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802.15.4, 868MHz, Mesh technologies

Analog Front end for Current Measurement

RS485 Transceiver, I/O Controller, Hardware Monitor, Security Ics

NAND Flash

PATA/SATA

Flash Modules

Product Family/Product Supplier Key Features Additional Information
PREMIER Series - SATA DOM Flexxon
  • Capacity: 2-128GB
  • Operating Temp: -40 ~ 85°C
  • Max. Performance:
    • Read: 530MB/s
    • Write: 200MB/s
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling
    • Bad Block Management
    • TRIM
    • SMART
    • Over-Provision
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning

USB Flash Modules

USB 2.0 Flash Modules

Product Family/Product Supplier Key Features Additional Information
FLEXXON USB Flash Module (UFM) Flexxon
  • Operating Temp.: -40 ~ 85°C
  • Capacity: up to 64GB
  • Max. Performance: Read: 30MB/s, Write: 25MB/s
  • Low power consumption
  • High speed USB2.0 compliant
  • Advanced Flash Management:
  • ECC, Static and Dynamic Wear Leveling,
  • Bad Block Management
  • Durable solid-state storage

8-Bit Microcontroller

8-Bit 8051 Flash

Product Family/Product Supplier Key Features Additional Information
Holtek Standard 8051 Holtek Semiconductor
  • Internal clock 3.68MHz
  • 64K programming memory
  • All common interfaces SPI/I2C/UART/ADC, temperature sensor, I/Os,
  • 4 x 16-bit timer
Design-In Support
Nuvoton 8051 series Nuvoton Technology
  • Pin-compatible with traditional 12T 8051
  • 4T/6T/12T 8051 processor
  • Max frequency of 40MHz
  • Up to 128kB of flash memory, 2kB SRAM
  • Operating at 2.4V to 5.5V
  • Operating temperature: -40℃ to 85℃
  • Connectivity: UART, SPI, I²C
  • ADC with up to 8 channels, 10-bit resolution, up to 96kSPS
  • Provides 22.1184MHz internal oscillator (1% accuracy at 25℃, 5V)
  • Data flash configurable and high immunity (8KV ESD, 4KV EFT)
Design-In Support

8-Bit Flash

Product Family/Product Supplier Key Features Additional Information
Holtek Flash Holtek Semiconductor Cost-Effective Flash MCUs with EEPROM
  • Proprietary architecture to further decrease costs
  • Internal clock up to 16MHz
  • Fully integrated internal oscillator requires no external components
  • Up to 64K flash
  • Up to 0.5us instruction cycle with 8MHz system clock
Design-In Support

8-Bit OTP

Product Family/Product Supplier Key Features Additional Information
Holtek OTP Holtek Semiconductor Cost-Effective MCUs with EEPROM
  • Proprietary architecture to further decrease costs
  • Internal clock up to 12MHz
  • Fully integrated internal oscillator requires no external components
  • Up to 64K flash
  • Up to 0.5us instruction cycle with 8MHz system clock
Design-In Support

8-Bit SoC Poly Phase

Product Family/Product Supplier Key Features Additional Information
V9003/V9103 Upgraded Poly-Phase SoC Platform
  • High Accuracy
    • Watt·h: <0.1%, 2000:1 DR
    • VAR·h: <0.2%, 2000:1 DR
  • Metering Engine: VMA
  • 8 independent oversampling ?/? ADCs
  • Up to 64KB Flash
  • Fast transient pulse stress: 5kV, 5kHz

with load error <0.1%

  • Up to 3 UART interfaces and 5 timers
  • integrated RTC and temperature sensor, digital crystal frequency

compensation for calibration and temperature variation

  • Supports IEC 62053-21:2003, IEC 62053-22:2003 and IEC 62053-

23:2003

8-Bit SoC Single Phase

Product Family/Product Supplier Key Features Additional Information
V9801S/V9811S Upgraded Single-Phase SoC Platform
  • High Accuracy
    • Watt·h: <0.1%, 5000:1 DR
    • VAR·h: <0.1%, 3000:1 DR
  • Metering Engine: VMA
  • 4 independent oversampling ?/? ADCs
  • Up to 128 KB Flash
  • Fast transient pulse stress: 5kV, 5kHz, with load error <0.1%
  • Programmable power:

Freq. Div. mode/RMS/Const.meter/Pulse width adjustable

  • 5mA@13MHz
  • 3mA@3.2MHz
  • 500?A@ I detection mode
  • 8?A@sleep mode
  • Metering accuracy exceeding

32-Bit ARM Cortex Mx Microcontroller

ARM Cortex M0 MCUs

Product Family/Product Supplier Key Features Additional Information
ARM Cortex M0 MCUs
  • Max frequency of 72 MHz
  • Up to 128KB of flash memory, 20KB SRAM
  • Operating at 1.8 ~ 3.6V; 2.5V ~ 5.5V
  • Operating Temperature -40? ~ 105?
  • Connectivity: CAN, LIN, USB, ISO-7816-3, LCD, UART, SPI, I²C
  • ADC, up to 16 channels, 12-bit resolution
ARM Cortex-M0 MCUs Nuvoton Technology
  • Max. frequency of 72MHz
  • Up to 128kB of flash memory, 20kB SRAM
  • Operating at 1.8V to 3.6V; 2.5V to 5.5V
  • Operating temperature range: -40℃ to +105℃
  • Connectivity: CAN, LIN, USB, ISO-7816-3, LCD, UART, SPI, I²C
  • ADC with up to 16 channels, 12-bit resolution
Design-In Support

ARM Cortex M3 MCUs

Product Family/Product Supplier Key Features Additional Information
HT32 Holtek Semiconductor General Purpose MCUs
  • Cost-Effective MCU
  • Up to 256K Flash
  • Up to 32K SRAM
  • System clock up to 72MHz
  • CRC: CCITT CRC-16 and Ethernet CRC-32
  • I2S (Inter-IC Sound)
  • Master or Slave mode
  • Mono or stereo
  • 8 / 16 / 24 / 32-bit sample size
  • 8 x 32-bit Tx & Rx FIFO with PDMA supported
  • EBI (External Bus Interface)
  • High Speed Bus, up to 36MB/s
  • With programmable timing and interfaces
  • Supports a wide range of devices such as SRAM / NOR Flash / LCD
Design-In Support Data Sheet

ARM Cortex M4 MCUs

Product Family/Product Supplier Key Features Additional Information
ARM Cortex M4 MCUs
  • Max frequency of 100 MHz
  • Up to 2MB of flash memory, 128KB SRAM
  • Operating at 2.5V ~ 5.5V
  • Operating Temperature -40? ~ 105?
  • Connectivity: Ethernet, SD-Host, CAN, LIN, USB OTG, USB Device, ISO-7816-3, UART, SPI, I²C
  • ADC, up to 16 channels, 12-bit resolution
ARM Cortex-M4 MCUs Nuvoton Technology
  • Max. frequency of 100MHz
  • Up to 2MB of flash memory, 128kB SRAM
  • Operating at 2.5V to 5.5V
  • Operating temperature range: -40℃ to +105℃
  • Connectivity: Ethernet, SD-Host, CAN, LIN, USB OTG, USB Device, ISO-7816-3, UART, SPI, I²C
  • ADC with up to 16 channels, 12-bit resolution
Design-In Support

ARM Cortex M0+ MCUs

Product Family/Product Supplier Key Features Additional Information
ARM Cortex-M0+ MCUs Holtek Semiconductor
  • Power
    • Lowest active 150μA/MHz
    • Idle 2μA
  • Performance
    • 2 - 10x higher than 8/16-Bit MCU
  • Flash
    • Full range from 16KB to 128KB Flash
  • Device
    • Up to 8 products, 20 devices pin-to-pin compatible
  • Ecosystem
    • Rich development resources, tools ans solutions
Design-In Support More Info Data Sheet

32-Bit ARM Microprocessor - System on Chip (SoC)

CSRatlas SoCs

Product Family/Product Supplier Key Features Additional Information
SiRFatlasV Qualcomm
  • High-performance GPS and Galileo location engine
  • Integrated power management unit
  • 500MHz or 664MHz high-speed ARM11 CPU with vector floating point unit
  • DDR2, Mobile DDR, SD/MMC/MMC+ and NAND flash memory controllers
  • Audio DAC; LCD touch panel controller and video post processing accelerator
  • Supports QVGA H.264 mobile digital TV content and VGA MPEG4 video playback
  • Advanced memory controller supports 166MHz clock Mobile-DDR and 200MHz clock DDR2
  • Embedded hardware for colour space conversion, deinterlace and scaler
Data Sheet Design-In Support

Digi ARM9 Microprocessor Solutions

Product Family/Product Supplier Key Features Additional Information
NS9215 Digi International
  • 32-bit system-on-chip with ARM926EJ-S core
  • Integrated 10/100 Mbit Ethernet MAC
  • On-chip high-performance encryption engine
  • Power management and rich set of interfaces
  • Industrial operating temperature
  • Speed Grades: 75/150MHz
  • 4 KB I-cache / 4 KB D-cache
  • Process: 0.18μ CMOS
  • Up to 108 GPIOs
  • 265-pin BGA
  • 15 x 15 mm
  • 12-bit ADC
Data Sheet Design-In Support
NS9210 Digi International
  • 32-bit system-on-chip with ARM926EJ-S core
  • Integrated 10/100 Mbit Ethernet MAC
  • On-chip high-performance encryption engine
  • Power management and rich set of interfaces
  • Drop-in replacement option for NS7520 designs
  • Speed grades: 75/150MHz
  • 4 KB I-cache / 4 KB D-cache
  • Process: 0.18μ CMOS
  • Up to 54 GPIOs
  • 177-pin BGA
  • 13 x 13 mm
Data Sheet Design-In Support

32-Bit ARM System on Modules (SoM)

Digi Connect Core Modules

Product Family/Product Supplier Key Features Additional Information
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454 MHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Running Linux or Android
  • Up To 256MB Flash and RAM
  • Single/dual 10/100 Mbit/s Ethernet
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature range
Data Sheet Design-In Support

Digi Connect Modules

Product Family/Product Supplier Key Features Additional Information
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support

PremierWave Modules

Product Family/Product Supplier Key Features Additional Information
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

802.15.4, 868MHz, Mesh technologies, ZigBee

BT Mesh

Product Family/Product Supplier Key Features Additional Information
CSR Mesh Qualcomm
  • Simple direct control & config from a Smartphone to a device from anywhere in the network
  • No access hubs, routers or other devices
  • No single point of failure
  • Proven BT Smart Technology
    • Co-exists well with WiFi
    • Neither interfere with each other
  • Secure and robust
  • Protected against eavesdroppers and man-in-middle attacks
  • Three carrier channels
  • Extends the reach of BT Smart beyond 1 radio link
  • Flood mesh algorithm
  • CSR Mesh will extend beyond lighting
  • Home/ building/ industrial automation, proximity, asset tracking coming in future releases
Design-In Support

XBee 802.15.4 Modules

Product Family/Product Supplier Key Features Additional Information
XBee 802.15.4 Digi International
  • 4 different antenna options (wire, PCB, U.fl, RPSMA)
  • 2,4GHz for worldwide employment
  • 900MHz for longe range deployment
  • Low power sleep mode
  • Industrial temperature range (-40°C to +85°C)
Data Sheet Design-In Support
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

XBee 868 Low Power / Long Range

Product Family/Product Supplier Key Features Additional Information
Xbee-Pro 868
  • 863 to 870 MHz
  • Indoor Range up to 500 ft. w/2.1 dBi antenna/ up to 250 ft. w/PCB embedded antenna
  • Line-of-sight Range up to 2.5 miles w/2.1 dBi antenna/ up to 0.6 miles w/PCB embedded antenna

13 I/O

  • 4 channels 10-bit analog inputs
  • Temperature range -40°C to +85°C
  • Digi Mesh, Repeater, Point-to-Point, Point-to-Multipoint, Peer-to-peer
  • Programmable (32kB Flash/2kB RAM)
  • ETSI 1.8.1 conform (CE)

XBee Digi Mesh Modules

Product Family/Product Supplier Key Features Additional Information
XBee Digi Mesh Digi International
  • 2,4GHz for worldwide employment
  • Multiple antenna options
  • Simple deployment and growth
  • Outdoor line-of-sight range up to 1 mile
  • Digi Mesh peer-to-peer mesh networking protocol
  • Self-healing and discovery for network stability
  • Sleeping router supported for longer battery life
  • No configuration needed for out-of-box RF communications
  • Ready to be used with ConnectPort X gateways
Data Sheet Design-In Support

Home Plug Green Phy to Zigbee bridge

Product Family/Product Supplier Key Features Additional Information
GV 7011-MOD Greenvity Communications
  • Module based on GV 7011 chip
  • Key features: see above
Data Sheet Design-In Support
GV 7011 Greenvity Communications
  • The World’s First Single Chip with IEEE 802.15.4 wireless and HomePlug Green PHY PLC
    • HPGP is a compatible standard to HomePlug AV
    • On PLC achieving long distances in heavy concrete houses
    • True single chip solution for PLC to 802.15.4 radio
  • Optimized for Light controlling
    • No extra cables or additional RF needed
  • Applications
    • App controlled Light/Home automation (turn-key solution)
    • Metering In House Display (IHD)
    • Internet of Green Things
Data Sheet Design-In Support

ZigBee Embedded Modules

Product Family/Product Supplier Key Features Additional Information
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Family/Product Supplier Key Features Additional Information
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Antenna solutions

Antennas for Cellular and LTE

Product Family/Product Supplier Key Features Additional Information
flexiiANT Antenova

• 824-960MHz / 1710-2170MHz
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 680 - 2700 Mhz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• GSM850 / 900 / 1800 / 1900/ WCDMA
• M2M and IoT requirements

Design-In Support Data Sheet

Antennas for Bluetooth, Wi-Fi, ZigBee

Product Family/Product Supplier Key Features Additional Information
flexiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• Swivel/SMD mounting
• M2M and IoT requirements

Design-In Support Data Sheet
ceriiANT Antenova

• 2.4-2.5 GHz
• Extremely compact antennas
• Highly efficient
• SMD mounting

Design-In Support Data Sheet

Antennas for ISM (Industrial, Scientific, Medical)

Product Family/Product Supplier Key Features Additional Information
flexiiANT Antenova

• 868-928 MHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 4.48 GHz Frequencies
• TransferJet
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• 868 MHz / 915 MHz Frequencies
• SMD mounting
• M2M and IoT requirements

Design-In Support Data Sheet

Antennas for GNSS: GPS, GLONASS, Beidou, Galileo

Product Family/Product Supplier Key Features Additional Information
flexiiANT Antenova

• 1559-1609 MHz/ 2.4-2.5 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 1559-1609 MHz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• 1575 MHz / 1559-1609MHz Frequencies
• SMD mounting
• M2M and IoT requirements

Design-In Support Data Sheet

Antennas for Wireless M2M

Product Family/Product Supplier Key Features Additional Information
Antennas Antenova
  • Antennas for a wide range of uses:
    • Bluetooth
    • WiFi
    • ZigBee
    • GNSS
    • Cellular
  • Various Frequencies and Dimension
  • Please refer to PDF for more information

Audio ADC

Audio ADCs

Product Family/Product Supplier Key Features Additional Information
AK5388 AKM - Asahi Kasei Microdevices
  • 24-bit, 216kHz sampling 4-channel A/D converter for high-end audio systems
  • Uses AKM’s Enhanced dual bit architecture, enabling it to realize high accuracy and low cost
  • 120dB dynamic range/ 110dB S/(N+D)
  • Digital filter with modified FIR architecture minimizing group delay while maintaining excellent linear phase response
  • Available in 44pin LQFP package
Data Sheet More Info Design-In Support
AK5730 AKM - Asahi Kasei Microdevices
  • 4-channel ADC withMIc amplifier & diagnostics
  • Supports Line and Microphone inputs, making it ideal for microphone array applications
  • TDM audio format makes it easy to connect with DSP
  • Perfectly suited for car audio applications
Data Sheet More Info Design-In Support
AK5720 AKM - Asahi Kasei Microdevices
  • 2 channel 24-bit ADC w, TDM, Mic amp & short group delay
  • Includes an Input Gain Amplifier, making it suitable for microphone applications
  • Single-ended analog signal input, eliminating the need for external filters
  • Housed in a space-saving 16-pin TSSOP package
Data Sheet More Info Design-In Support

Premium 32bit ADCs

Product Family/Product Supplier Key Features Additional Information
AK557x
  • With support for: 2,4,6 or 8 channels
  • High Sampling Rate? PCM 768kHz max
  • Ultra Low Power? 1/2 of current market level
  • WW No1 SNR? 127dB
  • THD+N: -110dB
  • WW Minimum Latency 5/fs
  • VELVET SOUND & Selectable 5 Sound Colors
  • 2 to 8 channel
AK5558 AKM - Asahi Kasei Microdevices

● Number of Channel: 6ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 261mW
● Package: 64-pin QFN (9mm x 9mm)

Design-In Support Data Sheet
AK5556 AKM - Asahi Kasei Microdevices

● Number of Channel: 6ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 206mW
● Package: 64-pin QFN (9mm x 9mm)

Design-In Support Data Sheet
AK5554 AKM - Asahi Kasei Microdevices

● Number of Channel: 4ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 140mW
● Package: 48-pin QFN (7mm x 7mm)

Design-In Support Data Sheet
AK5552 AKM - Asahi Kasei Microdevices

● Number of Channel: 2ch
● DR, S/N: 115dB
● THD+N: -106dB
● Sampling Rate: 8kHz to 768kHz
● Output Format: PCM mode: 24-bit/32-bit justified, I2S or TDM
  DSD mode: DSD Native 64(2.8MHz), 128(5.6MHz), 256(11.2MHz)
● Sound Color: Four Types Digital Low-pass Filters
 - Short Delay Sharp Roll-off, GD=5/fs
 - Short Delay Slow Roll-off, GD=5/fs
 - Sharp Roll-off
 - Slow Roll-off
Digital High-pass Filters
● Resolution: 32bit
● Input Method: Full Differential Input
● VELVET SOUND Technology: Low-distortion Technology
● Cascade TDM I/F: TDM512: fs= 48 kHz, TDM256: fs= 96 kHz or 48 kHz, TDM128: fs= 192 kHz, 96 kHz or 48 kHz
● Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting available)
● Operation Mode: Master mode / Slave mode
● Detection Function: Input Overflow Flag
● Power Supply: Analog:4.5 to 5.5V Digital:1.7 to 1.98V / 3.0 to 3.6V
● Operation Temperature: -40 to +105°C
● Power Consumption: 83mW
● Package: 48-pin QFN (7mm x 7mm)

Design-In Support Data Sheet
AK5578 AKM - Asahi Kasei Microdevices
  • S/(N+D): 112 dB
  • Sampling Rate: 8 kHz-768 kHz
  • Input: Full Differential Inputs
  • Internal Filter: Four types of LPF, Digital HPF
  • Power Supply: 4.75-5.25 V (Analog), 1.7-1.98 V or 3.0-3.6 V (Digital)
  • Output Format:
    • PCM mode: 24/32-bit MSB justified, I2S or TDM
    • DSD mode: DSD Native 64, 128, 256
    • Maximized Slot Efficiency in TDM Mode by Optimal Data Placed Mode
  • Cascade TDM I/F:
    • TDM512: fs= 48 kHz
    • TDM256: fs= 96 kHz or 48 kHz
    • TDM128: fs= 192 kHz, 96 kHz or 48 kHz
  • Operation Mode: Master Mode & Slave Mode
  • Detection Function: Input Overflow Flag
  • Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting is also available)
  • Power Consumption: 536 mW (@AVDD= 5.0 V, TVDD= 3.3 V, fs= 48 kHz)
  • Package: 64-pin QFN
Data Sheet Design-In Support
AK5576 AKM - Asahi Kasei Microdevices
  • S/(N+D): 110dB
  • Sampling Rate: 8kHz to 768kHz
  • Full Differential Inputs
  • 32Bit Digital Filter
    • Sharp Roll-Off Filter
    • Slow Roll-Off Filter
    • Short Delay Sharp Roll-Off Filter
    • Short Delay Slow Roll-Off Filter
  • DR, S/N: 120dB (Mono Mode: 123dB)
  • Digital HPF
  • Power Supply: 4.75~ 5.25V(Analog), 1.7~1.98V or 3.0 to 3.6V(Digital)
  • Output Format: 24/32bit MSB justified, I2S or TDM
  • Cascade TDM I/F: 16ch/48kHz, 8ch/96kHz, 4ch/192kHz
  • DSD (64fs, 128fs, 256fs) Output Data
  • Master & Slave Modes
  • Overflow Flag
  • 3-wire Serial and I2C μP I/F
  • Power Consumption: 452.9 mW (@AVDD=5.0V, TVDD=3.3V, fs=48kHz)
  • Package: 64-pin QFN
Data Sheet Design-In Support
AK5574 AKM - Asahi Kasei Microdevices
  • S/(N+D): 110dB
  • Sampling Rate: 8kHz to 768kHz
  • Full Differential Inputs
  • 32Bit Digital Filter
    • Sharp Roll-Off Filter
    • Slow Roll-Off Filter
    • Short Delay Sharp Roll-Off Filter
    • Short Delay Slow Roll-Off Filter
  • DR, S/N: 120dB (Mono Mode: 123dB)
  • Digital HPF
  • Power Supply: 4.75~ 5.25V(Analog), 1.7~1.98V or 3.0 to 3.6V(Digital)
  • Output Format: 24/32bit MSB justified, I2S or TDM
  • Cascade TDM I/F: 16ch/48kHz, 8ch/96kHz, 4ch/192kHz
  • DSD (64fs, 128fs, 256fs) Output Data
  • Master & Slave Modes
  • Overflow Flag
  • 3-wire Serial and I2C μP I/F
  • Power Consumption: 302.2mW (@AVDD=5.0V, TVDD=3.3V, fs=48kHz)
  • Package: 48-pin QFN
Data Sheet Design-In Support
AK5572 AKM - Asahi Kasei Microdevices
  • S/(N+D): 112 dB
  • Sampling Rate: 8 kHz - 768 kHz
  • Input: Full Differential Inputs
  • DR: 121 dB (2-to-1 mode: 124 dB)
  • S/N: 121 dB (2-to-1 mode: 124 dB)
  • Internal Filter: Four types of LPF, Digital HPF
  • Power Supply: 4.75-5.25 V (Analog), 1.7-1.98 V or 3.0-3.6 V (Digital)
  • Output Format
    • PCM mode: 24/32-bit MSB justified, I2S or TDM
    • DSD mode: DSD Native 64, 128, 256
  • Maximized Slot Efficiency in TDM Mode by Optimal Data Placed Mode
  • Cascade TDM I/F:
    • TDM512: fs= 48 kHz
    • TDM256: fs= 96 kHz or 48 kHz
  • TDM126: fs= 192 kHz, 96 kHz or 48 kHz
  • Operation Mode: Master Mode & Slave Mode
  • Detection Function: Input Overflow Flag
  • Serial Interface: 3-wire Serial and I2C μP I/F (Pin setting is also available)
  • Power Consumption: 148 mW (@AVDD= 5.0 V, TVDD= 3.3 V, fs= 48 kHz)
  • Package: 48-pin QFN
Data Sheet Design-In Support
AK5397 AKM - Asahi Kasei Microdevices
  • Thoroughly engineered for highest sound quality
  • Achieves wide dynamic range and wide bandwidth, while keeping superior distortion characteristics
  • 127dB dynamic range
  • Maximum Sampling Frequency/Resolution:
  • PCM768kHz/32-bit
  • Ideal for professional studio equipment
  • 3 type of digital sound color filters
Data Sheet More Info Design-In Support

Audio Amplifier

Class D Amplifier

Product Family/Product Supplier Key Features Additional Information
NAU8224 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 3,1W output power
  • Chip enables pin with extremely low standby current and fast start-up time of 3,4ms
  • Ideal for the portable applications of battery drive, as it has advanced features like 87 dB PSRR, 91% efficiency, ultra low quiescent current (i.e. 2,1mA at 3,7V for 2 channels) and superior EMI performance
  • Gain can be selected from 24dB to -62dB (plus mute) by using 2 wire interface and GS pin
Data Sheet Design-In Support
NAU8223 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 3,1W output powe
  • Chip enable pin with extremely low standby current and fast start-up time of 3,4 ms
  • Ideal for the portable applications of battery drive, as it has advanced features like 87 dB PSRR, 91% efficiency, ultra low quiescent current (i.e. 2,1mA at 3,7V for 2 channels) and superior EMI performance
  • Five selectable gain settings (0 dB, 6 dB, 12 dB, 18 dB and 24 dB)
Data Sheet Design-In Support

DDFA - Direct Digital Feedback Amplifier

Product Family/Product Supplier Key Features Additional Information
CSRA6601 & CSRA6600 Qualcomm
  • Outstanding sound quality
  • Typical power levels from 25W to 100W into 8Ω
  • THD+N0.004%
  • Dynamic range 120dB
  • Residual output noise <60µVrms
  • High efficiency Class D architecture
  • Compatible with digital sources
  • On chip DSP resources
  • Platform solutions with CSR wireless and DSP products
CSRA6601:
  • Digital modulator
  • 8 channels
  • Signal processing
  • Digital feedback processing
  • System analysis
CSRA6600:
  • Analogue feedback processor
  • Analogue error processing
  • Digital error conversion
Design-In Support

Headphone

Product Family/Product Supplier Key Features Additional Information
AK4201 AKM - Asahi Kasei Microdevices
  • Audio stereo cap-less headphone amplifier
  • Eliminates the need for large DC-blocking capacitors with a built-in Charge-pump circuit
  • 100dB PSRR (Power Supply Rejection Ratio) is achieved by a built-in regulator
  • 2 Vrms outputs available with excellent linearity when used as a lineout amplifier
  • Available in tiny 12-pin USON (2,2mm x 2,9mm), saving board space, cost, and reducing component height
Data Sheet More Info Design-In Support
ISD8102/8104 Nuvoton Technology
  • Capable of driving a 4Ω load with up to 2Wrms output power
  • Device includes output current limiting, chip enable, low standby current and excellent pop-and-click suppression
  • Internal device gain: 20dB (with external resistors any lesser amount possible)
Data Sheet Design-In Support

Audio Codecs

High Feature Low Power Audio CODECs

Product Family/Product Supplier Key Features Additional Information
AK4951 AKM - Asahi Kasei Microdevices
  • Includes microphone, headphone and speaker amplifiers
  • Supports sampling frequency from 8kHz to 48kHz
  • Thanks to a automatic wind noise reduction filter and a high performance digital ALC (automatic level control) circuit it can record with high-quality sound regardless of whether indoors or outdoors
  • Available in a small 32-pin QFN (AK4951EN) and a 32-pin BGA (AK4951EG) package saving mounting area on the board
Data Sheet More Info Design-In Support
AK4958 AKM - Asahi Kasei Microdevices
  • Includes Microphone & speaker amplifiers
  • Suitable for portable application with recording/playback function
  • Integrated one channel composite In/Out video amplifier
  • Available in a small 32-pin BGA (AK4958EG) or a 25-pin CSP (AK4958ECB) package saving mounting area on the board
Data Sheet More Info Design-In Support
AK4961 AKM - Asahi Kasei Microdevices
  • High sound fidelity for high resolution audio
  • Advanced recording features during video recording
  • Industry proven hands free processing capability
  • Industry leading level performance of THD+N (-99dB) and 110dB dynamic range
  • Includes AKM’s DSP core that enables:
    • Various kinds of voice processing such as voice wakeup
    • Dual mic Tx noise suppression
    • Rx noise suppression
    • Echo cancellation
    • Hands free functions
  • Five audio I/F and SLIMbus I/F
Data Sheet More Info Design-In Support

Multi-Channel Audio CODECs

Product Family/Product Supplier Key Features Additional Information
AK4611/12/13/14 AKM - Asahi Kasei Microdevices
  • Single chip 24-bit audio CODEC that includes:
    • 4 to 6 channel 24-bit ADC
    • 8 to 12 channel 24-bit DAC
  • ADC/DAC with Enhanced Dual Bit architecture/Advanced Multi-Bit architecture enabling very low noise performance
  • Fabricated on a low power process, the AK4611 operates off of a +3.3 V analog supply and a +1.8 V digital supply
  • Supports both single-ended and differential inputs and outputs
  • Available in an 80-pin LQFP package
Data Sheet More Info Design-In Support
AK4627/29 AKM - Asahi Kasei Microdevices
  • Single chip audio CODEC with a sampling rate of up to 96kHz
  • 4 channel 24-bit ADC
  • 6 channel or 8 channel 24-bit DAC
  • ADC/DAC with Enhanced Dual Bit architecture/Advanced Multi-Bit architecture enabling very low noise performance
  • Supports both single-ended and differential inputs and outputs
  • Available in a 48-pin LQFP package.
Data Sheet More Info Design-In Support

Software Codecs

Product Family/Product Supplier Key Features Additional Information
aptX - High Quality Audio Codec Qualcomm
  • Outstanding Bluetooth® Stereo audio quality
  • Audio bandwidth matching CD performance
  • Compression ratio: 4:1
  • Audio Format: 16-bit, 44,1 kHz (CD-Quality)
  • Data Rates: 352 kbps
  • Frequency Response: 10 Hz to 22 kHz
  • Algorithmic Delay:
    • Dynamic Range: 16-bit: >92 dB
    • THD+N: -68,8 dB
Design-In Support

Stereo Audio CODECs

Product Family/Product Supplier Key Features Additional Information
AK4621 AKM - Asahi Kasei Microdevices
  • High performance 192kHz 24-bit CODEC
  • On-board ADC with a high dynamic range due to AKM’s Enhanced Dual-Bit architecture
  • DAC with AKM’s Advanced Multi-Bit architecture that achieves low out-of-band noise and high jitter tolerance through the use of Switched Capacitor Filter (SCF) technology
Data Sheet More Info Design-In Support
AK4558 AKM - Asahi Kasei Microdevices
  • Low voltage 32-bit 216kHz CODEC
  • Includes newly developed 32-bit Digital Filter achieving short group delay and high quality sound
  • Features “OSR-Doubler” technology - making it capable of supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Single-ended analog inputs and outputs to minimize pin count and external filtering requirements
  • Housed in a very small 28-pin QFN - ideal for space-sensitive applications
Data Sheet More Info Design-In Support
AK4556 AKM - Asahi Kasei Microdevices
  • Low voltage 24-bit 192 kHz CODEC
  • Very high dynamic performance to power supply voltage ratio : -103dB SNR for ADC / 106dB SNR for DAC
  • Supports sampling rates up to 216kHz
  • Reduces jitter sensitivity by using an integrated switched-capacitor filter
  • Single-ended analog inputs and outputs to minimize pin count and external filtering requirements
  • Packaged in a very small 20-pin TSSOP - ideal for space-sensitive applications
Data Sheet More Info Design-In Support

Audio DAC

32bit Premium DACs

Product Family/Product Supplier Key Features Additional Information
AK4497 AKM - Asahi Kasei Microdevices
  • DR, S/N: 128dB (Mono mode: 131dB)
  • THD+N: -116dB
  • Sampling Rate8kHz to 768kHz
  • DSD Input: Max: 22.4MHz
  • Sound Color
    • 32-bit 8-fold Digital Filters
    • Short Delay Sharp Roll-off, GD=6.25/fs
    • Short Delay Slow Roll-off, GD=5.3/fs
    • Sharp Roll-off
    • Slow Roll-off
    • Super Slow Roll-off
    • Low-dispersion Short Delay
  • Resolution: 32BIT
  • Number of ChanneL: 2ch
  • Input Method: Full Differential Input
  • VELVET SOUND Technology
  • Low-distortion technology
  • OSRD (Over Sampling Ratio Doubler) technology
  • Power Consumption: 346mW
  • Power Supply
    • Analog: 4.75 to 5.25V
    • Digital: 1.7 to 3.6V
  • Operation Temperature: -40~85°C
  • Package: 64-pin TQFP (10mm x 10mm)
     
Data Sheet More Info Design-In Support
AK4454/6/8 AKM - Asahi Kasei Microdevices 32-bit 4 channel / 6 channel / 8 channel Premium DACs
  • DR, S/N: 115dB
  • Industry best low distortion characteristics
  • Digital input supports PCM inputs up to 768kHz and an 11.2MHz DSD
  • New “OSR-Doubler” technology - supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Five types of 32-bit digital filters
  • THD+N: -107dB
Data Sheet More Info Design-In Support
AK4452 AKM - Asahi Kasei Microdevices
  • DR, S/N: 115dB
  • Industry best low distortion characteristics
  • Digital input supports PCM inputs up to 768kHz and an 11,2MHz DSD
  • New “OSR-Doubler” technology - supporting wide range signals and achieving low out-of-band noise while realizing low power consumption
  • Five types of 32-bit digital filters
  • THD+N: -107dB
Data Sheet More Info Design-In Support
AK4414 AKM - Asahi Kasei Microdevices
  • DR, S/N: 120dB (Stereo mode: 123dB)
  • 128x Over sampling
  • Sampling rate: 30kHz to 216kHz
  • 32-bit 8x digital filter
    • Ripple: ±0.005dB, Attenuation: 80dB
    • High quality sound short delay option; GD=7/fs and GD=5.5/fs
    • Sharp roll-off filter
    • Slow roll-off filter
  • High tolerance to clock jitter
  • Low distortion differential output
  • DSD data input
  • Digital De-emphasis for 32, 44.1, 48kHz sampling
  • Soft mute
  • Digital attenuator (255 levels and 0.5dB step)
  • Stereo mode
  • THD+N: -107dB
  • I/F Format: 24/32-bit MSB justified, 16/20/24/32-bit LSB justified, I2S, DSD, TDM
  • Power supply: DVDD=AVDD=2.7V to 3.6V, VDD1/2=4.75V to 5.25V
  • Digital input level: CMOS
  • Package: 44pin LQFP
Data Sheet More Info Design-In Support
AK4495EQ AKM - Asahi Kasei Microdevices
  • SNR:123 / 120 dB
  • Internal 32-bit digital filter, layout & pin arrangement optimised for unprecedented sound quality
  • Maximum sampling frequency: PCM768kHz/32-bit
  • Maximum bitrate: DSD128 (5,6MHz)
  • THD+N: -101dB
  • 5 types of sound color digital filters
Data Sheet More Info Design-In Support
AK4490 AKM - Asahi Kasei Microdevices
  • SNR:120dB
  • Digital input supports PCM inputs up to 768kHz and DSD input of 2,8MHz / 5,6MHz  / 11,2MHz
  • Internal 32-bit Digital Filter optimized for unprecedented sound quality
  • Maximum sampling frequency: PCM768kHz/ 32-bit
  • Maximum bitrate: DSD256 (11,2MHz)
  • THD+N: -112dB
  • 5 types of sound color digital filters
Data Sheet More Info Design-In Support

Low power DACs

Product Family/Product Supplier Key Features Additional Information
AK4376 AKM - Asahi Kasei Microdevices
  • DAC:
    • 32-bit Advanced Audio Stereo D/A Converter
    • 4 types of Digital Filter for Sound Color Selection
  • Headphone Amplifier
    • Ground-referenced Class-G Stereo Headphone-Amp
    • THD+N: 106dB S/N: 125dB
  • Digital Audio Interface Sampling Rate: Maximum 384kHz
  • Low Jitter PLL
  • Crystal Oscillator
  • Microcomputer Interface: I2C (400kHz)
  • Power Supply: Analog: 1.7 ~ 1.9V Digital: 1.65 ~ 3.6V
  • Operation Temperature Range: -40 ~ 85°C
  • Package: 36-pin CSP, 2.74 x 2.56 mm
Data Sheet Design-In Support
AK4375 AKM - Asahi Kasei Microdevices
  • Ground-referenced headphone amplifier
  • Newly developed 32-bit digital filters for better sound quality, achieving low distortion characteristics and wide dynamic range
  • Jitter cleaner with a built-in SRC and a X’tal
  • Available in a 36-pin CSP package, utilizing less board space than competitive offerings
Data Sheet More Info Design-In Support

Audio Sample Rate Converter

Sample rate converter

Product Family/Product Supplier Key Features Additional Information
AK4133 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 110dB (A-weighted, Typ.)
  • 2 channels Input/Output
  • Asynchronous Sample Rate Converter
  • PCM
    • Input Sample Rate Range (FSI): 8k ~ 192kHz
    • Output Sample Rate (FSO): 44.1kHz, 48kHz
  • Input to Output Sample Rate Ratio: FSO/FSI= 44.1/192~6
  • THD+N: Up to -100dB
  • I/F format: MSB justified, I2S compatible
  • Oscillator for Internal Operation Clock
  • Clock for Master Mode: 128/256/512fso
  • Soft Mute Function
  • Power Supply: DVDD= 3.0 ~ 3.6V or 1.7 ~ 1.9V(LDO OFF Mode)
  • Operating Temperature: -40 ~ +105°C
Data Sheet Design-In Support
AK4132 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 100dB (A-weighted, Typ.)
  • 2 channels Input/Output
  • Asynchronous Sample Rate Converter
  • PCM:
    • Input Sample Rate Range (FSI): 8k ~ 96kHz
    • Output Sample Rate (FSO): 44.1kHz, 48kHz
  • Input to Output Sample Rate Ratio: FSO/FSI = 44.1/96 ~ 6
  • THD+N: Up to -90dB
  • I/F format: MSB justified, I2S compatible
  • Oscillator for Internal Operation Clock
  • Clock for Master mode: 256fso
  • Power Supply: DVDD= 3.0 ~ 3.6V or 1.7 ~ 1.9V (LDO OFF Mode)
  • Operating Temperature: -40 ~ +105ºC
Data Sheet Design-In Support
AK4137 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 188dB (A-weighted)
  • 2 channels input/output
  • Asynchronous sample rate converter with internal oscillator
  • PCM
    • Input sample rate range (FSI): 8kHz to 768kHz
    • Output sample rate range (FSO): 8kHz to768kHz
  • DSD
    • Input sample rate range (FSI): 2,8224MHz to 11,2896MHz
    • Output Sample rate range (FSO): 2,8224MHz to 11,2896MHz
  • Input to Output Sample Rate Ratio: FSO/FSI = 1/6 ~ 24
  • THD+N: up to -150dB
  • PCM/DSD converter
  • Operating temperature: Ta= -40°C to +105°C
Data Sheet More Info Design-In Support
AK4136 AKM - Asahi Kasei Microdevices
  • Dynamic Range: 140 dB (A-weighted)
  • 2 channels input/output
  • Asynchronous Sample Rate Converter with internal oscillator
  • PCM:
    • Input sample rate range(FSI): 8kHz to 384kHz
    • Output sample rate range(FSO): 8kHz to 384kHz
  • Input to output sample rate ratio: FSO/FSI = 1/6 ~ 12
  • THD+N: up to -130dB
  • Operating temperature: Ta= -40°C to +105°C
Data Sheet More Info Design-In Support

Bluetooth Smart

Bluetooth Smart ICs

BT Smart ICs

Product Family/Product Supplier Key Features Additional Information
CSR102x Platform Qualcomm
  • Bluetooth 4.1 low energy radio with direct single-ended 50Ω antenna connection
  • 16-bit microprocessor with 80Kbytes RAM
  • 256 KB Internal Flash memory (some package variants)
  • 64 KB One-time Programmable (OTP) memory
  • Hardware G.722 CODEC
  • Multiple links (up to 4)
  • Integrated Bluetooth 4.2 qualified stack* (*Qualification pending)
  • I2S and I2C interfaces
  • Multiple links (up to 4)
  • SPI interface for external flash memory
Design-In Support More Info
CSR101x Platform Qualcomm
  • On-Chip Application
    • 16MHz 16bit Apps processor
    • Full stack and 50kB application on chip
  • Advanced Power Management
    • Direct battery connection
    • 900nA standby, 16mA peak
  • Powerful Software Development Kit
    • SDK includes many example applications, profiles and services
  • Low Cost PCB
    • Single or double sided
    • 50Ohm direct antenna connection
  • Optimized Peripherals
    • Direct serial interfaces
  • External SPI Flash or EEPROM
  • Up to 32 GPIOs
More Info Design-In Support Solution

Bluetooth Smart Modules

BT Smart Modules

Product Family/Product Supplier Key Features Additional Information
BC118 Blue Creation
  • Features: iBeacon, Mesh or Custom functionality
  • Low power consumption
  • Up to 50m range
  • Transparent and command mode
  • Over the Air Secure firmware upgrade
  • UART, I2C, analog and GPIO interfaces
  • Certification: Bluetooth, FCC, CE and IC
  • Cable replacement: secure reliable data transfer
  • Can run as standalone or controlled by a host
  • Commands can be sent by App to control BC118
  • Transparent mode for I2C and UART
  • iBeacon or proximity for Android
  • Audio over BLE ready
Data Sheet More Info Design-In Support
BTM101 Flairmicro
  • Antenna included
  • External antenna option
  • Easy integration
    • Software support by Atlantik Elektronik
    • Use of development kits
  • High data rate (module to module) of 160kBit/s
  • CSR1010 based
    • +7.5dBm Tx power, -92.5dBm sensitivity
    • Support of BLE profiles ATT, GATT, SMP, L2CAP, GAP
  • QDL/EP – Qualified Design Listing
  • Interfaces
    • UART host interface
    • Debug SPI host interface
    • 10bits ADC
    • 12 digital PIOs
    • 3 analog AIOs
Design-In Support Solution

Bluetooth Smart Software and APPs

Product Family/Product Supplier Key Features Additional Information
Software and APPs Qualcomm
  • Atlantik Standard Software
  • Atlantik Lighting Software
  • Atlantik Customized Software
  • Atlantik Apps
  • CSR Mesh
Design-In Support More Info

Bluetooth Smart Ready

Bluetooth Audio ICs

BT Automotive ICs

Product Family/Product Supplier Key Features Additional Information
CSR8350 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • 80MIPS DSP
  • On-Chip SBC Encoder/ decoder
  • aptX decoder
  • Dual Mic CVC
  • A2DP decode
  • 2 ADCs
  • Dual I2S/ PCM interface
  • UART and USB
  • BGA
Design-In Support

BT ROM Stereo ICs

Product Family/Product Supplier Key Features Additional Information
CSR8635 Qualcomm
  • BT4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (Stereo Line-In)
  • iOS battery status monitor
  • Advanced multi-point (2xHFP, 2x A2DP)
  • 6th generation 1-mic CVC
  • Targeted for Mid-Tier 2-mic stereo headsets
Design-In Support
CSR8630 Qualcomm
  • BT4.0
  • A2DP1.2 and AVRCP1.4
  • Wired audio (Stereo Line-In)
  • Advanced multi-point (2x A2DP)
  • Targeted for entry stereo music speaker
Design-In Support
CSR8645 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired Audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • aptX Codec for high-quality audio
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
Design-In Support
CSR8640 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
  • Pin compatible with CSR8645
Design-In Support

BT Flash ICs

Product Family/Product Supplier Key Features Additional Information
CSR8675 Qualcomm
  • BT4.1
  • 16Mb eFlash and up to 64Mb external serial flash
  • 120 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 2 x I2S interface
  • 16 GPIOs
  • USB 3.3V regulator
  • BGA, pin compatible with CSR8670
Design-In Support
CSR8670 Qualcomm
  • BT 4.0
  • 16Mb eFlash and up to 64Mb external serial flash
  • 80 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 1 x I2S interface
  • 14 GPIOs
  • USB 3.3V regulator
  • BGA and WL-CSP
Design-In Support

BT ROM Mono ICs

Product Family/Product Supplier Key Features Additional Information
CSR8615 Qualcomm
  • BT4.0
  • 1-mic mono
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • Wired Audio (Stereo Line-in)
  • HD Voice
  • Advanced Multi-point (2xHFP, 2xA2DP)
  • iOS battery status monitor
  • 6th generation CVC
  • For Mid-Tier 1-mic mono headsets, mono speakers/ speakerphones
Design-In Support
CSR8605 Qualcomm
  • BT 4.0
  • Mono A2DP sink
  • A2DP1.2 and AVRCP1.0
  • Wired audio (Mono Line-in)
  • Best suited for entry-level mono Music speakers
Design-In Support

Bluetooth Audio Stacks

Product Family/Product Supplier Key Features Additional Information
Melody Blue Creation
  • Support for both Bluetooth 4.0 as well as multiple classic Bluetooth profiles.
    • Supported profiles: HFP, A2DP1.2, AVRCP1.4, PBAP, SPP1.0, IAP
  • Compatibility with 90% of Bluetooth modules
  • Can be controlled over the air via UART or GPIO interfaces
  • Connection to all mobile platforms: Android, iOS, Windows Mobile and Blackberry
  • Melody supports aptX, AAC, SBC and MP3
  • Small memory footprint: 8Mbits
  • Highly flexible and customizable to your demands
Design-In Support
wSync Flairmicro
  • Support of BT 4.0 & BT 2.1+EDR
  • Profiles: HFP (HF/AG), AVRCP, A2DP, DUN, OPP, SPP, MAP, PBAP, PAN
  • Phonebook download via AT commands or OPP
  • Full-duplex voice calls, built-in AEC and noise suppression functions
  • Runs on different hardware platforms with various CPU architectures such as ARM/MIPS
  • UART data transfer interface and simple schematics
  • Works best with Flairmicro HCI modules
Design-In Support

Bluetooth Connectivity ICs

BT Connectivity Automotive ICs

Product Family/Product Supplier Key Features Additional Information
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support

BT Connectivity Flash ICs

Product Family/Product Supplier Key Features Additional Information
CSRB5348 (BC8-Ext) Qualcomm
  • BT4.1
    • Dual-Mode Bluetooth and Bluetooth Smart
  • Low Power
    • Deep Sleep 80µA
  • On Chip Application
    • With external quad-SPI flash interface
    • xIDE based SDK
  • Extensive Array of Input/ Outputs
    • Fully configurable
    • Direct HID streaming to minimize latency
  • Low eBOM
  • Optional charging support
Design-In Support

BT Connectivity ROM ICs

Product Family/Product Supplier Key Features Additional Information
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support
CSR8510 Qualcomm
  • BT4.0 HCI ROM
  • USB
  • CSP
Design-In Support
CSR8811 Qualcomm
  • BT 4.0 HCI ROM
  • UART
  • CSP, QFN
Design-In Support

Bluetooth Connectivity Modules

BT Connect Core Modules

Product Family/Product Supplier Key Features Additional Information
ConnectCard
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40 to 85°C operating temperature
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

BT Connectivity Modules

Product Family/Product Supplier Key Features Additional Information
BTM808 Flairmicro
  • Bluetooth 4.0 module
  • Based on AEC-Q100 CSR8311
  • HCI / High speed UART and USB interface
  • PCM/I2S digital audio interface
  • EEPROM
  • 20.0 x 14.4 x 2.3mm
BTM403 Flairmicro
  • Bluetooth v2.1+EDR, Class 1&2 module
  • HCI / UART interface
  • SPP Master & Slave support
  • Easy-to-use AT command interface
  • 35.3 × 14.0 × 2.5mm
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Bluetooth Connectivity Stacks

Product Family/Product Supplier Key Features Additional Information
MiniStack Blue Creation
  • Support of Dual Mode BT
  • Fully Bluetooth qualified –no further re-test required
  • Small footprint (as low as 26k flash and 3k RAM)
  • Ported on Atmel, STM32, Microchip and TI processors
  • Simple API with example source code application
  • Support of:
    • HID, HFP-AG, HFP-HF, A2DP, AVRCP, SPP
    • IAP/ IAP2 profiles
    • All BLE profiles
    • Multiple connections
  • Available in Windows7 and Linux evaluation form
More Info Design-In Support

Bluetooth/ Wi-Fi Combos

BT/ Wi-Fi Combo ICs

Product Family/Product Supplier Key Features Additional Information
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

Wi-Fi/ BT Combo Modules

Product Family/Product Supplier Key Features Additional Information
WNFQ-255ACN(BT) SparkLAN
  • Standard: 802.11ac/b/g/n
  • Interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Chipset: Qualcomm Atheros QCA6174
  • Antenna: 2 x IPEX MHF4 connector, 2T2R
  • Concurrent Wi-Fi and BT co-existence
  • Data rate up to 867Mbps (MCS9)
  • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
  • Support Win7/Win8.1
Data Sheet Design-In Support

Bluetooth Audio Modules

BT Audio Modules

Product Family/Product Supplier Key Features Additional Information
BTM501 Flairmicro
  • Bluetooth v2.1+EDR, Class 2 module
  • Embedded Bluetooth Protocol Stack
  • Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc.
  • UART and USB programming and data IF
  • Microphone / speaker interface
  • Supports aptX
  • 23.24 mm x 11,94 mm x 2.00 mm
Design-In Support
BC127 Blue Creation
  • BT4.0 Dual Mode
  • Embedded Bluetooth Protocol Stack
  • Supports HFP, A2DP Sync, AVRCP, PBAP, MAP, SPP
  • Supports HFP-AG and A2DP Source for Transmit
  • Supports IAP1/IAP2 profiles
  • Supports aptX
  • Simple UART and GPIO interfaces for command and control
  • Small form factor (11.8 mm x 18 mm)
Data Sheet Design-In Support
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Connect Core Modules

Product Family/Product Supplier Key Features Additional Information
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

Cellular

LTE/GSM/GPRS/UMTS/HSPA Modems

GSM/GPRS

Product Family/Product Supplier Key Features Additional Information
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band
M95 Quectel
  • 42-pin LCC
  • 19.9 x 23.6 x 2.65 mm
  • Quad-band
  • 3G migration
More Info Data Sheet Design-In Support
M66 Quectel
  • 44-pin LCC
  • 17.7 × 15.8 × 2.3 mm
  • Quad-band
More Info Data Sheet Design-In Support

UMTS/HSPA

Product Family/Product Supplier Key Features Additional Information
UG96 Quectel
  • Penta-band UMTS/HSPA
  • compatibility with Quectel UG95 & M95
  • 7.2Mbps DL / 5.76Mbps UL
  • 22.5 × 26.5 × 2.2mm
Data Sheet Design-In Support
UC20 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC20 Quectel
  • 112-pin LCC
  • 32.0 x 29.0 x 2.5 mm
  • 14.4M DL / 5.76M UL
  • -E/ -A / -G
  • UMTS / HSPA+
  • GPS/GNSS
  • M10 upgrade (ext.)
Data Sheet Design-In Support
UC15 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC15 Quectel
  • 108-pin LCC
  • 29.0 x 29.0 x 2.5 mm
  • 3.6M DL / 384K UL
  • -E/ -A
  • UMTS / HSDPA
  • M10 upgrade
More Info Data Sheet Design-In Support
UG95 Quectel
  • 102-pin LGC
  • 23.6 x 19.9 x 2.2 mm
  • 7.2M DL / 5.76M UL
  • -E/ -A
  • UMTS / HSPA
  • M95 upgrade
More Info Data Sheet Design-In Support

Power Amplifiers and Switches

PAs, switches, MMMB PAs, ASMs and more

Product Family/Product Supplier Key Features Additional Information
Solutions around cellular chipsets and antennas Qorvo

Complete solution around cellular applications including:

  • Single band PAs and Multi-Mode Multi-Band (MMMB) PAs
  • Filters / Duplexers
  • Antenna switching and antenna tuning

Router-, Gateway-Solutions

ConnectPort X family

Product Family/Product Supplier Key Features Additional Information
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Industrial Router

Product Family/Product Supplier Key Features Additional Information
LR54 Digi International
  • Cat 6 LTE-Advanced speed (300Mbps)
  • Dual 2.4 and 5GHz radios, with 802.11ac
  • Global LTE network support: Offers software selectable 3G/4G LTE
  • Patented SureLink™ connection
  • PCI-certified Digi Remote Manager®, IPsec VPN firewall, and 256-bit AES encryption as well as the new Digi TrustFence™ Device Security Framework
  • Operate between -20°C to +70° C
  • Remote device management
Design-In Support Data Sheet
WR 44 family
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing / IP30
WR 44RR family
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
WR 41 family
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 21 family
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 11 family
  • 1 x Ethernet port
  • Cellular 2.5G/3G/4G
  • Dual SIM
  • Plastic housing
  • Digi Device Cloud ready
WR31 Digi International
  • 2 x Ethernet port
  • 1 x RS232/422/486 port
  • Din-Rail mounting
  • Hazardous (CLASS 1 DIV 2)
  • Aluminum Enclosure (IP30)
Data Sheet Design-In Support
WR44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
Data Sheet Design-In Support
WR44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing / IP30
Data Sheet Design-In Support
WR41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR11 family Digi International
  • 1 x Ethernet port
  • Cellular LTE/HSPA+ with 3G and 2G fallback
  • 2 SIM Slots
  • XT variant comes with metal housing
  • XT variant with screw-down SIM cover
  • Digi Remote Manager
  • Power Input 5VDC
Data Sheet Design-In Support

GSM/GPRS/UMTS/HSPA Modems

Product Family/Product Supplier Key Features Additional Information
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band

Clock & Timing

Clock Distributions - Buffers

Product Family/Product Supplier Key Features Additional Information
AK8181D AKM - Asahi Kasei Microdevices 3.3V LVPECL 1:4 Clock Fanout Buffer
  • Four differential 3.3V LVPECL outputs
  • Selectable differential PCLK0p/n or LVPECL clock inputs
  • Operating temperature range: -40℃ to +85℃
  • Package: 20-pin TSSOP (Pb free)
Data Sheet More Info Design-In Support
AK8180E AKM - Asahi Kasei Microdevices 2.5V, 3.3V LVCMOS 1:18 Clock Fanout Buffer
  • 18 LVCMOS outputs enable to drive up to 36 clock lines
  • LVCMOS/LVTTL input
  • Operating temperature range: -40℃ to +85℃
  • Package: 32-pin LQFP (Pb free)
  • Pin compatible with CY29942, MPC942C
Data Sheet More Info Design-In Support
AK8122 AKM - Asahi Kasei Microdevices Differential Zero Delay Clock Buffer
  • Phase Locked Loop (PLL)
  • Operational frequency range: 160MHz to 400MHz
  • Output delay: -30 ±100 ps
  • Operating temperature range: -40℃ to +85℃
  • Package: 8-pin MSOP (lead free)
Data Sheet More Info Design-In Support

ICs for crystal oscillator - XO, TCXO, VCXO

Product Family/Product Supplier Key Features Additional Information
AK2147 AKM - Asahi Kasei Microdevices XO (X'tal oscillator) IC
  • Exceptional high stability
  • Oscillator and output characteristics are adjustable using an internal EEPROM
Design-In Support
AK2175 AKM - Asahi Kasei Microdevices TCXO (Temperature compensated X'tal oscillator) IC
  • Exceptional high stability
Design-In Support
AK2160A AKM - Asahi Kasei Microdevices VCXO (Voltage controlled X'tal oscillator) IC
  • Oscillator and output characteristics are adjustable using an internal EEPROM
Design-In Support
AK2148/49 AKM - Asahi Kasei Microdevices
  • For small size / low noise / low power XO
Design-In Support

Low Jitter, programmable, multi Clock components

Product Family/Product Supplier Key Features Additional Information
AK8160 AKM - Asahi Kasei Microdevices Multi Clock Generator for PCI-Express
  • PLL with spread spectrum (SS) function
  • Output high quality differential 100MHz as PCI Express clock and 25MHz as reference simultaneous
  • Low current consumption: 31mA typical
  • Automotive qualified version (AK8160BV2) available
Data Sheet More Info Design-In Support
AK8140A AKM - Asahi Kasei Microdevices Programmable Multi Clock Generator
  • In-system programmability
  • Serial programmable register via I2C interface
  • High accuracy clock generator
  • Flexible Input clock source
  • Operating temperature range: -40℃ to +85℃
  • Package: 24-pin ETSSOP (lead free)
Data Sheet More Info Design-In Support
AK8116 AKM - Asahi Kasei Microdevices Single clock generator IC with an integrated PLL
  • Low jitter performance: 15ps (typical) period, 1 σ
  • Low current consumption: 3,8mA (typical)
  • Operating temperature range: -20℃ to +85℃
  • Package: 6-pin SON (lead-free)
Data Sheet More Info Design-In Support
AK8186B AKM - Asahi Kasei Microdevices Multi Output Clock Generator with Integrated 2.0GHz VCO
  • Low phase noise PLL : RMS jitter < 300 fs
  • On-chip VCO tunes from 1.75GHz to 2.25GHz
  • External VCO/VCXO to 500MHz optional
  • 1 differential or 2 single-ended inputs
Data Sheet More Info Design-In Support

Circuit Protection

Circuit Protection

Product Family/Product Supplier Key Features Additional Information
Fuses & PTC Resettable devices Bel Fuse
  • Brick Miniature Surface Mount Fuses
  • Chip SMT Fuses
  • Ultra Low Profile SMT PTC Resettable devices
  • PTC Resettable devices
  • PTC Radial Leaded Resettable devices
  • 250 / 277 Volt Radial Fuse
  • 600 Volt Radial Fuse
  • 5 x 15 mm Axial Leaded Fuses
  • 3 x 7 mm Axial Lead Micro Fuse
  • Glas or Ceramic Fuses
More Info Design-In Support

DAB, DAB+

DAB/ DAB+ (Digital Audio Broadcasting)

Frontend and Baseband ICs

Product Family/Product Supplier Key Features Additional Information
PNxxxx family PnP Network Technologies
  • DAB 1.0/1.5/2.0/2.5
  • DRM Back-End
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support
PNSxxxx family PnP Network Technologies
  • Supports: DAB, DAB+, T-DMB, FM-RDS, DRM & HD
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

WWR (World Wide Radio)

WWR

Product Family/Product Supplier Key Features Additional Information
PAIOS family PnP Network Technologies
  • Supports:
    • DAB/DAB+/DMB-A
    • DRM/DRM+
    • AM/FM
    • HD radio
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

DC-DC Power Converters

DC-DC Power Converters

Product Family/Product Supplier Key Features Additional Information
Non Isolated Converter Bel Fuse Largest selection of non-isolated DC-DC converters in the OEM Embedded Power industry:
  • Micro SIP series 12Vin/ 10A max. output
  • Power SIP series 12Vin/ 90A max. output
  • Voltage regulator module 150A max. output
  • Bobcat series (Surface &vertical) 30A max. output
  • Tunable loop series 50A max. output
  • Power block series 30A max. output
  • Custom designs
Design-In Support
Isolated Brick Converter Bel Fuse Broad line of single output isolated DC-DC Power Converters:
  • Full isolated brick converter 48 Vin/ 700W max. output
  • 1/2 isolated brick converter 48 Vin/ 600W max. output
  • 1/4 isolated brick converter 48 Vin/ 400W max. output
  • 1/8 isolated brick converter 48 Vin/ 144W max. output
  • 1/16 isolated brick converter 24 Vin or 48 Vin/ 60W max. output
  • Custom designs
Design-In Support

DRAM

DDR SDRAM

Product Family/Product Supplier Key Features Additional Information
W94 Family Winbond Electronics
  • 32Mb to 256Mb densities
  • Voltage: 2.4V to 2.7V or 2.5V±0.2V
  • Speed: DDR-500 / DDR-400 / DDR-333
  • Automotive and industrial certified
Design-In Support

DDR2 SDRAM

Product Family/Product Supplier Key Features Additional Information
W97 Family Winbond Electronics
  • 256Mb to 4GB densities
  • Voltage: 1.8V±0.1V
  • Speed: 1066 / 800 / 667Mbps
  • Automotive and industrial certified
Design-In Support

DDR3 SDRAM

Product Family/Product Supplier Key Features Additional Information
W6 Family Winbond Electronics
  • 512Mb to 4GB densities
  • Speed: 1866 / 1600 / 1333Mbps
  • Automotive and industrial certified
Design-In Support

SDRAM

Product Family/Product Supplier Key Features Additional Information
W98 Family Winbond Electronics
  • 16Mb to 256MB densities
  • Voltage: 3.3V±0.3V and 2.7V to 3.6V
  • Speed: 143 / 166 / 200MHz
  • Automotive and industrial certified
Design-In Support

DSPs

Hands free & ECNR

Product Family/Product Supplier Key Features Additional Information
AK7738VQ AKM - Asahi Kasei Microdevices
  • Two stereo ADCs, one monaural ADC, two stereo 32-bit DACs and four asynchronous stereo SRCs
  • Flexible serial interface is available with twelve input and twelve output channels
  • Can provide signals to a class-D amplifier and receive input data from external digital audio sources
  • Easy composition of a multichannel system with an external DAC
Data Sheet More Info Design-In Support
AK7755EN AKM - Asahi Kasei Microdevices
  • Includes a mono ADC, a stereo audio CODEC, a MIC pre-amplifier, a line-out amplifier and digital audio I/F
  • Programmable for user requirements such as high performance hands free function and acoustic effects
  • Available in a space saving small 36-pin QFN package
Data Sheet More Info Design-In Support
AK7736BVQ AKM - Asahi Kasei Microdevices
  • Integrated 2 channel SRC
  • Includes internal memories for digital audio processing
  • High accuracy IIR/FIR filter performance
  • Can operate with hands-free software by AKM or other sound processing software
Data Sheet More Info Design-In Support

Audio DSP & Hands free

Product Family/Product Supplier Key Features Additional Information
AK7601 AKM - Asahi Kasei Microdevices
  • Integrated audio CODEC (3 channel ADC, 6 channel DAC) and delay line memory
  • Analog inputs support quasi-differential/single-ended inputs with 4:1 stereo selector
  • Digital inputs supports 3:1 input selector with asynchronous Sample Rate Converter (SRC)
  • 6-channel DAC integrates full-range digital volume control and achieves 102dB with single end outputs
  • Adjustable delay memory control
    • Maximum delay time:
      • Lch 18ms, Rch 18ms (for 1 stereo input / 3 stereo outputs)
  • Delay resolution: 1/fs
  • Operating temperature: -40°C to 85°C
Data Sheet More Info Design-In Support
AK7738VQ AKM - Asahi Kasei Microdevices
  • Two stereo ADCs, one monaural ADC, two stereo 32-bit DACs and four asynchronous stereo SRCs
  • Flexible serial interface is available with twelve input and twelve output channels
  • Can provide signals to a class-D amplifier and receive input data from external digital audio sources
  • Easy composition of a multichannel system with an external DAC
Data Sheet More Info Design-In Support

Sound Enhancement - Audio MAXX

Product Family/Product Supplier Key Features Additional Information
NPCP215x Nuvoton Technology
  • Improves audio quality for low-performance speakers
  • System-level BOM savings
  • Stereo or Stereo + Sub-woofer operation
  • I2C controlled
  • 24-bit accuracy
  • MaxxAudio® algorithms
  • Audio input: up to four I2S or Synchronous Serial Interface (SSI) inputs
  • Audio output:
    • Up to three I2S or SSI outputs
    • Class-D Power output up to 2 x 20W
    • 2.1 way power output up to 2 x 10W + 20W (internal generation of sub-woofer)
  • 100dB SNR
  • Typical power efficiency of 90%
  • Various protection sensors
  • Several General-Purpose digital signals available to the application (GPIOs)
  • Logic supply of 3.3V and Power supply up to 26.4V
  • 7 x 7 mm, 48-pin Quad Flat No-Lead (QFN) package
Data Sheet Design-In Support

Speech Recognition

Product Family/Product Supplier Key Features Additional Information
ISD9160 Nuvoton Technology
  • Audio SOC chip corder & recognition
  • REC/Playback
    • 60sec at 16kbps
  • Embedded flash
  • Class D
  • ISP (in system programming) Cortex-M0 up to 50MHz
  • Compression ADPCM, PCM
  • Voice sensor:
    • Speaker independent 90% accuracy
    • Personal defined commands 97% accuracy
Data Sheet Design-In Support

Ethernet & Wi-Fi Communication

Embedded Serial to Ethernet/Wi-Fi Modules

Rabbit MiniCore Modules

Product Family/Product Supplier Key Features Additional Information
MiniCore RCM5600W Series
  • Rabbit® 5000 running at 74 MHz
  • 802.11b/g wireless modules and pin-compatible with MiniCore 10/100 Ethernet
  • High Security: SSL and AES.
  • 1 MB of internal RAM for program storage
  • Up to 4 MB of serial Flash for datalogging or web page storage
  • Up to 32 GPIO lines and 6 serial ports
  • Dynamic C, an ANSI C compatible development environment
  • Certified to meet FCC and other international regulatory requirements
RabbitCore RCM6600W Digi International
  • Rabbit 6000 running up to 180 MHz
  • Integrated 802.11b/g and 10/100 Ethernet - up to 4Mflash, 1MB SRAM
  • 4 A/D inputs 12-bit resolution
  • Clock speed up to 180 MHz
  • Up to 35 GPIO line and 6 serial ports, PWM, RTC
  • Lightweight web server for monitoring and control & ZigBee and GPS/3G cellular connectivity support
Data Sheet Design-In Support
MiniCore RCM6700 Series Digi International
  • Rabbit® 6000 running at up to 200MHz
  • 10/100 Ethernet and pin-compatible with MiniCore 802.11b/g wireless modules
  • 1MB of internal RAM for program storage
  • Up to 4MB of serial flash for data logging or web page storage
  • Provides up to 6 serial ports, configurable I/O and control features such as PWM
  • Flexible interface module, FIM which extends peripheral connectivity like CANbus, 1-Wire and SD/SDIO
  • Dynamic C, is an ANSI C compatible development environment
Data Sheet Design-In Support

xPico Modules

Product Family/Product Supplier Key Features Additional Information
Lantronix xPico Lantronix
  • Based on the DSTni-EX enhanced 16-bit x86 architecture
  • 10/100 Mb ethernet (external magnetics & RJ45)
  • 2 Serial RS232, up to 920kbps
  • 8 GPIO (modem signals)
  • Extended temperature range: -40°C to +85°C
  • 256-bit AES encryption
  • SNMP, Telnet, Serial, Internal Web Server, and Microsoft Windows based utilitys for configuration
  • Input voltage: 3.3 VDC
  • Size: 24 mm (L) x 16.5 mm (W) x 5.64 mm (H)
  • Weight: 2.5 g
  • 5-Year limited warranty
Data Sheet Design-In Support
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support

Xport Modules

Product Family/Product Supplier Key Features Additional Information
Lantronix xPort & xPort Pro Lantronix
  • DSTni-EX chip at 26MHz, 48MHz and 88MHz
  • 10/100MB Ethernet (external magnetics & RJ45)
  • Serial RS232, up to 920kbps
  • 3 GPIO (modem signals, flow control)
  • Extended temperature range: -40°C to +85°C
  • 256-bit AES encryption
  • ModBus ASCII/TCP or RTU/TCP
  • Up to 16MB RAM, 16MB flash
  • Plug & Play or EVOS (xPort Pro), Linux development kit
  • SSH & SSL encryption for serial tunnel
  • SNMP V2c, MIB II support
Design-In Support Data Sheet

Digi Connect Modules

Product Family/Product Supplier Key Features Additional Information
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support

WI-Port Modules

Product Family/Product Supplier Key Features Additional Information
Wi-Port Lantronix
  • Lantronix DSTni-EX 186 CPU
  • 802.11b/g
  • Host Interface UART (921kbps)
  • Full TCP/IP stack, web server and Windows deployment software
  • 1 x U.FL connector
  • Lantronix SmartRoam technology provides seamless mobile connectivity and improved reliability
  • Temperature Range -40°C to +70°C
  • Ethernet-WLAN Bridging possible
  • Bulletproof wireless security with IEEE 802.11i-PSK, WPA-PSK, TKIP
Data Sheet Design-In Support

PremierWave Modules

Product Family/Product Supplier Key Features Additional Information
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Embedded Serial to Wi-Fi Modules

Product Family/Product Supplier Key Features Additional Information
MiniCore RCM5600W Series
  • Rabbit® 5000 running at 74 MHz
  • 802.11b/g wireless modules and pin-compatible with MiniCore 10/100 Ethernet
  • High Security: SSL and AES.
  • 1 MB of internal RAM for program storage
  • Up to 4 MB of serial Flash for datalogging or web page storage
  • Up to 32 GPIO lines and 6 serial ports
  • Dynamic C, an ANSI C compatible development environment
  • Certified to meet FCC and other international regulatory requirements
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Ethernet Mag Jack, Jacks & Plugs, Magnetics

Ethernet Jacks, Plugs & Cable Assemblies

Product Family/Product Supplier Key Features Additional Information
Ethernet Jacks, Plugs & Cable Assemblies Bel Fuse
  • Single port right angle modular jacks
  • Single port Vertical / 45° modular jacks
  • ARJ45 jack & plugs
  • MRJ21 cable assemblies
  • RJ point five cable assemblies and connectors
  • Harmonica jacks
  • Stacked jacks
  • Large Dia CAT6a plugs
  • Fiber optic cable assy
More Info Design-In Support

Ethernet MagJacks

Product Family/Product Supplier Key Features Additional Information
MagJacks Bel Fuse
  • Single, multi-port & USB Combo RJ-45 connectors
  • 10/100BT, 1GBT, 10GBT, PoE & PoE Plus
  • W & w/o LEDs and bi-color
  • Vertical mount packaging
  • Low profile & micro height versions
  • IR reflow compatible, 230°C @ 90 sec
  • Surge protection for GR1089 intra-building & ESD
  • Extended temperature range: -40°C to +85°C
Data Sheet Design-In Support

LAN Magnetics

Product Family/Product Supplier Key Features Additional Information
LAN Magnetics Bel Fuse
  • 10/100BT, 1GBT, 10GBT
  • PoE & PoE plus
  • Single, dual & quad port (as standard)
  • Extended temperature range -40°C to +85°C
  • Turn ratio: 1:1 Tx/Rx & alternatives
  • Standard & low profile package
  • Through Hole & SMT variants
Design-In Support

SFP Transceiver

Product Family/Product Supplier Key Features Additional Information
SFP Transceiver Bel Fuse
  • Designed with Broadcom’s BCM54616S chipset
  • Complies with IEEE 802.3, 802.3u & 802.3ab
  • 10/100/1000Base-T, 1000Base-X to 1000Base-T
  • 10/100/1000Base-T SyncE
  • SGMII compliant and/or GBIC compliant
  • Extended temperature range -40°C to +85°C
More Info Design-In Support

Router-, Gateway-Solutions

Industrial Routers

Product Family/Product Supplier Key Features Additional Information
WR31 Digi International
  • 2 x Ethernet port
  • 1 x RS232/422/486 port
  • Din-Rail mounting
  • Hazardous (CLASS 1 DIV 2)
  • Aluminum Enclosure (IP30)
Data Sheet Design-In Support
WR44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
Data Sheet Design-In Support
WR44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing / IP30
Data Sheet Design-In Support
WR41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR11 family Digi International
  • 1 x Ethernet port
  • Cellular LTE/HSPA+ with 3G and 2G fallback
  • 2 SIM Slots
  • XT variant comes with metal housing
  • XT variant with screw-down SIM cover
  • Digi Remote Manager
  • Power Input 5VDC
Data Sheet Design-In Support

ConnectPort X Family

Product Family/Product Supplier Key Features Additional Information
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Router-, Hub-, Gateway-Solutions

Product Family/Product Supplier Key Features Additional Information
LR54 Digi International
  • Cat 6 LTE-Advanced speed (300Mbps)
  • Dual 2.4 and 5GHz radios, with 802.11ac
  • Global LTE network support: Offers software selectable 3G/4G LTE
  • Patented SureLink™ connection
  • PCI-certified Digi Remote Manager®, IPsec VPN firewall, and 256-bit AES encryption as well as the new Digi TrustFence™ Device Security Framework
  • Operate between -20°C to +70° C
  • Remote device management
Design-In Support Data Sheet

Fingerprint Sensor & Modules

Embedded Fingerprint Module

Product Family/Product Supplier Key Features Additional Information
Fingerprint Embedded Module (GTM Series) Holtek Semiconductor
  • Single chip fingerprint recognition module
  • Complete integrated algorithms for learn, login and erase functions
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin optical sensor
  • 1:1 verification and 1:N identification
  • Downloadable sensor fingerprint image
  • Fingerprint templates can be read / written to module
  • UART communication protocol for interfacing to external master MCU
  • Easy fingerprint recognition product integration
Data Sheet Design-In Support

Fingerprint Sensor

Product Family/Product Supplier Key Features Additional Information
Fingerprint Sensor Module (GT Series) Holtek Semiconductor
  • Single chip fingerprint recognition sensors
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin profile
  • Internal I2C interface for parameter setting
  • High C/P Ratio
  • CCIR601 Interface
  • Special surface design can accommodate dry fingers
  • Static electricity resistant durable design
  • Resists 2D non-genuine fingerprints for higher safety coefficients
Data Sheet Design-In Support

USB Fingerprint Module

Product Family/Product Supplier Key Features Additional Information
Fingerprint USB Module (GTU Series) Holtek Semiconductor
  • High dpi and low image distortion
  • Advanced optical technology
  • High accuracy and high recognition speed
  • Ultra-thin optical sensor
  • Static electricity resistant durable design
  • Downloadable sensor fingerprint image
  • Easy fingerprint recognition product integration
  • USB 2.0 Full Speed Interface for convenient interfacing to external MCU or PC
  • Volume production with high quality based on NB CAM manufacturing procedure
  • Provides Software Development Kit and Application Programming Interface
Data Sheet Design-In Support

GPS, Glonass, Galileo & Beidou

GNSS Modules

RADIONOVA Antenna Modules

Product Family/Product Supplier Key Features Additional Information
M10578-A3 Antenova
  • Mediatek MT3333
  • 13.8 x 9.5 x 1.8 mm
  • GNSS module
  • Bandwith: 50MHz
  • External antenna support
  • Host interface: UART
  • CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet
M10578-A2 Antenova
  • Mediatek MT3337-E
  • 13.8 x 9.5 x 1.8 mm
  • GPS module
  • Bandwith: 30MHz
  • External antenna support
  • Host interface: UART, CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet

Lxx series (MTK based)

Product Family/Product Supplier Key Features Additional Information
L70(-R) Quectel
  • L70(-R)
  • MT3329
  • 10 x 10 mm
  • GPS module
Data Sheet Design-In Support
L80 Quectel
  • L80
  • MT3329
  • 16 x 16 mm
  • GPS antenna module
Data Sheet Design-In Support
L76 Quectel
  • MT3333
  • 10 x 10 mm
  • GNSS module
Data Sheet More Info Design-In Support

A10 Series (GNSS Antenna Modules)

Product Family/Product Supplier Key Features Additional Information
A10477 Antenova
  • SiRFstarIV GSD4e
  • 24,2 x 9,9 x 3,8 mm
  • GPS module
A10478-A1 Antenova
  • SiRFstarIV GSD4e
  • 13,8 x 9,5 x 1,8
  • GPS module
A10478-A2 Antenova
  • Mediatek MTK3337
  • 13,8 x 9,5 x 1,8
  • GPS module
A10478-A3 Antenova
  • Mediatek MTK3333
  • 13,8 x 9,5 x 1,8
  • GPS / GLONASS module

SiRFstarV Multi-GNSS platform

SiRFstarV e, ea

Product Family/Product Supplier Key Features Additional Information
SiRFstarV 5ea Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130 dBm)
  • Hot start
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10 Hz propagated
  • SiRFdrive support
Design-In Support
SiRFstarV 5e Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130dBm)
  • Hot start
  • Sensitivity
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10Hz propagated
Design-In Support

I/O Controller, Hardware Monitor, Security ICs

Hardware Monitors

Product Family/Product Supplier Key Features Additional Information
NCT7XXX Series Nuvoton Technology
  • Provides accurate voltage and temperature monitoring via Nuvoton’s SMART FAN™ IV fan control algorithms and advanced system protection mechanisms
  • Internal 10-bit ADC converts monitored temperature with ±1℃ accuracy.
  • Can monitor up to 5 temperature channels and 20 analog voltage inputs simultaneously.
  • Fan monitoring and conrol functions make possible an easy implementation of quiet cooling solutions with maximum safety and flexibility
  • System interface: SMBus
  • Operating voltage: 3.3V
Data Sheet Design-In Support

RS-485 Transceiver

Product Family/Product Supplier Key Features Additional Information
V6601

World first polarity adaptive RS-485 transceiver

  • ±15 kV contact ESD
  • Polarity self adaptive
  • Over thermal, over current and over voltage protected
  • Operating Temp. -40+85°C
  • Data rate: ?500kbps
  • High driving capability: up to 256 drivers on one bus
  • Differential driver output: 2.88V?VOD?5.0V @54?

Super I/O, eSIO, GPIO expander

Product Family/Product Supplier Key Features Additional Information
NCT66/67, NCT51/55, W83627 Nuvoton Technology
  • Up to 6 UARTs
  • LQFP48/64/128
  • Port 80
  • LPC interface, (eSPI interface)
  • Parallel Port, Hardware Monitor
  • Operating temperature range: -40℃ to 85℃
Design-In Support

Trusted Platform Module

Product Family/Product Supplier Key Features Additional Information
NPCTXXX Series Nuvoton Technology
  • Single-chip TPM solution (TSSOP28 & QFN32)
  • Various host interfaces (LPC, SPI (3,3 V & 1,8 V) & I2C/ TIS, CRB and NV-MMIO)
  • At least 16K/24K bytes NV storage (TPM1.2/2.0) (Extended life time (32Mio writes))
  • Five secured GPIOs (dedicated physical presence pin)
  • EK certification support
  • Field upgrade support
  • TCG compliance (TPM 1.2 & future TPM 2.0)
  • FIPS 140-2/3
  • Common criteria (CC) EAL4+
  • Security and Attack countermeasures
Design-In Support

GPIO Expander

Product Family/Product Supplier Key Features Additional Information
W83L60XXX Series, NCT5955Y, NCT5605Y Nuvoton Technology
  • This series allows the easy addition of multiple GPIO capabillities over standard SMBus interface
  • These devices include strappable address setting, input interrupts, LED, BEEP functions
  • Supply voltage: 2,3V to 5.5V
  • Up to 16 GPIOs
  • Interface: SMBus/I²C
Design-In Support

Level Shift Ics

Product Family/Product Supplier Key Features Additional Information
NCT59XXX Series Nuvoton Technology
  • GTL to TTL series:
    • Bi-directional level shifting between buses operation at TTL and GTL voltage levels
    • Operation voltage: 0.5V to 6.0V
    • Inputs: 4/ Outputs: 4
    • Operating temperature range: -40℃ to +85℃
    • TSSOP14 package
  • I²C series:
    • Provides the ability to interface a variety of devices with different operating voltages on the same I²C
    • High ESD protection and speeds are supported
    • SMBus Repeater, SMBus up to 1MHz
    • Operation voltage: 0.8V to 5.5V / 2.2V to 5.5V
    • Inputs: 1/ outputs: 1
    • Operating temperature range: -40℃ to +85℃
    • MSOP8 package
Design-In Support

Interconnect & Magnetics

Ethernet Jacks, Plugs & Cable Assemblies

Powerline Solution

Product Family/Product Supplier Key Features Additional Information
Powerline Solution
  • Based on Qualcomm Atheros AR6400/AR1400 chipsets
  • Supports HomePlug AV Standard (200Mbps)
  • MII (Host & PHY) interface
  • Supports 1024/256/64/16/8-QAM, QPSK, BPSK & ROBO modulation
  • 128-bit AES Link Encryption
  • Supports IGMP managed multicast sessions
  • Vertical or Horizontal mounting
  • Green standard compliant
  • Ext. temp. range -40° to +85° Cel.
Powerline Solutions Bel Fuse
  • Based on Qualcomm Atheros AR6400/AR1400 chipsets
  • Supports HomePlug AV standard (200Mbps)
  • MII (Host & PHY) interface
  • Supports 1024/256/64/16/8-QAM, QPSK, BPSK & ROBO modulation
  • 128-bit AES link encryption
  • Supports IGMP managed multicast sessions
  • Vertical or horizontal mounting
  • Green standard compliant
  • Extended temperature range: -40°C to +85°C
Design-In Support

Ethernet MagJacks

Product Family/Product Supplier Key Features Additional Information
MagJacks Bel Fuse
  • Single, multi-port & USB Combo RJ-45 connectors
  • 10/100BT, 1GBT, 10GBT, PoE & PoE Plus
  • W & w/o LEDs and bi-color
  • Vertical mount packaging
  • Low profile & micro height versions
  • IR reflow compatible, 230°C @ 90 sec
  • Surge protection for GR1089 intra-building & ESD
  • Extended temperature range: -40°C to +85°C
Data Sheet Design-In Support

LAN Magnetics

Product Family/Product Supplier Key Features Additional Information
LAN Magnetics Bel Fuse
  • 10/100BT, 1GBT, 10GBT
  • PoE & PoE plus
  • Single, dual & quad port (as standard)
  • Extended temperature range -40°C to +85°C
  • Turn ratio: 1:1 Tx/Rx & alternatives
  • Standard & low profile package
  • Through Hole & SMT variants
Design-In Support

SFP Transceiver

Product Family/Product Supplier Key Features Additional Information
SFP Transceiver Bel Fuse
  • Designed with Broadcom’s BCM54616S chipset
  • Complies with IEEE 802.3, 802.3u & 802.3ab
  • 10/100/1000Base-T, 1000Base-X to 1000Base-T
  • 10/100/1000Base-T SyncE
  • SGMII compliant and/or GBIC compliant
  • Extended temperature range -40°C to +85°C
More Info Design-In Support

Magnetic Sensors

Current Sensors

Product Family/Product Supplier Key Features Additional Information
CQ-3 Series AKM - Asahi Kasei Microdevices
  • Current Sensor in SMD package
  • High isolation voltage: 3.0kV (50/60Hz, 60sec)
  • Compliant to safety standards of IEC/UL-60950 and UL-508
  • Ultra-fast response time: 0.5 μsec (typ.)
  • Low variation and low temperature drift of sensitivity and zero-current output voltage
  • No output hysteresis
  • Low noise output: 0.7 to 2.7 mVrms (depending on variant)
  • Bi-directional type
  • 5V single power supply
  • Ratiometric output
  • Halogen free
Design-In Support

Hall Effect Ics

Product Family/Product Supplier Key Features Additional Information
EZ Series AKM - Asahi Kasei Microdevices
  • InAs Hybrid
  • Latch & Unipolar versions available
  • Many variants
  • Suitable for automotive applications
Design-In Support
EW Series AKM - Asahi Kasei Microdevices
  • InSb Hybrid
  • Latch & Uni-/Omnipolar versions available
  • Many variants
Design-In Support
AK/EM Series AKM - Asahi Kasei Microdevices
  • Si Monolithic
  • Latch & Uni-/Omnipolar versions available
  • Many variants
  • Suitable for automotive applications
Design-In Support

Hall Elements

Product Family/Product Supplier Key Features Additional Information
HW / HS series
  • InSb (Ultra Sensitivity?
  • Ultra-high sensitivity
  • Best suited to motor drivers, lift position detection, meters (gas, power, water)
HG/HZ series AKM - Asahi Kasei Microdevices
  • GaAs (Low Drift)
  • Excellent thermal characteristic
  • Linear output
  • Best suited to current sensors
Design-In Support
HQ series AKM - Asahi Kasei Microdevices
  • InAs (high sensitivity)
  • High sensitivity and low current consumption are achieved simultaneously
  • Excellent thermal characteristic
  • Suitable for battery-powered mobile equipment
Design-In Support
HW/HS series AKM - Asahi Kasei Microdevices
  • InSb (ultra sensitivity)
  • Ultra-high sensitivity
  • Best suited for motor drivers, lift position detection, meters (gas, power, water)
Design-In Support

Linear Hall Effect IC

Product Family/Product Supplier Key Features Additional Information
EQ-0321 AKM - Asahi Kasei Microdevices Programmable linear hall IC
  • Algorithm canceling hall sensor / magnet thermal characteristic
  • Enable to adjust output gain / neutral voltage via serial interface
  • Power down function (Stand-by current consumption Typ: 1nA)
  • Low current consumption
  • VDD: 2.7V to 5.5V
  • Small package: 10pinSON (2.9mm × 3.2mm × 0.6mm)
  • Operating temperature range: -30°C to +85°C
Design-In Support
EQ73x Series AKM - Asahi Kasei Microdevices
  • 3pin plastic package
  • 3,3V to 5,5V power supply
  • Fixed magnetic sensitivity (Gain) per device SIP
  • Analog output
  • Ultra quick response 1 μs
Design-In Support
EQ43x Series AKM - Asahi Kasei Microdevices
  • 3pin surface mount plastic package
  • 3,3V to 5,5V power supply
  • Fixed magnetic sensitivity (Gain) per device
  • Analog output
  • Quick response 3-4 μs
Design-In Support

Rotary Position Sensors Hall IC

Product Family/Product Supplier Key Features Additional Information
EM3242 AKM - Asahi Kasei Microdevices 10-bit angle sensor
  • Rotation angle sensor device with hall element inside
  • Contact-less angle sensor function can be realized by small magnet and EM-3242
  • Extremely small temperature drift
  • Small package
  • 3V single power supply
Data Sheet More Info Design-In Support
AK7405 AKM - Asahi Kasei Microdevices High speed 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: PWM / serial interface (3 line type)
  • 12-bit angle resolution
  • Less than ±0.95deg angle accuracy at 25°C
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, memory lock etc. via serial interface
More Info Design-In Support
AK7401 AKM - Asahi Kasei Microdevices 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: SPI (absolute angle), ABZ phase output (1024ppr incremental interface)
  • 12-bit angle resolution
  • Less than ±1.00deg angle accuracy at 25°C
  • Maximum tracking rate: 333rps (20,000rpm)
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, ABZ resolution/hysteresis etc. via serial interface
Data Sheet More Info Design-In Support
AK8776 AKM - Asahi Kasei Microdevices Onechip Encoder
  • 1.6V to 5.5V operation
  • Bop,Brp (vertical, horizontal) ±1.5mT(typical)
  • Low power operation : Average 90uA (typical)@VDD=3V
  • Two outputs: F(pulse count), D(direction of rotation)
  • Small package: SOP-4pin, halogen free
Data Sheet More Info Design-In Support
AK8775 AKM - Asahi Kasei Microdevices Onechip Encoder
  • 1.6V to 5.5V operation
  • Bop, Brp (vertical, horizontal) ±1.5mT (typical)
  • Low power operation : Average 90uA (typical)@VDD=3V
  • Two outputs: OUTA (detects vertical magnetic field), OUTB (detects horizontal magnetic field)
  • Small package: SOP-4pin, halogen free
Data Sheet More Info Design-In Support

Semiconductor Magnetoresistive Elements

Product Family/Product Supplier Key Features Additional Information
MS-P0XX Series (DIP Package) AKM - Asahi Kasei Microdevices
  • Pitch: m=0,4, m=0,8, with magnet holder
  • Features:
    • High resolution, low distortion on output V
    • Small distribution of magnetic character
    • Flat temperature dependency
    • Offset voltage
    • Output amplitude
Design-In Support
MS-00XX Series (SON Package) AKM - Asahi Kasei Microdevices
  • Pitch: m=0,2, m=0,4, m=0,8
  • Features:
    • High resolution, low distortion on output V
    • Small distribution of magnetic character
    • Flat temperature dependency
    • Offset voltage
    • Output amplitude
Design-In Support

Magnetic Sensors for Automotive

Current sensor Hall IC

Product Family/Product Supplier Key Features Additional Information
EG230L AKM - Asahi Kasei Microdevices Programmable linear hall IC
  • Analog ratiometric output
  • Wide ambient temperature range: Ta= -40°C to 125°C
  • Customer programmable sensitivity and offset
  • Quick response for magnetic field change (Typ. 2 μsec)
  • Single power supply voltage (from 4.75V to 5.25V )
  • SIP 3pin with the package thickness 1.2mm
  • Chip select function at EEPROM programming
  • EEPROM Programming through a modulation of the power supply voltage
More Info Design-In Support

Linear and angular position Hall IC

Product Family/Product Supplier Key Features Additional Information
AK7405 AKM - Asahi Kasei Microdevices High speed 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: PWM / serial interface (3 line type)
  • 12-bit angle resolution
  • Less than ±0.95deg angle accuracy at 25°C
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, memory lock etc. via serial interface
More Info Design-In Support
AK7401 AKM - Asahi Kasei Microdevices 12-bit angle sensor
  • Monolithic integrated 360 degrees angle sensor IC containing hall element
  • Easy to make a contactless rotation sensor with diametrically magnetized mono-pole magnet
  • Interfaces: SPI (absolute angle), ABZ phase output (1024ppr incremental interface)
  • 12-bit angle resolution
  • Less than ±1.00deg angle accuracy at 25°C
  • Maximum tracking rate: 333rps (20,000rpm)
  • Over voltage protection
  • Reverse connect protection
  • Various abnormal detection (memory data check, abnormal magnetic flux density range, and so on)
  • Setting function like zero point, rotation direction, ABZ resolution/hysteresis etc. via serial interface
Data Sheet More Info Design-In Support

One Chip Encoder Hall IC

Product Family/Product Supplier Key Features Additional Information
AK877XB Series AKM - Asahi Kasei Microdevices Pitch Free Single Chip Encoder IC
  • TS16949 and AEC-Q100 conformance
  • Single chip solution no more two hall effect latches needed
  • Pitch free : Works with any dimension and pole pitch of magnetic ring
  • Sensitivity (vertical, horizontal): ±1.7mT (typical)
  • Small package: SOP-6pin
  • Halogen free
Data Sheet More Info Design-In Support

Wheel speed sensors Hall IC

Product Family/Product Supplier Key Features Additional Information
AK7430 AKM - Asahi Kasei Microdevices
  • For indirect tire pressure monitoring system (iTPMS)
  • Differential hall IC
  • High sensitivity and low output jitter characteristics
  • Interface is the 2-wire current output type
Design-In Support

MAPX - High Integrated Audio Processor

MAPX - High Integrated Audio Processor

Product Family/Product Supplier Key Features Additional Information
Map-X series 8 Qualcomm
  • 3 DSP cores each running up to 432MHz delivering 1300 MIPS of processing power
  • Integrated RAM (up to 72Mbit)
  • Integrated 10/100 Mbps Ethernet MAC - IEE 802.3
  • Integrated USB 2.0 Host controller (MAC & PHY)
  • Integrated headphone amplifier
  • Up to 6 high quality 105dB (108dB) SNR ADCs
  • Up to 8 high quality 110dB SNR DACs
  • Multiple digital interfaces (inputs/outputs)
  • Wide range of software support
More Info Design-In Support

Medical Sensors

Noncontact Sensors, Hybrids and IC

Product Family/Product Supplier Key Features Additional Information
PS25401 Plessey Semiconductors EPIC PCB hybrid sensor, optimized for movement
  • Ultra high effective input resistance, typically 20GΩ
  • Effective input capacitance as low as 15pF
  • Upper 3dB point typically 10kHz
  • Operates with bipolar power supply from ±2.4V to ±4.0V
  • Sensors supplied in a custom package with exposed pins for surface mount assembly
Data Sheet Design-In Support
PS25251 Plessey Semiconductors EPIC PCB hybrid sensor, optimized for contact ECG
  • Ultra high input resistance, typically 20GΩ
  • Dry contact capacitive coupling
  • Input capacitance as low as 15pF
  • Lower 3dB point typically 200mHz
  • Upper 3dB point typically 10kHz
  • Operates with bipolar power supply from ±2.4V to ±5.5V
  • Sensors supplied in a custom package with exposed pins for surface mount assembly
Data Sheet Design-In Support
PS25201 Plessey Semiconductors EPIC PCB hybrid sensor, optimised for contact ECG
  • Ultra high input resistance, typically 20GΩ
  • Dry contact capacitive coupling
  • Input capacitance as low as 10 pF
  • Upper 3dB point typically 10kHz
  • Lower 3dB point typically 100mHz
  • Operates with single +4.75V to 8.0V supply
  • Sensors supplied as custom engineered probe assemblies complete with connecting lead and DIN plug termination
Data Sheet Design-In Support

OLED

OLED

Product Family/Product Supplier Key Features Additional Information
Passive Matrix OLED Truly Semiconductors
  • PMOLED
  • 0,67“ to 2.7“
  • Chip on glass
  • Monochrome
Design-In Support

Other Sensors

Electronic Compass

Product Family/Product Supplier Key Features Additional Information
AK09912 AKM - Asahi Kasei Microdevices 3-axis magnetometer on a silicon chip
  • Wide dynamic measurement range and high resolution with lower current consumption
    • Output data resolution: 16-bit (0.15 μT/LSB)
    • Measurement range: ± 4900μT
    • Average current at 100Hz repetition rate: 1mA (typ.)
  • Digital serial interface
    • I2C bus interface to control AK09912 functions and to read out the measured data by external CPU
    • A dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V
    • 4-wire SPI is also supported. A dedicated power supply for SPI can work in low-voltage apply as low as 1.65V
  • Device is worked by on-chip oscillator so no external clock source is necessary
  • Self test function with internal magnetic source to confirm magnetic sensor operation on end products
  • Built-in Noise Suppression Filter (NSF) keeps magnetic sensor output stable
  • Built-in temperature sensor to monitor the temperature while operation
Data Sheet More Info Design-In Support
AK09911 AKM - Asahi Kasei Microdevices

High sensitive 3-axis electronic compass IC

  • Wide dynamic measurement range and high resolution with lower current consumption.
    • Output data resolution: 14-bit (0.6 μT/LSB)
    • Measurement range: ± 4900 μT
    • Average current at 100Hz repetition rate: 2.4mA (typical)
  • Digital serial interface
    • I2C bus interface to control AK09911 functions and to read out the measured data by external CPU.
    • A dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V.
  • DRDY pin and register inform to system that measurement is end and set of data in registers are ready to be read.
  • Device is worked by on-chip oscillator so no external clock source is necessary.
  • Self test function with internal magnetic source to confirm magnetic sensor operation on end products.
Data Sheet More Info Design-In Support

IR Sensor & IC

Product Family/Product Supplier Key Features Additional Information
IR1011 AKM - Asahi Kasei Microdevices
  • Smallest mid-infrared quantum photo diode, made of InSb
  • Very small / thin package (2.65mm×1.9mm×0.4mm)
  • High sensitivities
  • Very fast response
  • No bias current required
Data Sheet More Info Design-In Support

Parallel & Serial Flash Memory

Parallel Flash Memory

Product Family/Product Supplier Key Features Additional Information
W29GL Family Winbond Electronics
  • 32Mb to 256Mb densities
  • Compatible with industry standard x29GL products
  • Automotive and industrial certified
  • 2.7V to 3.6V operation; also supports VIO at 1.8V
  • x8/x16 data bus configuration
  • 70/90ns read access time, 25ns page mode access time
  • Provides many sector protection mechanisms
  • Offers additional security of code/data
  • Wide range of package options
  • Special features
    • Drop-in replacement of industry standard x29GL
    • Saves 40% erase time and 60% program time
Design-In Support

Serial Spiflash Memory

Product Family/Product Supplier Key Features Additional Information
W25Q SpiFlash Family Winbond Electronics
  • 2Mbit to 512Mbit superset compatible with 25X
    • SPI, Dual-SPI, Quad-SPI and QPI (for many devices)
    • Uniform 4KB, 32KB & 64KB erase
    • Erase and Program Suspend/Resume
    • Quad Page Program
    • Security: Lock-down, ID#, OTP registers
    • Serial Flash Discoverable Parameters (SFDP)
  • Automotive and Industrial certified
  • High Performance
    • 104MHz Clock, 416MHz Quad-SPI (50MB/S)
    • Fast-boot or execute code (XIP) from SPI
  • Voltage & Package Options
    • 3V (2.7~3.6V), 2.5V (2.3~3.6V) and 1.8V (1.65~1.95V)
    • Space saving packages: 8-pin SOIC, WSON, VSOP, USON, WLCSP, 16-pin SOIC, 24-ball TFBGA
    • Known Good Die (KGD) wafers
Design-In Support
W25X SpiFlash Family Winbond Electronics
  • 512kbit to 4Mbit
  • Serial Peripheral Interface (SPI), Dual-SPI
  • Uniform 4kB, 32kB & 64kB erase
  • Automotive and industrial certified
Design-In Support

Passive LCD

Passive LCD

Product Family/Product Supplier Key Features Additional Information
Standard & Custom Displays JIYA Electronics
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD modules: COB, SMT, COG, COF, TAB and HS
  • Customer specific designs possible
Design-In Support
Custom & Standard Displays Truly Semiconductors
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD-modules: COB, SMT, COG, COF, TAB and HS
  • Customer specific designs possible
Design-In Support
Standard & Custom Display HT Display
  • Wide variety of panels:
    • TN
    • HTN
    • STN
    • FSTN
    • FFSTN
    • ISTN
  • LCD-modules: COB, SMT, COG, COF, TAB und HS
  • Customer specific designs possible
Design-In Support

NAND Flash Memory Solutions

NAND Flash Memory Cards

Product Family/Product Supplier Key Features Additional Information
SD & micro SD Cards - FX-8210/8035 Flexxon
  • Up to 64 GB capacity
  • Operation Temperature: -40 ~ +85° C
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling
    • Bad Block Management
    • SMART Function
    • Auto-Read Refresh
  • Supports SD 3.0
  • Supports SD SPI mode
  • Designed for read-only and read/write cards
  • CPRM (Content Protection for Recordable Media) of SD Card supported.
  • +4KV/-4KV ESD protection in contact pads

PREMIER Series - Industrial CFast Card Flexxon
  • Up to 128GB Capacity
  • Max Performance: Read: 520MB/s, Write: 190MB/s
  • Operating Temperature: -40 ~ +85°C
  • Advanced Flash Management: Static and Dynamic Wear Leveling, Bad Block Management, TRIM, SMART, Over-Provision
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning

SD & µSD Cards Flexxon
  • Up to 256 GB capacity
  • Operation Temperature: -40 ~ +85° C
  • Industrial Grade
    • Support Smart Info Tools
    • Support Auto-Read Refreshment
    • Support Unexpected Power
  • Supports SD 3.0
  • Supports SD SPI mode
  • Designed for read-only and read/write cards
  • CPRM (Content Protection for Recordable Media) of SD Card supported.
  • +4KV/-4KV ESD protection in contact pads

 

Design-In Support More Info

SSD

PATA SSD

Product Family/Product Supplier Key Features Additional Information
PATA Series Flexxon
  • Capacity: Up to 512GB
  • Operating temperature range: -40°C to 85°C
  • Max. performance:
    • Read: 120 MB/s
    • Write: 100 MB/s
  • Support data transfer up to Ultra DMA Mode 7, Multi-word DMA Mode 2, PIO Mode 4
  • Advanced flash management:
    • Static and dynamic wear leveling
    • Bad Block management
    • TRIM
    • SMART
    • Over-Provision
  • Advanced Device Security: secure erase, write protect
  • Power-saving implementation
  • Automatic error detection and retry capability
  • Support power down commands and idle modes
Design-In Support More Info

SATA SSD

Product Family/Product Supplier Key Features Additional Information
SATA Series Flexxon
  • Capacity: Up to 2TB
  • Temperature range.: -40°C to +85°C
  • Max. performance:
    • Read: 550 MB/s
    • Write: 530 MB/s
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling,
    • Bad Block Management, TRIM, SMART,
    • Over-Provision,
  • Ultimate performance & high density
  • End to End Data Path Protection
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low power management
  • Power loss protection
  • Advanced device security: secure erase, write protect
  • Adaptive Approach to performance tuning
Design-In Support More Info

Half Slim SATA III

Product Family/Product Supplier Key Features Additional Information
PREMIER Series - FX-S8 Half Slim SATA III Flexxon
  • Capacity: 8-256GB
  • Operating Temp: -40 ~ 85°C
  • Max. Performance:
    • Read: 525MB/s
    • Write: 390MB/s
  • High performance
  • Support high and special capacity
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling,
    • Bad Block Management
    • TRIM
    • SMART
    • Over-Provision
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning

mSATA / M.2

Product Family/Product Supplier Key Features Additional Information
ELITE Series - M.2 / mSATA III SSDs Flexxon
  • Max. Performance:
    • Read: 520MB/s
    • Write: 500MB/s
  • Operating Temperature: 0 ~ 70°C
  • Storage Temperature: -40 ~ +85°C
  • Capacity: 60-480GB
  • Ultimate performance & High Density
  • Quad-core CPU architecture
  • End to End Data Path Protection
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling
    • Bad Block Management
    • TRIM,
    • SMART
    • Over-Provision
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning

2,5" PATA SSD

Product Family/Product Supplier Key Features Additional Information
LEGACY Series - FX-P9 Flexxon
  • Capacity: 2-512GB
  • Operating Temp: -40 ~ 85°C
  • Max. Performance:
    • Read: 80MB/s
    • Write: 65MB/s
  • Support data transfer up to Ultra DMA Mode 7, Multi-word DMA Mode 2, PIO Mode 4
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling
    • Bad Block Management
    • TRIM
    • SMART
    • Over-Provision
  • Advanced Device Security: Secure Erase, Write Protect
  • Power-saving implementation
  • Automatic error detection and retry capability
  • Support power down commands and idle modes

2,5" SATA III

Product Family/Product Supplier Key Features Additional Information
ELITE Series - 2.5'' SATA III SSD Flexxon
  • Capacity: 120-960GB
  • Storage Temp.: -40 ~ 85°C
  • Operating Temp.: 0 ~ 70°C
  • Max. Performance:
    • Read: 550MB/s
    • Write: 530MB/s
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling,
    • Bad Block Management, TRIM, SMART,
    • Over-Provision,
  • Ultimate performance & High Density
  • End to End Data Path Protection
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning
SUPREME series - FX-S8 Flexxon
  • Capacity: 8GB- 1 TB
  • Operating Temp.: -40 ~ 85°C
  • Max. Performance:
    • Read: 520MB/s
    • Write: 490MB/s
  • High performance
  • Support high and special capacity
  • Advanced Flash Management:
    • Static and Dynamic Wear Leveling
    • Bad Block Management
    • TRIM
    • SMART
    • Over-Provision,
  • Backwards Compatible with SATA II (3Gb/s) and SATA I (1.5Gb/s)
  • Low Power Management
  • Power Loss Protection
  • Advanced Device Security: Secure Erase, Write Protect
  • Adaptive Approach to Performance Tuning

USB Flash Modules

Product Family/Product Supplier Key Features Additional Information
USB Flash Module Flexxon
  • Operating temperature range: -40°C to 85°C
  • Capacity: up to 256GB
  • Max. performance: read: 400MB/s, write: 300MB/s
  • Low power consumption
  • High speed USB2.0 and USB3.0 compliant
  • Advanced flash management:
  • ECC, Static and dynamic wear leveling
  • Bad Block management
  • Durable solid-state storage
Design-In Support More Info

eMMC

Product Family/Product Supplier Key Features Additional Information
eMMC Series Flexxon
  • Capacity: Up to 64GB
  • Temperature range.: -40°C to +85°C
  • Max. performance:
    • Read: 240 MB/s
    • Write: 120 MB/s
  • Grade:
    • Industrial (Gold & Diamond)
Design-In Support More Info

PCIe SSD

Product Family/Product Supplier Key Features Additional Information
PCIe Series Flexxon
  • Capacity: Up to 2TB
  • Temperature range.: -40°C to +85°C
  • Max. performance:
    • Read: 2500 MB/s
    • Write: 1200 MB/s
  • Grade:
    • Commercial & Industrial Silver
Design-In Support More Info

SD & microSD

Product Family/Product Supplier Key Features Additional Information
SD & microSD Flexxon
  • Interface: SD 3.0, SD 4.0
  • Speed Class: up to Class 10
  • UHS mode: UHS-I/II
  • Flash Type: SLC, MLC
  • Capacity: 128MB - 256GB
  • Max. Performance:
    • Read: 285 MB/s
    • Write: 100 MB/s
  • Grade: Industrial (Gold & Diamond), Commercial
Design-In Support More Info

USB

Product Family/Product Supplier Key Features Additional Information
USB Flexxon
  • Interface: USB 2.0 & USB 3.0
  • Form Factor: Flash Module, Pen Driver
  • Flash Type: SLC, MLC
  • Capacity: 256MB - 256GB
  • Max. Performance
    • Read: up to 400MB/s
    • Wrtite: up to 300MB/s
  • Grade: Industrial (Silver & Diamond), Commercial
Design-In Support More Info

Power Line Communication

Home Plug Green Phy PLC

Product Family/Product Supplier Key Features Additional Information
GV 7013-MOD Greenvity Communications
  • Module based on GV 7013 chip
  • Key features: see above
Data Sheet Design-In Support
GV 7013 Greenvity Communications
  • Single Chip HomePlug Green PHY PLC
    • HPGP is a compatible standard to HomePlug AV
    • On PLC achieving long distances in heavy concrete houses
    • True single chip solution for PLC to 802.15.4 radio
  • Optimized for Light controlling
    • No extra cables or additional RF needed
  • Applications
    • App controlled Light/Home automation (turn-key solution)
    • Metering In House Display (IHD)
    • Internet of Green Things
Data Sheet Design-In Support
GV 7011-MOD Greenvity Communications
  • Module based on GV 7011 chip
  • Key features: see above
Data Sheet Design-In Support
GV 7011 Greenvity Communications
  • The World’s First Single Chip with IEEE 802.15.4 wireless and HomePlug Green PHY PLC
    • HPGP is a compatible standard to HomePlug AV
    • On PLC achieving long distances in heavy concrete houses
    • True single chip solution for PLC to 802.15.4 radio
  • Optimized for Light controlling
    • No extra cables or additional RF needed
  • Applications
    • App controlled Light/Home automation (turn-key solution)
    • Metering In House Display (IHD)
    • Internet of Green Things
Data Sheet Design-In Support

RF-ICs

Mixer, PLL Synthesizer, VGA

Mixer, PLL, Synthesizer, VGA up to 8GHz

Product Family/Product Supplier Key Features Additional Information
AK1548 AKM - Asahi Kasei Microdevices
  • Operating frequency: 3GHz to 8GHz
  • Charge pump current: TBD typical, 8steps -The current range can be controlled by an external resistor
  • Fast lock mode: The programmable timer can switch two charge pump current setting
  • Supply voltage: 2.7V to 3.3V (PVDD, AVDD pins)
  • Charge pump power supply: Separately controlled, PVDD to 5.5V (CPVDD pin)
  • Phase noise: -226dBc/Hz
  • Current consumption: 15mA typical + Charge pump current
  • On-chip PLL Lock Detection: Selectable Phase Frequency Detector (PFD) Output or digital filtered - Lock detect
  • Package: 20pin QFN (0.5mm pitch, 4mm x 4mm x 0.75mm)
  • Operating temperature range: -40°C to 85 °C
Data Sheet More Info Design-In Support
AK1575 AKM - Asahi Kasei Microdevices General:
  • RF output frequency Range 690 MHz to 4,0 GHz
  • IF input frequency Range 20 MHz to 500 MHz
  • LO frequency Range 262,5 MHz to 4,4 GHz
  • Supply Voltage : 4,75 to 5,25 V (Mixer) 2,7 to 3,6 V / 4,75 to 5,25 V (Synthesizer /VCO)
  • Current Consumption: 150 mA (typ.)
  • Package: 32pin QFN (0,5 mm pitch, 5 mm x 5 mm x 0,85 mm)
  • Operating Temperature : -40°C ~ 85°C
Synthesizer/VCO:
  • Normalized Phase Noise -218 dBc/Hz
  • Phase Noise -111 dBc/Hz @100 kHz fo=2,1 GHz Mixer (frf=2 GHz)
  • Conversion Gain -1,5 dB typ.
  • Input 3rd orders intercept point +24 dBm typ.
  • Noise Figure 13 dB typ.
Data Sheet Design-In Support
AK1572 AKM - Asahi Kasei Microdevices General:
  • RF input frequency range 690MHz to 4.0GHz
  • IF output frequency range 20MHz to 500MHz
  • LO frequency range 262.5MHz to 4.4GHz
  • Supply voltage : 4.75V to 5.25 V (Mixer) 2.7V to 3.6 V / 4.75V to 5.25V (Synthesizer/VCO)
  • Current consumption: 150mA typical
  • Package: 32pin QFN (0.5 mm pitch, 5 mm x 5 mm x 0.85 mm)
  • Operating temperature range : -40°C to 85°C
Synthesizer/VCO:
  • Normalized phase noise -218 dBc/Hz
  • Phase noise -111 dBc/Hz @100 kHz fo=2.1 GHz Mixer (frf=2GHz)
  • Conversion gain -1.5dB typical
  • Input 3rd orders intercept point +23dBm typical
  • Noise figure 14dB typical
Data Sheet Design-In Support
AK1228 AKM - Asahi Kasei Microdevices
  • Input frequency: 10MHz to 2000MHz
  • Output frequency: 10MHz to 1000MHz
  • Operating supply current: 4.5mA to 10.5mA
  • Analog circuit characteristics: current consumption:10.5mA, IIP3:+12dBm, Gain:4dBm, NF: 8.5dB
  • LO input level: -10 to +5dBm
  • Operating supply voltage: 2.7V to 5.25V
  • Package: 16pin UQFN (0.5 mm pitch, 3 mm x 3 mm x 0.6 mm)
  • Operating temperature range: -40°C to 85°C
Data Sheet More Info Design-In Support

Remote Keyless entry

TPMS and Keyless Entry IC´s up to 435MHz

Product Family/Product Supplier Key Features Additional Information
AK3712 AKM - Asahi Kasei Microdevices
  • Maximum output power : +11dBm (typical)
  • Adjustable output power: from +7.5dBm to +11dBm (0.5dB step)
  • Output power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current : 16 mA (typical) (Maximum output power is set)
  • Low static current : 10nA (3V, RT)
  • Fast start-up time : 1.0 ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0V to 3.3 V
  • Small package: 10pin MSOP (3.1 mm × 3.1 mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3711 AKM - Asahi Kasei Microdevices
  • Maximum output power: +5dBm
  • Adjustable output power: from -2 to +5dBm (1dBstep)
  • Transmisson power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current: 10mA /9mA (300MHz/400MHz band) (3V, RT, maximum output power is set) Low static current : 10nA (3V, RT)
  • Fast start-up time : 1,0ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0 to 3.6V
  • Small package: 10pin MSOP (3.1mm × 3.1mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3701 AKM - Asahi Kasei Microdevices
  • Advanced direct conversion architecture (low power structure)
  • Excellent receiver sensitivity:
    • 118 dBm (BER=10-3, FSK, Deviation=+/-15 kHz, data rate=2.8 kbps) ,
    • 117 dBm (BER=10-3, ASK, data rate=2.8 kbps)
  • Self polling mode
  • Low current consumption: 9 mA (5 V, RT)
  • High ability to reject interference signal operating hopping channel and digital filter
  • Fast start-up time from power down mode
  • Supply voltage: 4.5 V ~ 5.5 V
  • Package: 28pin TSSOP (9.8 mm×4.5 mm×0.95 mm)
  • Compliant to AEC-Q100
More Info Design-In Support

Two way radio

IF Receiver for two radio

Product Family/Product Supplier Key Features Additional Information
AK2365A AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5 V
  • Wide operating temperature: Ta = -40°C to 85 °C
  • High sensitivity: -102 dBm at 12 dB SINAD
  • Built-in PGA and 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2MHz)
  • Built-in programmable AGC+BPF circuits corresponding to E to J type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 6mA
  • Compact plastic packaging: 32-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info
AK2364 AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5V
  • Wide operating temperature: Ta = -40°C to 85°C
  • Hi sensitivity: -104 dBm at 12 dB SINAD
  • Built-in 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2 MHz)
  • Built-in programmable AGC+BPF circuits corresponding to D to G type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 7mA
  • Compact plastic packaging, 28-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info

Single Board Computer (SBC)

Single Board Computer (SBC)

Product Family/Product Supplier Key Features Additional Information
Connect Core 6 SBC
  • Freescale i.MX6, up to 64 GB eMMC, 2 GB DDR3
  • Up to four Cortex-A9 cores up to 1.2 GHz (2.5 MIPS/MHz)
  • 802.11a/b/g/n + Bluetooth 4.0
  • Dual-diversity design, up to 150 Mbps data rate (MCS 7)
  • Development Board for Digi Connect Core 6 + production-ready SBC design
  • Designed for mass production
  • Standard Pico-ITX (100 mm x 72 mm) SBC / motherboard form factor
  • Standard interface availability
  • HDMI, Gigabit Ethernet, dual USB 2.0 Host, USB OTG, CAN header, dual-camera), multi-display LVDS/MIPI/parallel/HDMI), Micro SD card slot, PCI Express Mini Card slot, Micro SIM card slot, XBee socket,…..
ConnectCore 6 SBC Digi International
  • Compact, cost-effective off-the-shelf solution built
    on the ConnectCore 6 module - NXP i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express
  • Mini Card & Micro SIM, Video, Camera, XBEE Socket
  • Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
Data Sheet Design-In Support

TFT

Automotive

Product Family/Product Supplier Key Features Additional Information
Automotive TFT Truly Semiconductors
  • Size: 3,5" to 12.1"
  • Displays specifically designed for automotive applications
  • Multiple touch technologies available
  • Long-term availability guaranteed
  • Supply-chain certified by standard: ISO/TS 16949
Design-In Support

Industry

Product Family/Product Supplier Key Features Additional Information
Digital Signage Alpha Display
  • 32“to 98“ Signage Display up to UHD
  • Custom frame by request
  • HDBT long distance wirded connectivity up to 100m
  • PCAP, IR Touch Screen Available
  • Multi Vision Video Wall with daisy chain function
Design-In Support
Industry TFT Alpha Display
  • Size: 6" bis 65"
  • Casings: open frame chassis, panel mount, rack mount,...
  • On request: water & dust proof (IP65)
  • Wide viewing angle
  • Multiple touch technologies available
  • Long-term availability guaranteed
Design-In Support
Industry TFT Data Image
  • Size: 3,5" bis 21.5"
  • Casings: Open Frame Chassis, Panel Mount, Rack Mount,...
  • On Request: water & dust proof (IP65)
  • Wide Viewing Angle
  • Projected capacitive touch technologies available
  • Long-term availability guaranteed
Design-In Support

Wi-Fi

Intelligent Wi-Fi Modules (incl. Microcontoller)

Digi Connect Core Modules

Product Family/Product Supplier Key Features Additional Information
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454 MHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Running Linux or Android
  • Up To 256MB Flash and RAM
  • Single/dual 10/100 Mbit/s Ethernet
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature range
Data Sheet Design-In Support

Digi Connect Modules

Product Family/Product Supplier Key Features Additional Information
Digi Connect Wi-ME 9210~~~
  • 32-bit Digi NS9210 processor ARM926EJ-S @75 MHz
  • 802.11 b/g/n (2.4 GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8 MB Flash and 16 MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Temperature Range: Industrial: -40 °C ~ +85 °C
XBee Wi-Fi ~~~Modules
  • 802.11 b/g/n (2.4 GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host Interface: UART/SPI
  • Different Antenna Options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications with <6 ?A power-down current
  • Temperature Range: Industrial: -40 °C ~ +85 °C
Digi Connect ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 10/100Mbit Ethernet
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
XBee Wi-Fi Modules Digi International
  • 802.11 b/g/n (2.4GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host interface: UART/SPI
  • Different antenna options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications
  • Operating temperature range: Industrial: -40 °C ~ +85 °C
Data Sheet Design-In Support

PremierWave Modules

Product Family/Product Supplier Key Features Additional Information
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Wi-Port Modules

Product Family/Product Supplier Key Features Additional Information
Wi-Port Lantronix
  • Lantronix DSTni-EX 186 CPU
  • 802.11b/g
  • Host Interface UART (921kbps)
  • Full TCP/IP stack, web server and Windows deployment software
  • 1 x U.FL connector
  • Lantronix SmartRoam technology provides seamless mobile connectivity and improved reliability
  • Temperature Range -40°C to +70°C
  • Ethernet-WLAN Bridging possible
  • Bulletproof wireless security with IEEE 802.11i-PSK, WPA-PSK, TKIP
Data Sheet Design-In Support

Blue Creation Modules

Product Family/Product Supplier Key Features Additional Information
BC188 Blue Creation
  • Highly flexible, low power, small form factor, self contained
  • Preloaded with BlueCreation Melody-Wi-Fi software
  • Quickly and cost effectively integration
  • Ultra Low Power modes
  • 512KB SRam, 320KB ROM, 8Mbit Flash
  • Antenna Diversity
  • Size: 22 x 15.5 x 1.5 mm
Data Sheet Design-In Support

XPico Modules

Product Family/Product Supplier Key Features Additional Information
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support

Wi-Fi Frontend Modules

Wi-Fi - PCIe Frontend Modules

Product Family/Product Supplier Key Features Additional Information
WPEQ-256ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm Atheros QCA9892-BR4B
  • Antenna: 2 x U.FL connectors, 2T2R
  • Data rate up to 867Mbps
  • Industrial-Grade Temperature: -40 ~ 85°C
  • Support Linux
Data Sheet Design-In Support
WPEQ-353ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm QCA9890-BR4B
    • Antenna: 3 x U.FL connectors, 3T3R
    • Data rate up to 1.3Gbps
    • Industrial-Grade Temperature: -40 ~ 85°C
    • Support Linux
Data Sheet Design-In Support
WPEA-350GNH SparkLAN
  • 802.11b/g/n high power
  • Mini Card
  • Qualcomm Atheros AR9590-AR1A
  • 3T3R
Data Sheet Design-In Support
WPEA-128N SparkLAN
  • 802.11a/b/g/n
  • Half Mini Card
  • Qualcomm Atheros AR9380-AL1A
  • 3T3R
Data Sheet Design-In Support
WPER-172GN SparkLAN
  • 802.11b/g/n USB
  • Half Mini Card
  • MediaTek (Ralink) RT5390U
  • 1T2R
  • USB-Interface on Mini-PCIe Edge-Connector
Data Sheet Design-In Support
WPEA-251N(BT) SparkLAN
  • 802.11a/b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR9462
  • 2T2R
Data Sheet Design-In Support
WPEA-152GN(BT) SparkLAN
  • 802.11b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR3012 + AR9485
  • 1T1R
Data Sheet Design-In Support
WPEA-127NI SparkLAN
  • 802.11a/b/g/n
  • Mini Card
  • Qualcomm Atheros AR9390-AL1B
  • 3T3R
  • Industrial temperature range: -40°C to 80°C
Data Sheet Design-In Support
WPEA-127N SparkLAN
  • 802.11a/b/g/n
  • Mini Card
  • Qualcomm Atheros AR9380-AL1A
  • 3T3R
Data Sheet Design-In Support
WPEA-121N SparkLAN
  • 802.11a/b/g/n
  • Half Mini Card
  • Qualcomm Atheros AR9382
  • 2T2R
Data Sheet Design-In Support
WPEA-252NI SparkLAN
  • 802.11a/b/g/n
  • Mini Card
  • Qualcomm Atheros AR9592-AR1B
  • 2T2R
  • Industrial temperature range: -40°C to 85°C
Data Sheet Design-In Support
WPER-176AC SparkLAN
  • 802.11ac/a/n
  • Mini Card
  • MediaTek MT7610E
  • 1T1R
Data Sheet Design-In Support
WPEA-351AC SparkLAN
  • 802.11ac/a/n
  • Mini Card
  • Qualcomm Atheros QCA9880
  • 3T3R
Data Sheet Design-In Support
WPET-232ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Realtek RTL8812AE
  • 2T2R
Data Sheet Design-In Support
WPEA-352ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Qualcomm Atheros QCA9880-BR4A
  • 3T3R
Data Sheet Design-In Support

Wi-Fi - SDIO Frontend Modules

Product Family/Product Supplier Key Features Additional Information
WSDA-157GN SparkLAN
  • 802.11n SDIO module
  • Qualcomm Atheros AR6003
  • 1T1R
  • U.FL or printed antenna
Data Sheet Design-In Support

Wi-Fi - USB Frontend Modules

Product Family/Product Supplier Key Features Additional Information
WUBR-508N Module Series / Dongle SparkLAN
  • 802.11a/b/g/n USB Module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-Pin, or 4-Pin Wafer connector)
  • Dongle version available
WUBR-508N SparkLAN
  • 802.11a/b/g/n USB module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-pin, or 4-pin wafer connector)
  • Dongle version available
Data Sheet Design-In Support
WUBA-171GN SparkLAN
  • 802.11b/g/n High-Power USB module
  • Atheros AR9271
  • 1T1R (5-pin pin-header)
  • Industrial temperature range: -30°C to 75°C
Data Sheet Design-In Support
WUBM-273ACN SparkLAN
  • 802.11ac/b/g/n USB module
  • MediaTek MT7612U
  • 2T2R
Data Sheet Design-In Support
WUBR-175ACN SparkLAN
  • 802.11ac/b/g/n USB module
  • MediaTek MT7610U
  • 1T1R
Data Sheet Design-In Support

Wi-Fi Gateways and Routers

ZigBee to Wi-Fi Gateways

Product Family/Product Supplier Key Features Additional Information
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support

Wi-Fi ICs

Wi-Fi IoT Modules

Product Family/Product Supplier Key Features Additional Information
WSDQ-103GNI SparkLAN 802.11b/g/n Industrial-Grade IOT Module, Qualcomm Atheros QCA4010 , 1T1R
  • Standard: 802.11b/g/n
  • Host interface: UART, SPI/SDIO, I2C/I2S, USB, ADC
  • Chipset: Qualcomm Atheros QCA4010
  • Antenna: PCB Printed ANT, 1T1R
Data Sheet Design-In Support
SX-ULPGN Silex Technology
  • IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)
  • Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 Radio
  • Single Stream System (1x1), 20 MHz
  • Integrated RF front end and PCB trace antenna
  • Hostless IoT application development platform with large internal memory
  • UART AT command set for optional external MCU host
  • AllJoyn support
  • Wi-Fi Protected Setup Support
  • IPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host Controller
  • Ideal for cost effective Internet of Things (IoT) Applications
Design-In Support Data Sheet

Wi-Fi ICs

Product Family/Product Supplier Key Features Additional Information
QCA4531 Qualcomm
  • 650 MHz MIPS 24Kc CPU
  • Externer Speicherunterstützung für bis zu
    64 MB/128 MB DDR2 RAM
  • 128 MB SPI NOR Flash
  • 1 GB SPI NAND Flash
  • 2x2 11n Wi-Fi 2.4GHz Tx/Rx Antennenempfang
  • Große Auswahl an Peripheriegeräten SPI, GPIO, UART,
    Ethernet USB 2.0 Host, PCIe RC
  • Open Source Software QSDK, OpenWRT
  • Unterstützt AllJoyn®, HomeKit®, Weave
Data Sheet Design-In Support
QCA4012 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet
QCA4010 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet

Wi-Fi/ Bluetooth Combos Solution

Wi-Fi / BT Combo ICs

Product Family/Product Supplier Key Features Additional Information
WNFQ-255ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • Host interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Qualcomm Atheros QCA6174
    • Antenna: 2 x IPEX MHF4 connector, 2T2R
    • Concurrent Wi-Fi and BT co-existence
    • Data rate up to 867Mbps (MCS9)
    • Support Win7/Win8.1
Data Sheet Design-In Support
WNFQ-158ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • M.2 (PCIe: WLAN; USB2.0: Bluetooth)
  • Qualcomm Atheros QCA9377
    • Antenna: 2 x IPEX MHF4 connector, 1T1R with RX diversity
    • Concurrent Wi-Fi and BT co-existence
    • 802.11ac 2.0 with MU-MIMO
    • Data rate up to 433Mbps
    • Support Windows
Data Sheet Design-In Support
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

ZigBee

Home Plug Green Phy to Zigbee bridge

HPGP and ZigBee with SPI and Ethernet

Product Family/Product Supplier Key Features Additional Information
GV 7013-MOD Greenvity Communications
  • Module based on GV 7013 chip
  • Key features: see above
Data Sheet Design-In Support
GV 7013 Greenvity Communications
  • Single Chip HomePlug Green PHY PLC
    • HPGP is a compatible standard to HomePlug AV
    • On PLC achieving long distances in heavy concrete houses
    • True single chip solution for PLC to 802.15.4 radio
  • Optimized for Light controlling
    • No extra cables or additional RF needed
  • Applications
    • App controlled Light/Home automation (turn-key solution)
    • Metering In House Display (IHD)
    • Internet of Green Things
Data Sheet Design-In Support
GV 7011-MOD Greenvity Communications
  • Module based on GV 7011 chip
  • Key features: see above
Data Sheet Design-In Support
GV 7011 Greenvity Communications
  • The World’s First Single Chip with IEEE 802.15.4 wireless and HomePlug Green PHY PLC
    • HPGP is a compatible standard to HomePlug AV
    • On PLC achieving long distances in heavy concrete houses
    • True single chip solution for PLC to 802.15.4 radio
  • Optimized for Light controlling
    • No extra cables or additional RF needed
  • Applications
    • App controlled Light/Home automation (turn-key solution)
    • Metering In House Display (IHD)
    • Internet of Green Things
Data Sheet Design-In Support

ZigBee Embedded Modules

XBee ZigBee Modules

Product Family/Product Supplier Key Features Additional Information
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Family/Product Supplier Key Features Additional Information
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support