meters (gas, power, water)
HG/HZ series AKM - Asahi Kasei Microdevices
  • GaAs (Low Drift)
  • Excellent thermal characteristic
  • Linear output
  • Best suited to current sensors
Design-In Support
HQ series AKM - Asahi Kasei Microdevices
  • InAs (high sensitivity)
  • High sensitivity and low current consumption are achieved simultaneously
  • Excellent thermal characteristic
  • Suitable for battery-powered mobile equipment
Design-In Support
HW/HS series AKM - Asahi Kasei Microdevices
  • InSb (ultra sensitivity)
  • Ultra-high sensitivity
  • Best suited for motor drivers, lift position detection, meters (gas, power, water)
Design-In Support

Linear Hall Effect IC

Product Supplier Key Features
EQ-0321 AKM - Asahi Kasei Microdevices Programmable linear hall IC
  • Algorithm canceling hall sensor / magnet thermal characteristic
  • Enable to adjust output gain / neutral voltage via serial interface
  • Power down function (Stand-by current consumption Typ: 1nA)
  • Low current consumption
  • VDD: 2.7V to 5.5V
  • Small package: 10pinSON (2.9mm × 3.2mm × 0.6mm)
  • Operating temperature range: -30°C to +85°C
Design-In Support
EQ73x Series AKM - Asahi Kasei Microdevices
  • 3pin plastic package
  • 3,3V to 5,5V power supply
  • Fixed magnetic sensitivity (Gain) per device SIP
  • Analog output
  • Ultra quick response 1 μs
Design-In Support
EQ43x Series AKM - Asahi Kasei Microdevices
  • 3pin surface mount plastic package
  • 3,3V to 5,5V power supply
  • Fixed magnetic sensitivity (Gain) per device
  • Analog output
  • Quick response 3-4 μs
Design-In Support

Rotary Position Sensors Hall IC

Product Supplier Key Features
EM3242 AKM - Asahi Kasei Microdevices 10-bit angle sensor
  • Rotation angle sensor device with hall element inside
  • Contact-less angle sensor function can be realized by small magnet and EM-3242
  • Extremely small temperature drift
  • Small package
  • 3V single power supply
Data Sheet More Info Design-In Support
AK7405 AKM - Asahi Kasei Microdevices High speed 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: PWM / serial interface (3 line type)
  • 12-bit angle resolution
  • Less than ±0.95deg angle accuracy at 25°C
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, memory lock etc. via serial interface
More Info Design-In Support
AK7401 AKM - Asahi Kasei Microdevices 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: SPI (absolute angle), ABZ phase output (1024ppr incremental interface)
  • 12-bit angle resolution
  • Less than ±1.00deg angle accuracy at 25°C
  • Maximum tracking rate: 333rps (20,000rpm)
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, ABZ resolution/hysteresis etc. via serial interface
Data Sheet More Info Design-In Support
AK8776 AKM - Asahi Kasei Microdevices Onechip Encoder
  • 1.6V to 5.5V operation
  • Bop,Brp (vertical, horizontal) ±1.5mT(typical)
  • Low power operation : Average 90uA (typical)@VDD=3V
  • Two outputs: F(pulse count), D(direction of rotation)
  • Small package: SOP-4pin, halogen free
Data Sheet More Info Design-In Support
AK8775 AKM - Asahi Kasei Microdevices Onechip Encoder
  • 1.6V to 5.5V operation
  • Bop, Brp (vertical, horizontal) ±1.5mT (typical)
  • Low power operation : Average 90uA (typical)@VDD=3V
  • Two outputs: OUTA (detects vertical magnetic field), OUTB (detects horizontal magnetic field)
  • Small package: SOP-4pin, halogen free
Data Sheet More Info Design-In Support

Semiconductor Magnetoresistive Elements

Product Supplier Key Features
MS-P0XX Series (DIP Package) AKM - Asahi Kasei Microdevices
  • Pitch: m=0,4, m=0,8, with magnet holder
  • Features:
    • High resolution, low distortion on output V
    • Small distribution of magnetic character
    • Flat temperature dependency
    • Offset voltage
    • Output amplitude
Design-In Support
MS-00XX Series (SON Package) AKM - Asahi Kasei Microdevices
  • Pitch: m=0,2, m=0,4, m=0,8
  • Features:
    • High resolution, low distortion on output V
    • Small distribution of magnetic character
    • Flat temperature dependency
    • Offset voltage
    • Output amplitude
Design-In Support

Magnetic Sensors for Automotive

Current sensor Hall IC

Product Supplier Key Features
EG230L AKM - Asahi Kasei Microdevices Programmable linear hall IC
  • Analog ratiometric output
  • Wide ambient temperature range: Ta= -40°C to 125°C
  • Customer programmable sensitivity and offset
  • Quick response for magnetic field change (Typ. 2 μsec)
  • Single power supply voltage (from 4.75V to 5.25V )
  • SIP 3pin with the package thickness 1.2mm
  • Chip select function at EEPROM programming
  • EEPROM Programming through a modulation of the power supply voltage
More Info Design-In Support

Linear and angular position Hall IC

Product Supplier Key Features
AK7405 AKM - Asahi Kasei Microdevices High speed 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: PWM / serial interface (3 line type)
  • 12-bit angle resolution
  • Less than ±0.95deg angle accuracy at 25°C
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, memory lock etc. via serial interface
More Info Design-In Support
AK7401 AKM - Asahi Kasei Microdevices 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: SPI (absolute angle), ABZ phase output (1024ppr incremental interface)
  • 12-bit angle resolution
  • Less than ±1.00deg angle accuracy at 25°C
  • Maximum tracking rate: 333rps (20,000rpm)
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, ABZ resolution/hysteresis etc. via serial interface
Data Sheet More Info Design-In Support

One Chip Encoder Hall IC

Product Supplier Key Features
AK877XB Series AKM - Asahi Kasei Microdevices Pitch Free Single Chip Encoder IC
  • TS16949 and AEC-Q100 conformance
  • Single chip solution no more two hall effect latches needed
  • Pitch free : Works with any dimension and pole pitch of magnetic ring
  • Sensitivity (vertical, horizontal): ±1.7mT (typical)
  • Small package: SOP-6pin
  • Halogen free
Data Sheet More Info Design-In Support

Wheel speed sensors Hall IC

Product Supplier Key Features
AK7430 AKM - Asahi Kasei Microdevices
  • For indirect tire pressure monitoring system (iTPMS)
  • Differential hall IC
  • High sensitivity and low output jitter characteristics
  • Interface is the 2-wire current output type
Design-In Support

MAPX - High Integrated Audio Processor

MAPX - High Integrated Audio Processor

Product Supplier Key Features
Map-X series 8 Qualcomm
  • 3 DSP cores each running up to 432MHz delivering 1300 MIPS of processing power
  • Integrated RAM (up to 72Mbit)
  • Integrated 10/100 Mbps Ethernet MAC - IEE 802.3
  • Integrated USB 2.0 Host controller (MAC & PHY)
  • Integrated headphone amplifier
  • Up to 6 high quality 105dB (108dB) SNR ADCs
  • Up to 8 high quality 110dB SNR DACs
  • Multiple digital interfaces (inputs/outputs)
  • Wide range of software support
More Info Design-In Support

Medical Sensors

Noncontact Sensors, Hybrids and IC

Product Supplier Key Features
PS25401 Plessey Semiconductors EPIC PCB hybrid sensor, optimized for movement
  • Ultra high effective input resistance, typically 20GΩ
  • Effective input capacitance as low as 15pF
  • Upper 3dB point typically 10kHz
  • Operates with bipolar power supply from ±2.4V to ±4.0V
  • Sensors supplied in a custom package with exposed pins for surface mount assembly
Data Sheet Design-In Support
PS25251 Plessey Semiconductors EPIC PCB hybrid sensor, optimized for contact ECG
  • Ultra high input resistance, typically 20GΩ
  • Dry contact capacitive coupling
  • Input capacitance as low as 15pF
  • Lower 3dB point typically 200mHz
  • Upper 3dB point typically 10kHz
  • Operates with bipolar power supply from ±2.4V to ±5.5V
  • Sensors supplied in a custom package with exposed pins for surface mount assembly
Data Sheet Design-In Support
PS25201 Plessey Semiconductors EPIC PCB hybrid sensor, optimised for contact ECG
  • Ultra high input resistance, typically 20GΩ
  • Dry contact capacitive coupling
  • Input capacitance as low as 10 pF
  • Upper 3dB point typically 10kHz
  • Lower 3dB point typically 100mHz
  • Operates with single +4.75V to 8.0V supply
  • Sensors supplied as custom engineered probe assemblies complete with connecting lead and DIN plug termination
Data Sheet Design-In Support

OLED

OLED

Product Supplier Key Features
Passive Matrix OLED Truly Semiconductors
  • PMOLED
  • 0,67“ to 2.7“
  • Chip on glass
  • Monochrome
Design-In Support

Other Sensors

Electronic Compass

Product Supplier Key Features
AK09912 AKM - Asahi Kasei Microdevices 3-axis magnetometer on a silicon chip
  • Wide dynamic measurement range and high resolution with lower current consumption
    • Output data resolution: 16-bit (0.15 μT/LSB)
    • Measurement range: ± 4900μT
    • Average current at 100Hz repetition rate: 1mA (typ.)
  • Digital serial interface
    • I2C bus interface to control AK09912 functions and to read out the measured data by external CPU
    • A dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V
    • 4-wire SPI is also supported. A dedicated power supply for SPI can work in low-voltage apply as low as 1.65V
  • Device is worked by on-chip oscillator so no external clock source is necessary
  • Self test function with internal magnetic source to confirm magnetic sensor operation on end products
  • Built-in Noise Suppression Filter (NSF) keeps magnetic sensor output stable
  • Built-in temperature sensor to monitor the temperature while operation
Data Sheet More Info Design-In Support
AK09911 AKM - Asahi Kasei Microdevices

High sensitive 3-axis electronic compass IC

  • Wide dynamic measurement range and high resolution with lower current consumption.
    • Output data resolution: 14-bit (0.6 μT/LSB)
    • Measurement range: ± 4900 μT
    • Average current at 100Hz repetition rate: 2.4mA (typical)
  • Digital serial interface
    • I2C bus interface to control AK09911 functions and to read out the measured data by external CPU.
    • A dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V.
  • DRDY pin and register inform to system that measurement is end and set of data in registers are ready to be read.
  • Device is worked by on-chip oscillator so no external clock source is necessary.
  • Self test function with internal magnetic source to confirm magnetic sensor operation on end products.
Data Sheet More Info Design-In Support

IR Sensor & IC

Product Supplier Key Features
IR1011 AKM - Asahi Kasei Microdevices
  • Smallest mid-infrared quantum photo diode, made of InSb
  • Very small / thin package (2.65mm×1.9mm×0.4mm)
  • High sensitivities
  • Very fast response
  • No bias current required
Data Sheet More Info Design-In Support

Passive LCD

Passive LCD

Product Supplier Key Features
Standard & Custom Displays JIYA Electronics
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD modules: COB, SMT, COG, COF, TAB and HS
  • Customer specific designs possible
Design-In Support
Custom & Standard Displays Truly Semiconductors
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD-modules: COB, SMT, COG, COF, TAB and HS
  • Customer specific designs possible
Design-In Support
Standard & Custom Display HT Display
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD-modules: COB, SMT, COG, COF, TAB und HS
  • Customer specific designs possible
Design-In Support

Power Line Communication

RF-ICs

Mixer, PLL Synthesizer, VGA

Mixer, PLL, Synthesizer, VGA up to 8GHz

Product Supplier Key Features
AK1548 AKM - Asahi Kasei Microdevices
  • Operating frequency: 3GHz to 8GHz
  • Charge pump current: TBD typical, 8steps -The current range can be controlled by an external resistor
  • Fast lock mode: The programmable timer can switch two charge pump current setting
  • Supply voltage: 2.7V to 3.3V (PVDD, AVDD pins)
  • Charge pump power supply: Separately controlled, PVDD to 5.5V (CPVDD pin)
  • Phase noise: -226dBc/Hz
  • Current consumption: 15mA typical + Charge pump current
  • On-chip PLL Lock Detection: Selectable Phase Frequency Detector (PFD) Output or digital filtered - Lock detect
  • Package: 20pin QFN (0.5mm pitch, 4mm x 4mm x 0.75mm)
  • Operating temperature range: -40°C to 85 °C
Data Sheet More Info Design-In Support
AK1575 AKM - Asahi Kasei Microdevices General:
  • RF output frequency Range 690 MHz to 4,0 GHz
  • IF input frequency Range 20 MHz to 500 MHz
  • LO frequency Range 262,5 MHz to 4,4 GHz
  • Supply Voltage : 4,75 to 5,25 V (Mixer) 2,7 to 3,6 V / 4,75 to 5,25 V (Synthesizer /VCO)
  • Current Consumption: 150 mA (typ.)
  • Package: 32pin QFN (0,5 mm pitch, 5 mm x 5 mm x 0,85 mm)
  • Operating Temperature : -40°C ~ 85°C
Synthesizer/VCO:
  • Normalized Phase Noise -218 dBc/Hz
  • Phase Noise -111 dBc/Hz @100 kHz fo=2,1 GHz Mixer (frf=2 GHz)
  • Conversion Gain -1,5 dB typ.
  • Input 3rd orders intercept point +24 dBm typ.
  • Noise Figure 13 dB typ.
Data Sheet Design-In Support
AK1572 AKM - Asahi Kasei Microdevices General:
  • RF input frequency range 690MHz to 4.0GHz
  • IF output frequency range 20MHz to 500MHz
  • LO frequency range 262.5MHz to 4.4GHz
  • Supply voltage : 4.75V to 5.25 V (Mixer) 2.7V to 3.6 V / 4.75V to 5.25V (Synthesizer/VCO)
  • Current consumption: 150mA typical
  • Package: 32pin QFN (0.5 mm pitch, 5 mm x 5 mm x 0.85 mm)
  • Operating temperature range : -40°C to 85°C
Synthesizer/VCO:
  • Normalized phase noise -218 dBc/Hz
  • Phase noise -111 dBc/Hz @100 kHz fo=2.1 GHz Mixer (frf=2GHz)
  • Conversion gain -1.5dB typical
  • Input 3rd orders intercept point +23dBm typical
  • Noise figure 14dB typical
Data Sheet Design-In Support
AK1228 AKM - Asahi Kasei Microdevices
  • Input frequency: 10MHz to 2000MHz
  • Output frequency: 10MHz to 1000MHz
  • Operating supply current: 4.5mA to 10.5mA
  • Analog circuit characteristics: current consumption:10.5mA, IIP3:+12dBm, Gain:4dBm, NF: 8.5dB
  • LO input level: -10 to +5dBm
  • Operating supply voltage: 2.7V to 5.25V
  • Package: 16pin UQFN (0.5 mm pitch, 3 mm x 3 mm x 0.6 mm)
  • Operating temperature range: -40°C to 85°C
Data Sheet More Info Design-In Support

Remote Keyless entry

TPMS and Keyless Entry IC´s up to 435MHz

Product Supplier Key Features
AK3712 AKM - Asahi Kasei Microdevices
  • Maximum output power : +11dBm (typical)
  • Adjustable output power: from +7.5dBm to +11dBm (0.5dB step)
  • Output power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current : 16 mA (typical) (Maximum output power is set)
  • Low static current : 10nA (3V, RT)
  • Fast start-up time : 1.0 ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0V to 3.3 V
  • Small package: 10pin MSOP (3.1 mm × 3.1 mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3711 AKM - Asahi Kasei Microdevices
  • Maximum output power: +5dBm
  • Adjustable output power: from -2 to +5dBm (1dBstep)
  • Transmisson power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current: 10mA /9mA (300MHz/400MHz band) (3V, RT, maximum output power is set) Low static current : 10nA (3V, RT)
  • Fast start-up time : 1,0ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0 to 3.6V
  • Small package: 10pin MSOP (3.1mm × 3.1mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3701 AKM - Asahi Kasei Microdevices
  • Advanced direct conversion architecture (low power structure)
  • Excellent receiver sensitivity:
    • 118 dBm (BER=10-3, FSK, Deviation=+/-15 kHz, data rate=2.8 kbps) ,
    • 117 dBm (BER=10-3, ASK, data rate=2.8 kbps)
  • Self polling mode
  • Low current consumption: 9 mA (5 V, RT)
  • High ability to reject interference signal operating hopping channel and digital filter
  • Fast start-up time from power down mode
  • Supply voltage: 4.5 V ~ 5.5 V
  • Package: 28pin TSSOP (9.8 mm×4.5 mm×0.95 mm)
  • Compliant to AEC-Q100
More Info Design-In Support

Two way radio

IF Receiver for two radio

Product Supplier Key Features
AK2365A AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5 V
  • Wide operating temperature: Ta = -40°C to 85 °C
  • High sensitivity: -102 dBm at 12 dB SINAD
  • Built-in PGA and 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2MHz)
  • Built-in programmable AGC+BPF circuits corresponding to E to J type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 6mA
  • Compact plastic packaging: 32-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info
AK2364 AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5V
  • Wide operating temperature: Ta = -40°C to 85°C
  • Hi sensitivity: -104 dBm at 12 dB SINAD
  • Built-in 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2 MHz)
  • Built-in programmable AGC+BPF circuits corresponding to D to G type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 7mA
  • Compact plastic packaging, 28-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info

Single Board Computer (SBC)

Single Board Computer (SBC)

Product Supplier Key Features
Digi ConnectCore 6 SBC Digi International
  • Compact off-the-shelf SBC family
  • Scalable capabilities and i.MX6Quad/Dual/DualLite performance
  • Gigabit Ethernet and pre-certified dual-band Wi-Fi +
    Bluetooth 4.0
  • Ready for cellular connectivity and Digi XBee RF
  • Complete set of available peripherals and
  • interfaces with customization options
  • Designed for flexibility and reliability
  • Windows Embedded Compact, Linux and Android software platform support
  • Industrial operating temperature available
Data Sheet Design-In Support
Connect Core 6 SBC Digi International
  • Freescale i.MX6, up to 64 GB eMMC, 2 GB DDR3
  • Up to four Cortex-A9 cores up to 1.2 GHz (2.5 MIPS/MHz)
  • 802.11a/b/g/n + Bluetooth 4.0
  • Dual-diversity design, up to 150 Mbps data rate (MCS 7)
  • Development Board for Digi Connect Core 6 + production-ready SBC design
  • Designed for mass production
  • Standard Pico-ITX (100 mm x 72 mm) SBC / motherboard form factor
  • Standard interface availability
  • HDMI, Gigabit Ethernet, dual USB 2.0 Host, USB OTG, CAN header, dual-camera), multi-display LVDS/MIPI/parallel/HDMI), Micro SD card slot, PCI Express Mini Card slot, Micro SIM card slot, XBee socket,…..
ConnectCore 6 SBC Digi International
  • Compact, cost-effective off-the-shelf solution built
    on the ConnectCore 6 module - NXP i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express
  • Mini Card & Micro SIM, Video, Camera, XBEE Socket
  • Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
Data Sheet Design-In Support

Snapdragon based SBC

Product Supplier Key Features
Inforce SBC 6640 Inforce Computing ◾Snapdragon™ 820, Quad-core Kryo™ ARMv8 ISA CPU 64-bit @2.2GHz/1.6GHz
◾Adreno™ 530 GPU, Hexagon™ 680 DSP, and dual integrated ISPs
◾4K Ultra video with HEVC H.265 playback and capture
◾4GB LPDDR4 and 64GB UFS
◾Wi-Fi 802.11ac, BT 4.2 LE, and GPS connectivity
◾Dual MIPI-CSI, Dual MIPI-DSI, USB 3.0, USB 2.0, HDMI, PCIe, SDC, 12x BLSPs, 8x GPIO, and expansion header
◾Fastest time to market
◾Product-ready & tested
◾Seamless industry / RF certification
◾Simple cost-reductions through Built-to-Order
◾Production-ready single board computer platform that requires little to no hardware development
◾Standard software – Android and Linux
Data Sheet Design-In Support
Inforce SBC 6410PLUS Inforce Computing ◾Snapdragon™ 600, Quad-core Krait 300 CPU @1.7GHz
◾Adreno™ 320 GPU, Hexagon™ DSP, and integrated ISP
◾FullHD H.264 playback and capture @1080p
◾2GB LPDDR2 and 4GB eMMC (Upgradable to 32GB eMMC), MicroSD
◾Wi-Fi/BT/GbE/GPS connectivity
◾Dual MIPI-CSI, Dual MIPI-DSI, Micro HDMI, 2x USB2.0 (host), 1x USB2.0 (OTG), GigE, and expansion header
◾Fastest time to market
◾Product-ready & tested
◾Seamless industry / Rf certification
◾Simple cost-reductions through Built to Order
◾Production-ready single board computer platform that requires little to no hardware development
◾Standard software – Android and Linux
◾10 years supply guarantee
Data Sheet Design-In Support
Inforce SBC 6309 Inforce Computing ◾Snapdragon™ 410, Quad-core ARM® Cortex® A53 64-bit @1.2GHz
◾Adreno™ 306 GPU, Hexagon™ DSP, and Integrated ISP
◾H.264 playback and capture @1080p, H.265 playback @720p, HD Audio 5.1
◾1GB LPDDR3, 8GB eMMC, MicroSD
◾Wi-Fi 802.11 b/g/n, BT 4.1 LE, GPS
◾Dual MIPI-CSI, Dual LVDS, HDMI, 2x USB2.0 (Host), 1x USB2.0 (Debug), GigE, and expansion header
◾Extended temperature: -30ºC to +85ºC
◾Fastest time to market
◾Product-ready & tested
◾Seamless industry / RF certification
◾Simple cost-reductions through Built to Order
◾Production-ready single board computer platform that requires little to no hardware development
◾Standard Software – Android and Linux
◾10 years supply guarantee
Data Sheet Design-In Support

TFT

Automotive

Product Supplier Key Features
Automotive TFT Truly Semiconductors
  • Size: 3,5" to 12.1"
  • Displays specifically designed for automotive applications
  • Multiple touch technologies available
  • Long-term availability guaranteed
  • Supply-chain certified by standard: ISO/TS 16949
Design-In Support

Industry

Product Supplier Key Features
Digital Signage Alpha Display
  • 32“to 98“ Signage Display up to UHD
  • Custom frame by request
  • HDBT long distance wirded connectivity up to 100m
  • PCAP, IR Touch Screen Available
  • Multi Vision Video Wall with daisy chain function
Design-In Support
Industry TFT Alpha Display
  • Size: 6" bis 65"
  • Casings: open frame chassis, panel mount, rack mount,...
  • On request: water & dust proof (IP65)
  • Wide viewing angle
  • Multiple touch technologies available
  • Long-term availability guaranteed
Design-In Support
Industry TFT Data Image
  • Size: 3,5" bis 21.5"
  • Casings: Open Frame Chassis, Panel Mount, Rack Mount,...
  • On Request: water & dust proof (IP65)
  • Wide Viewing Angle
  • Projected capacitive touch technologies available
  • Long-term availability guaranteed
Design-In Support

Wi-Fi

Intelligent Wi-Fi Modules (incl. Microcontoller)

Digi Connect Core Modules

Product Supplier Key Features
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454 MHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Running Linux or Android
  • Up To 256MB Flash and RAM
  • Single/dual 10/100 Mbit/s Ethernet
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature range
Data Sheet Design-In Support

Digi Connect Modules

Product Supplier Key Features
Digi ConnectCore 6 SBC Digi International
  • Compact off-the-shelf SBC family
  • Scalable capabilities and i.MX6Quad/Dual/DualLite performance
  • Gigabit Ethernet and pre-certified dual-band Wi-Fi +
    Bluetooth 4.0
  • Ready for cellular connectivity and Digi XBee RF
  • Complete set of available peripherals and
  • interfaces with customization options
  • Designed for flexibility and reliability
  • Windows Embedded Compact, Linux and Android software platform support
  • Industrial operating temperature available
Data Sheet Design-In Support
Digi Connect Wi-ME 9210~~~ Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75 MHz
  • 802.11 b/g/n (2.4 GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8 MB Flash and 16 MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Temperature Range: Industrial: -40 °C ~ +85 °C
XBee Wi-Fi ~~~Modules Digi International
  • 802.11 b/g/n (2.4 GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host Interface: UART/SPI
  • Different Antenna Options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications with
  • Temperature Range: Industrial: -40 °C ~ +85 °C
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
XBee Wi-Fi Modules Digi International
  • 802.11 b/g/n (2.4GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host interface: UART/SPI
  • Different antenna options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications
  • Operating temperature range: Industrial: -40 °C ~ +85 °C
Data Sheet Design-In Support

PremierWave Modules

Product Supplier Key Features
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Wi-Port Modules

Product Supplier Key Features
Wi-Port Lantronix
  • Lantronix DSTni-EX 186 CPU
  • 802.11b/g
  • Host Interface UART (921kbps)
  • Full TCP/IP stack, web server and Windows deployment software
  • 1 x U.FL connector
  • Lantronix SmartRoam technology provides seamless mobile connectivity and improved reliability
  • Temperature Range -40°C to +70°C
  • Ethernet-WLAN Bridging possible
  • Bulletproof wireless security with IEEE 802.11i-PSK, WPA-PSK, TKIP
Data Sheet Design-In Support

xPico Wi-Fi Modules

Product Supplier Key Features
XPico 200 Lantronix
  • 802.11a/b/g/n WLAN, entweder mit integrierter Antenne, oder mit zwei U.FL-Anschlüssen
  • Ein 10/100 Mbps Ethernet MAC (RMII)
  • USB 2.0 high Speed Schnittstelle  (Host- oder Devicemodus)
  • Eine TTL-UART-Schnittstelle mit RTS / CTS
  • Eine Master / Slave-SDIO-Schnittstelle
  • Eine SPI-Schnittstelle (nur Master-Modus, 24 MHz)
  • Bis zu 10 konfigurierbare GPIO-Pins
  • 3,3-V-Stromanschluss und Logik-IO
  • Interner Reset-Schaltkreis
  • Integrierte wake up / shutdown Logik  für Sleep / Standby 
Design-In Support Data Sheet

XPico Modules

Product Supplier Key Features
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support

Wi-Fi Frontend Modules

Wi-Fi - PCIe Frontend Modules

Product Supplier Key Features
WPEQ-256ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm Atheros QCA9892-BR4B
  • Antenna: 2 x U.FL connectors, 2T2R
  • Data rate up to 867Mbps
  • Industrial-Grade Temperature: -40 ~ 85°C
  • Support Linux
Data Sheet Design-In Support
WPEQ-353ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm QCA9890-BR4B
    • Antenna: 3 x U.FL connectors, 3T3R
    • Data rate up to 1.3Gbps
    • Industrial-Grade Temperature: -40 ~ 85°C
    • Support Linux
Data Sheet Design-In Support
WPEA-251N(BT) SparkLAN
  • 802.11a/b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR9462
  • 2T2R
Data Sheet Design-In Support
WPEA-152GN(BT) SparkLAN
  • 802.11b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR3012 + AR9485
  • 1T1R
Data Sheet Design-In Support
WPEA-121N SparkLAN
  • 802.11a/b/g/n
  • Half Mini Card
  • Qualcomm Atheros AR9382
  • 2T2R
Data Sheet Design-In Support
WPEA-252NI SparkLAN
  • 802.11a/b/g/n
  • Mini Card
  • Qualcomm Atheros AR9592-AR1B
  • 2T2R
  • Industrial temperature range: -40°C to 85°C
Data Sheet Design-In Support
WPEA-351AC SparkLAN
  • 802.11ac/a/n
  • Mini Card
  • Qualcomm Atheros QCA9880
  • 3T3R
Data Sheet Design-In Support
WPET-232ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Realtek RTL8812AE
  • 2T2R
Data Sheet Design-In Support
WPEA-352ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Qualcomm Atheros QCA9880-BR4A
  • 3T3R
Data Sheet Design-In Support

Wi-Fi - USB Frontend Modules

Product Supplier Key Features
WUBR-508N Module Series / Dongle SparkLAN
  • 802.11a/b/g/n USB Module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-Pin, or 4-Pin Wafer connector)
  • Dongle version available
WUBR-508N SparkLAN
  • 802.11a/b/g/n USB module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-pin, or 4-pin wafer connector)
  • Dongle version available
Data Sheet Design-In Support
WUBA-171GN SparkLAN
  • 802.11b/g/n High-Power USB module
  • Atheros AR9271
  • 1T1R (5-pin pin-header)
  • Industrial temperature range: -30°C to 75°C
Data Sheet Design-In Support
WUBM-273ACN SparkLAN
  • 802.11ac/b/g/n USB module
  • MediaTek MT7612U
  • 2T2R
Data Sheet Design-In Support

Wi-Fi Gateways and Routers

ZigBee to Wi-Fi Gateways

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support

Wi-Fi ICs

Wi-Fi IoT Modules

Product Supplier Key Features
WSDQ-103GNI SparkLAN 802.11b/g/n Industrial-Grade IOT Module, Qualcomm Atheros QCA4010 , 1T1R
  • Standard: 802.11b/g/n
  • Host interface: UART, SPI/SDIO, I2C/I2S, USB, ADC
  • Chipset: Qualcomm Atheros QCA4010
  • Antenna: PCB Printed ANT, 1T1R
Data Sheet Design-In Support
SX-ULPGN Silex Technology
  • IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)
  • Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 Radio
  • Single Stream System (1x1), 20 MHz
  • Integrated RF front end and PCB trace antenna
  • Hostless IoT application development platform with large internal memory
  • UART AT command set for optional external MCU host
  • AllJoyn support
  • Wi-Fi Protected Setup Support
  • IPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host Controller
  • Ideal for cost effective Internet of Things (IoT) Applications
Design-In Support Data Sheet

Wi-Fi ICs

Product Supplier Key Features
QCA4531 Qualcomm
  • 650 MHz MIPS 24Kc CPU
  • Externer Speicherunterstützung für bis zu
    64 MB/128 MB DDR2 RAM
  • 128 MB SPI NOR Flash
  • 1 GB SPI NAND Flash
  • 2x2 11n Wi-Fi 2.4GHz Tx/Rx Antennenempfang
  • Große Auswahl an Peripheriegeräten SPI, GPIO, UART,
    Ethernet USB 2.0 Host, PCIe RC
  • Open Source Software QSDK, OpenWRT
  • Unterstützt AllJoyn®, HomeKit®, Weave
Data Sheet Design-In Support
QCA4012 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet
QCA4010 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet

Wi-Fi/ Bluetooth Combos Solution

Wi-Fi / BT Combo ICs

Product Supplier Key Features
QCA402x Qualcomm
  • QCA4020 tri-mode SoC integrates Bluetooth 5 low energy, dual-band Wi-Fi, and 802.15.4 technologies
  • QCA4024 dual-mode SoC integrates Bluetooth 5 low energy and 802.15.4
    Isolated low power processors for connectivity
  • 15.4 SW MAC, 15.4 and BLE drivers, coex management
  • Wi-Fi operations (QCA4020 only)
  • Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and wireless protocol security
  • Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
  • Integrated sensor hub for post-processing designed to enable low power sensor use cases
  • Small package size allows for optimized form factors
Design-In Support Data Sheet
WNFQ-255ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • Host interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Qualcomm Atheros QCA6174
    • Antenna: 2 x IPEX MHF4 connector, 2T2R
    • Concurrent Wi-Fi and BT co-existence
    • Data rate up to 867Mbps (MCS9)
    • Support Win7/Win8.1
Data Sheet Design-In Support
WNFQ-158ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • M.2 (PCIe: WLAN; USB2.0: Bluetooth)
  • Qualcomm Atheros QCA9377
    • Antenna: 2 x IPEX MHF4 connector, 1T1R with RX diversity
    • Concurrent Wi-Fi and BT co-existence
    • 802.11ac 2.0 with MU-MIMO
    • Data rate up to 433Mbps
    • Support Windows
Data Sheet Design-In Support
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

Wi-Fi IoT Module

Product Supplier Key Features
XPico 200 Lantronix
  • 802.11a/b/g/n WLAN, entweder mit integrierter Antenne, oder mit zwei U.FL-Anschlüssen
  • Ein 10/100 Mbps Ethernet MAC (RMII)
  • USB 2.0 high Speed Schnittstelle  (Host- oder Devicemodus)
  • Eine TTL-UART-Schnittstelle mit RTS / CTS
  • Eine Master / Slave-SDIO-Schnittstelle
  • Eine SPI-Schnittstelle (nur Master-Modus, 24 MHz)
  • Bis zu 10 konfigurierbare GPIO-Pins
  • 3,3-V-Stromanschluss und Logik-IO
  • Interner Reset-Schaltkreis
  • Integrierte wake up / shutdown Logik  für Sleep / Standby 
Design-In Support Data Sheet

ZigBee

ZigBee Embedded Modules

XBee ZigBee Modules

Product Supplier Key Features
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support