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Technologie: Wireless Connectivity

Wi-Fi Bluetooth Kombi Module

XBee Cellular

XBee Cellular Modems

Product Supplier Key Features
Digi XBee Cellular 3G Digi International
  • FCC/IC, PTCRB, and AT&T certified – eliminates certification
    costs and risks
  • Transparent and API modes simplify software integration
  • Low-power modes for battery powered applications
  • Integrated MicroPython programmability enables custom scripting directly on the modem
  • Enhanced with Digi TrustFence® security framework
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support

802.15.4, 868MHz, Mesh technologies, ZigBee

BT Mesh

Product Supplier Key Features
CSR Mesh Qualcomm
  • Simple direct control & config from a Smartphone to a device from anywhere in the network
  • No access hubs, routers or other devices
  • No single point of failure
  • Proven BT Smart Technology
    • Co-exists well with WiFi
    • Neither interfere with each other
  • Secure and robust
  • Protected against eavesdroppers and man-in-middle attacks
  • Three carrier channels
  • Extends the reach of BT Smart beyond 1 radio link
  • Flood mesh algorithm
  • CSR Mesh will extend beyond lighting
  • Home/ building/ industrial automation, proximity, asset tracking coming in future releases
Design-In Support

XBee 802.15.4 Modules

Product Supplier Key Features
XBee 802.15.4 Digi International
  • 4 different antenna options (wire, PCB, U.fl, RPSMA)
  • 2,4GHz for worldwide employment
  • 900MHz for longe range deployment
  • Low power sleep mode
  • Industrial temperature range (-40°C to +85°C)
Data Sheet Design-In Support
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

XBee Digi Mesh Modules

Product Supplier Key Features
XBee Digi Mesh Digi International
  • 2,4GHz for worldwide employment
  • Multiple antenna options
  • Simple deployment and growth
  • Outdoor line-of-sight range up to 1 mile
  • Digi Mesh peer-to-peer mesh networking protocol
  • Self-healing and discovery for network stability
  • Sleeping router supported for longer battery life
  • No configuration needed for out-of-box RF communications
  • Ready to be used with ConnectPort X gateways
Data Sheet Design-In Support

ZigBee Embedded Modules

Product Supplier Key Features
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

XBee Cellular

Product Supplier Key Features
Digi XBee Cellular 3G Digi International
  • FCC/IC, PTCRB, and AT&T certified – eliminates certification
    costs and risks
  • Transparent and API modes simplify software integration
  • Low-power modes for battery powered applications
  • Integrated MicroPython programmability enables custom scripting directly on the modem
  • Enhanced with Digi TrustFence® security framework
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support

Antenna solutions

Antennas for Cellular and LTE

Product Supplier Key Features
flexiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
flexiiANT Antenova

• 824-960MHz / 1710-2170MHz
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 680 - 2700 Mhz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• GSM850 / 900 / 1800 / 1900/ WCDMA
• M2M and IoT requirements

Design-In Support Data Sheet

Antennas for Bluetooth, Wi-Fi, ZigBee

Product Supplier Key Features
flexiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• FPC + Cable + Connector
• Self-Adhesive mounted
• IPEX MHF connector

Design-In Support Data Sheet
lamiiANT Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• SMD mounting
• FR4 materials

Design-In Support Data Sheet
gigaNOVA Antenova

• 2.4-2.5 GHz / 4.9-5.9 GHz Frequencies
• Swivel/SMD mounting
• M2M and IoT requirements

Design-In Support Data Sheet
ceriiANT Antenova

• 2.4-2.5 GHz
• Extremely compact antennas
• Highly efficient
• SMD mounting

Design-In Support Data Sheet

Antennas for GNSS: GPS, GLONASS, Beidou, Galileo

Product Supplier Key Features
Zenon Antenova
  • REFLECTOR Technology
  • Antenna for 2.4GHz applications
  • Bluetooth, Wi-Fi, ZigBee, ISM
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Robusta Antenova
  • REFLECTOR Technology
  • Antenna for GNSS applications
  • GPS, GLONASS, Beidou and Galileo
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Latona Antenova
  • Antenna for LP-WAN applications. Including NB-IOT, LoRa, SigFox, ISM and Weightless-P
  • Frequency bands from 791- 960MHz
  • Maintains high performance on device: DFI (Designed for Integration)
  • Corner placement to save space
  • Low profile innovative design
  • Supplied on Tape and Reel
  • Automotive temperature rating.
Data Sheet Design-In Support
Grandis Antenova
  • Antenna for ISM 868 and 915 MHz applications including LoRa, SigFox, and
    Weightless-P
  • Frequency bands from 863 - 928MHz
  • Maintains high performance on device: DFI (Designed for Integration)
  • Corner placement to save space
  • Low profile innovative design
  • SMD mounting
  • Supplied in Tape and Reel
  • Automotive temperature rating
Data Sheet Design-In Support

Antennas for Wireless M2M

Product Supplier Key Features
Zenon Antenova
  • REFLECTOR Technology
  • Antenna for 2.4GHz applications
  • Bluetooth, Wi-Fi, ZigBee, ISM
  • Maintains high performance within device: DFI (Designed For Integration)
  • 1.13mm diameter RF cable with IPEX MHF connector
  • Self-Adhesive mounted
  • Quick integration minimizes design cycle
  • High performance
  • Available in 2 standard cable lengths
Data Sheet Design-In Support
Antennas Antenova
  • Antennas for a wide range of uses:
    • Bluetooth
    • WiFi
    • ZigBee
    • GNSS
    • Cellular
  • Various Frequencies and Dimension
  • Please refer to PDF for more information

Bluetooth Smart

Bluetooth Smart ICs

BT Smart ICs

Product Supplier Key Features
CSR102x Platform Qualcomm
  • Bluetooth 4.1 low energy radio with direct single-ended 50Ω antenna connection
  • 16-bit microprocessor with 80Kbytes RAM
  • 256 KB Internal Flash memory (some package variants)
  • 64 KB One-time Programmable (OTP) memory
  • Hardware G.722 CODEC
  • Multiple links (up to 4)
  • Integrated Bluetooth 4.2 qualified stack* (*Qualification pending)
  • I2S and I2C interfaces
  • Multiple links (up to 4)
  • SPI interface for external flash memory
Design-In Support More Info
CSR101x Platform Qualcomm
  • On-Chip Application
    • 16MHz 16bit Apps processor
    • Full stack and 50kB application on chip
  • Advanced Power Management
    • Direct battery connection
    • 900nA standby, 16mA peak
  • Powerful Software Development Kit
    • SDK includes many example applications, profiles and services
  • Low Cost PCB
    • Single or double sided
    • 50Ohm direct antenna connection
  • Optimized Peripherals
    • Direct serial interfaces
  • External SPI Flash or EEPROM
  • Up to 32 GPIOs
More Info Design-In Support Solution

Bluetooth Smart Modules

BT Smart Modules

Product Supplier Key Features
BC118
  • Features: iBeacon, Mesh or Custom functionality
  • Low power consumption
  • Up to 50m range
  • Transparent and command mode
  • Over the Air Secure firmware upgrade
  • UART, I2C, analog and GPIO interfaces
  • Certification: Bluetooth, FCC, CE and IC
  • Cable replacement: secure reliable data transfer
  • Can run as standalone or controlled by a host
  • Commands can be sent by App to control BC118
  • Transparent mode for I2C and UART
  • iBeacon or proximity for Android
  • Audio over BLE ready
Data Sheet More Info Design-In Support
BTM101 Flairmicro
  • Antenna included
  • External antenna option
  • Easy integration
    • Software support by Atlantik Elektronik
    • Use of development kits
  • High data rate (module to module) of 160kBit/s
  • CSR1010 based
    • +7.5dBm Tx power, -92.5dBm sensitivity
    • Support of BLE profiles ATT, GATT, SMP, L2CAP, GAP
  • QDL/EP – Qualified Design Listing
  • Interfaces
    • UART host interface
    • Debug SPI host interface
    • 10bits ADC
    • 12 digital PIOs
    • 3 analog AIOs
Design-In Support Solution

Bluetooth Smart Software and APPs

Product Supplier Key Features
Software and APPs Qualcomm
  • Atlantik Standard Software
  • Atlantik Lighting Software
  • Atlantik Customized Software
  • Atlantik Apps
  • CSR Mesh
Design-In Support More Info

Bluetooth Smart Ready

Bluetooth Audio ICs

BT Automotive ICs

Product Supplier Key Features
CSR8350 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • 80MIPS DSP
  • On-Chip SBC Encoder/ decoder
  • aptX decoder
  • Dual Mic CVC
  • A2DP decode
  • 2 ADCs
  • Dual I2S/ PCM interface
  • UART and USB
  • BGA
Design-In Support

BT ROM Stereo ICs

Product Supplier Key Features
CSR8635 Qualcomm
  • BT4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (Stereo Line-In)
  • iOS battery status monitor
  • Advanced multi-point (2xHFP, 2x A2DP)
  • 6th generation 1-mic CVC
  • Targeted for Mid-Tier 2-mic stereo headsets
Design-In Support
CSR8630 Qualcomm
  • BT4.0
  • A2DP1.2 and AVRCP1.4
  • Wired audio (Stereo Line-In)
  • Advanced multi-point (2x A2DP)
  • Targeted for entry stereo music speaker
Design-In Support
CSR8645 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired Audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • aptX Codec for high-quality audio
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
Design-In Support
CSR8640 Qualcomm
  • BT 4.0
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • HD voice
  • Wired audio (USB and analog)
  • ACC-LC, MP3 and SBC decoders
  • iOS battery status monitor
  • 6th generation dual mic CVC
  • Targeted for stereo headsets and speakers
  • Pin compatible with CSR8645
Design-In Support

BT Flash ICs

Product Supplier Key Features
CSR8675 Qualcomm
  • BT4.1
  • 16Mb eFlash and up to 64Mb external serial flash
  • 120 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 2 x I2S interface
  • 16 GPIOs
  • USB 3.3V regulator
  • BGA, pin compatible with CSR8670
Design-In Support
CSR8670 Qualcomm
  • BT 4.0
  • 16Mb eFlash and up to 64Mb external serial flash
  • 80 MIPs DSP performance
  • Integrated high performance stereo DAC & ADCs
  • 1 x I2S interface
  • 14 GPIOs
  • USB 3.3V regulator
  • BGA and WL-CSP
Design-In Support

BT ROM Mono ICs

Product Supplier Key Features
CSR8615 Qualcomm
  • BT4.0
  • 1-mic mono
  • HFP1.6, A2DP1.2 and AVRCP1.4
  • Wired Audio (Stereo Line-in)
  • HD Voice
  • Advanced Multi-point (2xHFP, 2xA2DP)
  • iOS battery status monitor
  • 6th generation CVC
  • For Mid-Tier 1-mic mono headsets, mono speakers/ speakerphones
Design-In Support
CSR8605 Qualcomm
  • BT 4.0
  • Mono A2DP sink
  • A2DP1.2 and AVRCP1.0
  • Wired audio (Mono Line-in)
  • Best suited for entry-level mono Music speakers
Design-In Support

Bluetooth Audio Stacks

Product Supplier Key Features
Melody
  • Support for both Bluetooth 4.0 as well as multiple classic Bluetooth profiles.
    • Supported profiles: HFP, A2DP1.2, AVRCP1.4, PBAP, SPP1.0, IAP
  • Compatibility with 90% of Bluetooth modules
  • Can be controlled over the air via UART or GPIO interfaces
  • Connection to all mobile platforms: Android, iOS, Windows Mobile and Blackberry
  • Melody supports aptX, AAC, SBC and MP3
  • Small memory footprint: 8Mbits
  • Highly flexible and customizable to your demands
Design-In Support
wSync Flairmicro
  • Support of BT 4.0 & BT 2.1+EDR
  • Profiles: HFP (HF/AG), AVRCP, A2DP, DUN, OPP, SPP, MAP, PBAP, PAN
  • Phonebook download via AT commands or OPP
  • Full-duplex voice calls, built-in AEC and noise suppression functions
  • Runs on different hardware platforms with various CPU architectures such as ARM/MIPS
  • UART data transfer interface and simple schematics
  • Works best with Flairmicro HCI modules
Design-In Support

Bluetooth Connectivity ICs

BT Connectivity Automotive ICs

Product Supplier Key Features
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support

BT Connectivity Flash ICs

Product Supplier Key Features
CSRB5348 (BC8-Ext) Qualcomm
  • BT4.1
    • Dual-Mode Bluetooth and Bluetooth Smart
  • Low Power
    • Deep Sleep 80µA
  • On Chip Application
    • With external quad-SPI flash interface
    • xIDE based SDK
  • Extensive Array of Input/ Outputs
    • Fully configurable
    • Direct HID streaming to minimize latency
  • Low eBOM
  • Optional charging support
Design-In Support

BT Connectivity ROM ICs

Product Supplier Key Features
CSR8311 Qualcomm
  • BT4.0 HCI ROM
  • Supports BT3.0+HS architecture
  • Bluetooth Wideband Speech
  • UART and USB
  • QFN
Design-In Support
CSR8510 Qualcomm
  • BT4.0 HCI ROM
  • USB
  • CSP
Design-In Support
CSR8811 Qualcomm
  • BT 4.0 HCI ROM
  • UART
  • CSP, QFN
Design-In Support

Bluetooth Connectivity Modules

BT Connect Core Modules

Product Supplier Key Features
ConnectCard Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40 to 85°C operating temperature
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

BT Connectivity Modules

Product Supplier Key Features
BTM808 Flairmicro
  • Bluetooth 4.0 module
  • Based on AEC-Q100 CSR8311
  • HCI / High speed UART and USB interface
  • PCM/I2S digital audio interface
  • EEPROM
  • 20.0 x 14.4 x 2.3mm
BTM403 Flairmicro
  • Bluetooth v2.1+EDR, Class 1&2 module
  • HCI / UART interface
  • SPP Master & Slave support
  • Easy-to-use AT command interface
  • 35.3 × 14.0 × 2.5mm
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Bluetooth Connectivity Stacks

Product Supplier Key Features
MiniStack
  • Support of Dual Mode BT
  • Fully Bluetooth qualified –no further re-test required
  • Small footprint (as low as 26k flash and 3k RAM)
  • Ported on Atmel, STM32, Microchip and TI processors
  • Simple API with example source code application
  • Support of:
    • HID, HFP-AG, HFP-HF, A2DP, AVRCP, SPP
    • IAP/ IAP2 profiles
    • All BLE profiles
    • Multiple connections
  • Available in Windows7 and Linux evaluation form
More Info Design-In Support

Bluetooth/ Wi-Fi Combos

BT/ Wi-Fi Combo ICs

Product Supplier Key Features
BX Serie Sierra Wireless   • Wi-Fi 802.11 b/g/n at 2.4GHz, 1x1 SISO
• Dual-mode simultaneous Bluetooth Low Energy 4.2 and Classic Bluetooth with backwards compatibility
• Hostless module with regulatory certifications and integrated antenna (BX3105) for easy integration (BX3100 has connection for an external antenna)
• Embedded TCP/IP and Bluetooth Stacks with simple UART interface
• Supports multiple connections to external Codecs with UART, I2S, I2C, and SPI interfaces
• Secure boot and value-add firmware with FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep the connectivity optimized and secure
• Future-proof common flexible form factor (CF3®) enables the flexibility and scalability in designs, even across cellular technologies
Design-In Support Design-In Support Data Sheet
QCA9377 Qualcomm
  • 1x1 802.11ac + Bluetooth 4.2 in a single SoC
  • Supports Bluetooth 4.2 + HS, Bluetooth lowenergy and is backward compatible withBluetooth 1.x and 2.x
  • Single regulated 3.3V supply operation
  • Integrated RF Front End, single ended design
  • Offloading for minimal host utilization
  • Low-density parity check (LDPC)encoding/decoding
  • STBC, MU-MIMO, Transmit Beam-forming
  • 1.5KB OTP to eliminate an external flash
  • 256-QAM in 2.4GHz
  • Enhanced Coexistence Bluetooth and LTE;concurrent operation
  • PCB friendly: WLP to go on 4-L FR4non-HDI PCB
  • Provides a 48MHz reference clock
  • 1216KB RAM and 448KB ROM for Wi-Fi
  • 192KB RAM and 672KB ROM for Bluetooth
Design-In Support Data Sheet
WUBQ-159ACN(BT) SparkLAN
  • Qualcomm Atheros QCA9377-7
    ● Antenna: PCB Printed Antenna or 1xU.FL connector, 1
    ● Data Rates: allows link speeds up to 433Mbps
    ● Support Win7/8.1/10
Data Sheet Design-In Support
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

Wi-Fi/ BT Combo Modules

Product Supplier Key Features
WNFQ-255ACN(BT) SparkLAN
  • Standard: 802.11ac/b/g/n
  • Interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Chipset: Qualcomm Atheros QCA6174
  • Antenna: 2 x IPEX MHF4 connector, 2T2R
  • Concurrent Wi-Fi and BT co-existence
  • Data rate up to 867Mbps (MCS9)
  • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
  • Support Win7/Win8.1
Data Sheet Design-In Support

Bluetooth Audio Modules

BT Audio Modules

Product Supplier Key Features
BTM501 Flairmicro
  • Bluetooth v2.1+EDR, Class 2 module
  • Embedded Bluetooth Protocol Stack
  • Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc.
  • UART and USB programming and data IF
  • Microphone / speaker interface
  • Supports aptX
  • 23.24 mm x 11,94 mm x 2.00 mm
Design-In Support
BTM809 Flairmicro
  • Bluetooth 4.0 module
  • Based on CSR8670
  • HCI / High speed UART and USB interface
  • PCM/I2S/SPDIF digital audio interface
  • EEPROM
  • 20.8 x 11.8 x 2.7 mm
Design-In Support Data Sheet
BTM805 Flairmicro
  • Bluetooth 4.0 module
  • HCI / High speed UART interface
  • PCM/I2S digital audio interface
  • Optional antenna
  • 12 x 7 x 1.5mm / 7 x 7 x 1.5mm
Design-In Support

Connect Core Modules

Product Supplier Key Features
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454MHz
  • 802.11a/b/g/n
  • Bluetooth 4.0 (Bluetooth 2.1+EDR, Bluetooth 3.0+HS802.11 AMP, Bluetooth Low Energy)
  • Single/dual 10/100 Mbit/s Ethernet
  • UART, USB, CAN, SPI, I2C, I2S, ADC, GPIO
  • Optional LCD/JTAG connector
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature
Data Sheet Design-In Support

Cellular

LTE/GSM/GPRS/UMTS/HSPA Modems

GSM/GPRS

Product Supplier Key Features
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band
M95 Quectel
  • 42-pin LCC
  • 19.9 x 23.6 x 2.65 mm
  • Quad-band
  • 3G migration
More Info Data Sheet Design-In Support
M66 Quectel
  • 44-pin LCC
  • 17.7 × 15.8 × 2.3 mm
  • Quad-band
More Info Data Sheet Design-In Support

UMTS/HSPA

Product Supplier Key Features
UG96 Quectel
  • Penta-band UMTS/HSPA
  • compatibility with Quectel UG95 & M95
  • 7.2Mbps DL / 5.76Mbps UL
  • 22.5 × 26.5 × 2.2mm
Data Sheet Design-In Support
UC20 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC20 Quectel
  • 112-pin LCC
  • 32.0 x 29.0 x 2.5 mm
  • 14.4M DL / 5.76M UL
  • -E/ -A / -G
  • UMTS / HSPA+
  • GPS/GNSS
  • M10 upgrade (ext.)
Data Sheet Design-In Support
UC15 Mini PCIe Quectel
  • 52-pin miniPCI
  • 51.0 x 30.0 x 4.9 mm
  • -E/ -A / -G
  • LTE Cat3 +
  • GPS/GLONASS
Data Sheet Design-In Support
UC15 Quectel
  • 108-pin LCC
  • 29.0 x 29.0 x 2.5 mm
  • 3.6M DL / 384K UL
  • -E/ -A
  • UMTS / HSDPA
  • M10 upgrade
More Info Data Sheet Design-In Support
UG95 Quectel
  • 102-pin LGC
  • 23.6 x 19.9 x 2.2 mm
  • 7.2M DL / 5.76M UL
  • -E/ -A
  • UMTS / HSPA
  • M95 upgrade
More Info Data Sheet Design-In Support

LTE/UMTS/HSPA

Product Supplier Key Features
EG06 Quectel
  • Compact-sized multi-band NB-IoT module
  • Ultra-low power consumption
  • Super high sensitivity
  • LCC package makes it easy for large volume manufacturing
  • Compatible with Quectel GSM/GPRS module, easy for future
    upgrading
  • Embedded with abundant Internet service protocols
  • Fast time-to-market: Reference designs, evaluation tools and timely technical support
    minimize design-in time and development efforts
Design-In Support Data Sheet

Router-, Gateway-Solutions

ConnectPort X family

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support

Industrial Router

Product Supplier Key Features
LR54 Digi International
  • Cat 6 LTE-Advanced speed (300Mbps)
  • Dual 2.4 and 5GHz radios, with 802.11ac
  • Global LTE network support: Offers software selectable 3G/4G LTE
  • Patented SureLink™ connection
  • PCI-certified Digi Remote Manager®, IPsec VPN firewall, and 256-bit AES encryption as well as the new Digi TrustFence™ Device Security Framework
  • Operate between -20°C to +70° C
  • Remote device management
Design-In Support Data Sheet
WR 44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing / IP30
WR 44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
WR 41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Automatically switches between WiFi and Cellular connection
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n WiFi access point
  • Dual SIM
  • Industrial temp.-range
  • Digi Device Cloud ready
  • Metal housing
WR 11 family Digi International
  • 1 x Ethernet port
  • Cellular 2.5G/3G/4G
  • Dual SIM
  • Plastic housing
  • Digi Device Cloud ready
WR31 Digi International
  • 2 x Ethernet port
  • 1 x RS232/422/486 port
  • Din-Rail mounting
  • Hazardous (CLASS 1 DIV 2)
  • Aluminum Enclosure (IP30)
Data Sheet Design-In Support
WR44RR family Digi International
  • Enterprise class router
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing with M12 connectors (certified according to AARS-5702, EN50155 & AREMA C6H standards)
Data Sheet Design-In Support
WR44 family Digi International
  • 4 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing / IP30
Data Sheet Design-In Support
WR41 family Digi International
  • 1 x Ethernet port
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Automatically switches between Wi-Fi and cellular connection
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR21 family Digi International
  • 1 or 2 Ethernet ports
  • VPN and firewall
  • Optional integrated 802.11 b/g/n Wi-Fi access point
  • Dual SIM
  • Industrial temperature range
  • Digi Device Cloud ready
  • Metal housing
Data Sheet Design-In Support
WR11 family Digi International
  • 1 x Ethernet port
  • Cellular LTE/HSPA+ with 3G and 2G fallback
  • 2 SIM Slots
  • XT variant comes with metal housing
  • XT variant with screw-down SIM cover
  • Digi Remote Manager
  • Power Input 5VDC
Data Sheet Design-In Support

GSM/GPRS/UMTS/HSPA Modems

Product Supplier Key Features
M72 Quectel
  • 30-pin LCC
  • 27.5 x 24.0 x 3.6mm
  • Dual-Band
M85 Quectel
  • 83-pin LCC
  • 24.5 x 25.3 x 2.6mm
  • Quad-Band

DAB, DAB+

DAB/ DAB+ (Digital Audio Broadcasting)

Frontend and Baseband ICs

Product Supplier Key Features
PNxxxx family PnP Network Technologies
  • DAB 1.0/1.5/2.0/2.5
  • DRM Back-End
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support
PNSxxxx family PnP Network Technologies
  • Supports: DAB, DAB+, T-DMB, FM-RDS, DRM & HD
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

WWR (World Wide Radio)

WWR

Product Supplier Key Features
PAIOS family PnP Network Technologies
  • Supports:
    • DAB/DAB+/DMB-A
    • DRM/DRM+
    • AM/FM
    • HD radio
  • Antenna Diversity (MRC)
  • Automotive Grade
  • Integration Support
  • Customized Software
Design-In Support

GPS, Glonass, Galileo & Beidou

GNSS Modules

RADIONOVA Antenna Modules

Product Supplier Key Features
M10578-A3 Antenova
  • Mediatek MT3333
  • 13.8 x 9.5 x 1.8 mm
  • GNSS module
  • Bandwith: 50MHz
  • External antenna support
  • Host interface: UART
  • CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet
M10578-A2 Antenova
  • Mediatek MT3337-E
  • 13.8 x 9.5 x 1.8 mm
  • GPS module
  • Bandwith: 30MHz
  • External antenna support
  • Host interface: UART, CMOS 3.3v
  • Sensitivity acquisition/tracing: -148 dBm/-165 dBm
Design-In Support Data Sheet

Lxx series (MTK based)

Product Supplier Key Features
L70(-R) Quectel
  • L70(-R)
  • MT3329
  • 10 x 10 mm
  • GPS module
Data Sheet Design-In Support
L80 Quectel
  • L80
  • MT3329
  • 16 x 16 mm
  • GPS antenna module
Data Sheet Design-In Support
L76 Quectel
  • MT3333
  • 10 x 10 mm
  • GNSS module
Data Sheet More Info Design-In Support

SiRFstarV Multi-GNSS platform

SiRFstarV e, ea

Product Supplier Key Features
SiRFstarV 5ea Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130 dBm)
  • Hot start
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10 Hz propagated
  • SiRFdrive support
Design-In Support
SiRFstarV 5e Qualcomm
  • Tracking channels: 52
  • Jamming Removal: 8 in-band channels
  • TTFF (@ -130dBm)
  • Hot start
  • Sensitivity
  • Acquisition (GPS -147dBm)
  • Tracking (GPS -165dBm, GLONASS -163dBm)
  • Navigation (GPS -162dBm, GLONASS-157dBm)
  • Update Rates: 1 & 5Hz calculated, 10Hz propagated
Design-In Support

RF-ICs

Mixer, PLL Synthesizer, VGA

Mixer, PLL, Synthesizer, VGA up to 8GHz

Product Supplier Key Features
AK1548 AKM - Asahi Kasei Microdevices
  • Operating frequency: 3GHz to 8GHz
  • Charge pump current: TBD typical, 8steps -The current range can be controlled by an external resistor
  • Fast lock mode: The programmable timer can switch two charge pump current setting
  • Supply voltage: 2.7V to 3.3V (PVDD, AVDD pins)
  • Charge pump power supply: Separately controlled, PVDD to 5.5V (CPVDD pin)
  • Phase noise: -226dBc/Hz
  • Current consumption: 15mA typical + Charge pump current
  • On-chip PLL Lock Detection: Selectable Phase Frequency Detector (PFD) Output or digital filtered - Lock detect
  • Package: 20pin QFN (0.5mm pitch, 4mm x 4mm x 0.75mm)
  • Operating temperature range: -40°C to 85 °C
Data Sheet More Info Design-In Support
AK1575 AKM - Asahi Kasei Microdevices General:
  • RF output frequency Range 690 MHz to 4,0 GHz
  • IF input frequency Range 20 MHz to 500 MHz
  • LO frequency Range 262,5 MHz to 4,4 GHz
  • Supply Voltage : 4,75 to 5,25 V (Mixer) 2,7 to 3,6 V / 4,75 to 5,25 V (Synthesizer /VCO)
  • Current Consumption: 150 mA (typ.)
  • Package: 32pin QFN (0,5 mm pitch, 5 mm x 5 mm x 0,85 mm)
  • Operating Temperature : -40°C ~ 85°C
Synthesizer/VCO:
  • Normalized Phase Noise -218 dBc/Hz
  • Phase Noise -111 dBc/Hz @100 kHz fo=2,1 GHz Mixer (frf=2 GHz)
  • Conversion Gain -1,5 dB typ.
  • Input 3rd orders intercept point +24 dBm typ.
  • Noise Figure 13 dB typ.
Data Sheet Design-In Support
AK1572 AKM - Asahi Kasei Microdevices General:
  • RF input frequency range 690MHz to 4.0GHz
  • IF output frequency range 20MHz to 500MHz
  • LO frequency range 262.5MHz to 4.4GHz
  • Supply voltage : 4.75V to 5.25 V (Mixer) 2.7V to 3.6 V / 4.75V to 5.25V (Synthesizer/VCO)
  • Current consumption: 150mA typical
  • Package: 32pin QFN (0.5 mm pitch, 5 mm x 5 mm x 0.85 mm)
  • Operating temperature range : -40°C to 85°C
Synthesizer/VCO:
  • Normalized phase noise -218 dBc/Hz
  • Phase noise -111 dBc/Hz @100 kHz fo=2.1 GHz Mixer (frf=2GHz)
  • Conversion gain -1.5dB typical
  • Input 3rd orders intercept point +23dBm typical
  • Noise figure 14dB typical
Data Sheet Design-In Support
AK1228 AKM - Asahi Kasei Microdevices
  • Input frequency: 10MHz to 2000MHz
  • Output frequency: 10MHz to 1000MHz
  • Operating supply current: 4.5mA to 10.5mA
  • Analog circuit characteristics: current consumption:10.5mA, IIP3:+12dBm, Gain:4dBm, NF: 8.5dB
  • LO input level: -10 to +5dBm
  • Operating supply voltage: 2.7V to 5.25V
  • Package: 16pin UQFN (0.5 mm pitch, 3 mm x 3 mm x 0.6 mm)
  • Operating temperature range: -40°C to 85°C
Data Sheet More Info Design-In Support

Remote Keyless entry

TPMS and Keyless Entry IC´s up to 435MHz

Product Supplier Key Features
AK3712 AKM - Asahi Kasei Microdevices
  • Maximum output power : +11dBm (typical)
  • Adjustable output power: from +7.5dBm to +11dBm (0.5dB step)
  • Output power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current : 16 mA (typical) (Maximum output power is set)
  • Low static current : 10nA (3V, RT)
  • Fast start-up time : 1.0 ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0V to 3.3 V
  • Small package: 10pin MSOP (3.1 mm × 3.1 mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3711 AKM - Asahi Kasei Microdevices
  • Maximum output power: +5dBm
  • Adjustable output power: from -2 to +5dBm (1dBstep)
  • Transmisson power is kept constant in spite of the variation of cell battery voltage or temperature
  • Low operating current: 10mA /9mA (300MHz/400MHz band) (3V, RT, maximum output power is set) Low static current : 10nA (3V, RT)
  • Fast start-up time : 1,0ms (the time oscillator starts up and PLL is locked up)
  • Supply voltage: 2.0 to 3.6V
  • Small package: 10pin MSOP (3.1mm × 3.1mm × 1.1mm)
  • Compliant to AEC-Q100
More Info Design-In Support
AK3701 AKM - Asahi Kasei Microdevices
  • Advanced direct conversion architecture (low power structure)
  • Excellent receiver sensitivity:
    • 118 dBm (BER=10-3, FSK, Deviation=+/-15 kHz, data rate=2.8 kbps) ,
    • 117 dBm (BER=10-3, ASK, data rate=2.8 kbps)
  • Self polling mode
  • Low current consumption: 9 mA (5 V, RT)
  • High ability to reject interference signal operating hopping channel and digital filter
  • Fast start-up time from power down mode
  • Supply voltage: 4.5 V ~ 5.5 V
  • Package: 28pin TSSOP (9.8 mm×4.5 mm×0.95 mm)
  • Compliant to AEC-Q100
More Info Design-In Support

Two way radio

IF Receiver for two radio

Product Supplier Key Features
AK2365A AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5 V
  • Wide operating temperature: Ta = -40°C to 85 °C
  • High sensitivity: -102 dBm at 12 dB SINAD
  • Built-in PGA and 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2MHz)
  • Built-in programmable AGC+BPF circuits corresponding to E to J type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 6mA
  • Compact plastic packaging: 32-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info
AK2364 AKM - Asahi Kasei Microdevices
  • Low operating voltage: VDD = 2.6V to 5.5V
  • Wide operating temperature: Ta = -40°C to 85°C
  • Hi sensitivity: -104 dBm at 12 dB SINAD
  • Built-in 2nd Mixer
  • Local frequency: 45,9 MHz, 50,4 MHz, 57,6 MHz (Triple of 15,3, 16,8 and 19,2 MHz)
  • Built-in programmable AGC+BPF circuits corresponding to D to G type ceramic filters
  • Built-in PLL FM detector
  • RSSI function
  • Built-in noise squelch circuits
  • Low consumption current: 7mA
  • Compact plastic packaging, 28-pin QFNJ (4,0 x 4,0 x 0,75mm, 0,4mm pitch)
Data Sheet Design-In Support More Info

Wi-Fi

Intelligent Wi-Fi Modules (incl. Microcontoller)

Digi Connect Core Modules

Product Supplier Key Features
ConnectCore 6UL (Ultra Lite) Digi International
  • NXP i.MX6UL-2, Cortex-A7 @ 528 MHz
  • Up to 2 GB NAND flash, up to 1 GB DDR3
  • Pre-certified 802.11a/b/g/n/ac + Bluetooth 4.1 option
  • 10/100 Ethernet (IEEE1588),Microntroller Assist - Ultra-low power ARM® Cortex®-M0+
  • MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2xUSB 2.0 OTG, 3xI2S,1xS/PDIF,2xFlexCAN,4xI2C
  • 4xSPI, 7xUART, 2x12-bit ADC, up to 103 GPIOs
  • 2D Pixel Processing Pipeline (PXP, up to 150 MPixel/s), 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel
Data Sheet Design-In Support
ConnectCore 6 Digi International
  • Freescale i.MX6 (Solo/Dual/Quad) ARM Cortex-A9 @ up to 1.2GHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Gigabit Ethernet (MII) w/IEEE1588
  • UART, USB, CAN, MIPI DSI/CSI, CSI, I2C, I2S, crypto/security, MMC/SDXC, PCI Express (x1)
  • Up to 4 displays (HDMI, LVDS, RGB)
  • Low-profile 50 mm x 50 mm x 5 mm footprint (SMT)
  • Up to -40 to 85°C operating temperature
Data Sheet Design-In Support
ConnectCard for i.MX28 Digi International
  • Freescale i.MX28 ARM9 @454 MHz
  • 802.11a/b/g/n + Bluetooth 4.0
  • Running Linux or Android
  • Up To 256MB Flash and RAM
  • Single/dual 10/100 Mbit/s Ethernet
  • PCI Express Mini Card
  • Up to -40°C to 85°C operating temperature range
Data Sheet Design-In Support

Digi Connect Modules

Product Supplier Key Features
Digi Connect Wi-ME 9210~~~ Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75 MHz
  • 802.11 b/g/n (2.4 GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8 MB Flash and 16 MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Temperature Range: Industrial: -40 °C ~ +85 °C
XBee Wi-Fi ~~~Modules Digi International
  • 802.11 b/g/n (2.4 GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host Interface: UART/SPI
  • Different Antenna Options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications with
  • Temperature Range: Industrial: -40 °C ~ +85 °C
Digi Connect Wi-ME 9210 Digi International
  • 32-bit Digi NS9210 processor ARM926EJ-S @75MHz
  • 802.11 b/g/n (2.4GHz)
  • Programmable (Net+OS, Linux, Plug & Play)
  • Up To 8MB Flash and 16MB RAM
  • Host Interface: UART/SPI
  • FIM: Flexible Interface Module: UART, 1-Wire, USB device (low-speed), CAN BUS
  • On-Chip Hardware Encryption Engine
  • RJ-45 form factor compatible with Digi Connect ME 9210
  • Operating temperature range: Industrial: -40 °C to +85 °C
Data Sheet Design-In Support
XBee Wi-Fi Modules Digi International
  • 802.11 b/g/n (2.4GHz)
  • Configuration by Web browser, AT command set, API frames
  • Host interface: UART/SPI
  • Different antenna options: Whip, 1 x U.FL, 1 x RP-SMA, PCB antenna
  • Native Device Cloud integration for data acquisition and device management over the Cloud
  • XBee form factor (THT & SMT)
  • Common XBee footprint allows OEMs to support a variety of wireless protocols
  • Support for low-power sleeping applications
  • Operating temperature range: Industrial: -40 °C ~ +85 °C
Data Sheet Design-In Support

PremierWave Modules

Product Supplier Key Features
PremierWave GG2050 Lantronix
  • 802.11ac Wi-Fi module for high performance Enterprise IoT - Wi-Fi Ethernet bridging Applications
  • IEEE 802.3 MAC and PHY, 10BaseT and 100BaseT
  • Simultaneous AP and Client Access - 14 simultaneous client connections
  • configurable via CLI , Web Browser (HTTP/HTTPS), Web Services API (HTTPS), XML Configuration and XML Status (CLI, FTP, API)
  • AES/CCMP and TKIP encryption, WPA/WPA2 Personal, WPA2 Enterprise, NIST Certified AES (FIPS-197), FIPS 140-2 Level 1 Certification
Data Sheet Design-In Support
PremierWave EN Lantronix
  • 32-bit ARM9 Processor @400MHz
  • 802.11a/b/g/n Dual Band radio module
  • Host interface UART, SPI, 10/100 Ethernet (Bridging)
  • Linux SDK with IPv6 Support
  • Full TCP/IP stack and web Server
  • 2 x U.FL or 1 x U.FL + chip antenna
  • Selectable frequency for each antenna
  • Ethernet-WLAN bridging
  • Security WPA/WPA2 enterprise
  • End-to-end SSL TLS and SSH tunneling
  • Virtual IP (VIP) enabled
  • Operating temperature range -40°C to +85°C
Data Sheet Design-In Support

Wi-Port Modules

Product Supplier Key Features
Wi-Port Lantronix
  • Lantronix DSTni-EX 186 CPU
  • 802.11b/g
  • Host Interface UART (921kbps)
  • Full TCP/IP stack, web server and Windows deployment software
  • 1 x U.FL connector
  • Lantronix SmartRoam technology provides seamless mobile connectivity and improved reliability
  • Temperature Range -40°C to +70°C
  • Ethernet-WLAN Bridging possible
  • Bulletproof wireless security with IEEE 802.11i-PSK, WPA-PSK, TKIP
Data Sheet Design-In Support

xPico Wi-Fi Modules

Product Supplier Key Features
XPico 200 Lantronix
  • 802.11a/b/g/n WLAN, entweder mit integrierter Antenne, oder mit zwei U.FL-Anschlüssen
  • Ein 10/100 Mbps Ethernet MAC (RMII)
  • USB 2.0 high Speed Schnittstelle  (Host- oder Devicemodus)
  • Eine TTL-UART-Schnittstelle mit RTS / CTS
  • Eine Master / Slave-SDIO-Schnittstelle
  • Eine SPI-Schnittstelle (nur Master-Modus, 24 MHz)
  • Bis zu 10 konfigurierbare GPIO-Pins
  • 3,3-V-Stromanschluss und Logik-IO
  • Interner Reset-Schaltkreis
  • Integrierte wake up / shutdown Logik  für Sleep / Standby 
Design-In Support Data Sheet

XPico Modules

Product Supplier Key Features
xPico Wi-Fi Lantronix
  • ARM Cortex M3 class processor with on-chip Flash and SRAM
  • 802.11b/g/n
  • Host Interface UART (921 kbps, SPI, USB)
  • Full TCP/IP stack and web server
  • 8 GPIO
  • Simultaneous access point and client mode
  • 1 x U.FL connector
  • Chip-sized footprint: 24mm x 16.5mm
  • Temperature Range -40°C to +85°C
  • Ethernet-WLAN Bridging possible
  • Security WPA/WPA2 personal
  • Available as SMT version
Data Sheet More Info Design-In Support

Wi-Fi Frontend Modules

Wi-Fi - PCIe Frontend Modules

Product Supplier Key Features
WPEQ-256ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm Atheros QCA9892-BR4B
  • Antenna: 2 x U.FL connectors, 2T2R
  • Data rate up to 867Mbps
  • Industrial-Grade Temperature: -40 ~ 85°C
  • Support Linux
Data Sheet Design-In Support
WPEQ-353ACNI SparkLAN
  • 802.11ac/b/g/n
  • Mini PCI-E
  • Qualcomm QCA9890-BR4B
    • Antenna: 3 x U.FL connectors, 3T3R
    • Data rate up to 1.3Gbps
    • Industrial-Grade Temperature: -40 ~ 85°C
    • Support Linux
Data Sheet Design-In Support
WPEA-251N(BT) SparkLAN
  • 802.11a/b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR9462
  • 2T2R
Data Sheet Design-In Support
WPEA-152GN(BT) SparkLAN
  • 802.11b/g/n Wi-Fi + Bluetooth
  • Half Mini Card
  • Qualcomm Atheros AR3012 + AR9485
  • 1T1R
Data Sheet Design-In Support
WPEA-121N SparkLAN
  • 802.11a/b/g/n
  • Half Mini Card
  • Qualcomm Atheros AR9382
  • 2T2R
Data Sheet Design-In Support
WPEA-252NI SparkLAN
  • 802.11a/b/g/n
  • Mini Card
  • Qualcomm Atheros AR9592-AR1B
  • 2T2R
  • Industrial temperature range: -40°C to 85°C
Data Sheet Design-In Support
WPEA-351AC SparkLAN
  • 802.11ac/a/n
  • Mini Card
  • Qualcomm Atheros QCA9880
  • 3T3R
Data Sheet Design-In Support
WPET-232ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Realtek RTL8812AE
  • 2T2R
Data Sheet Design-In Support
WPEA-352ACN SparkLAN
  • 802.11ac/b/g/n
  • Mini Card
  • Qualcomm Atheros QCA9880-BR4A
  • 3T3R
Data Sheet Design-In Support

Wi-Fi - USB Frontend Modules

Product Supplier Key Features
WUBR-508N Module Series / Dongle SparkLAN
  • 802.11a/b/g/n USB Module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-Pin, or 4-Pin Wafer connector)
  • Dongle version available
WUBR-508N SparkLAN
  • 802.11a/b/g/n USB module
  • MediaTek (Ralink) RT5572, 2T2R (USB 2.0 Type A, 4-pin, or 4-pin wafer connector)
  • Dongle version available
Data Sheet Design-In Support
WUBA-171GN SparkLAN
  • 802.11b/g/n High-Power USB module
  • Atheros AR9271
  • 1T1R (5-pin pin-header)
  • Industrial temperature range: -30°C to 75°C
Data Sheet Design-In Support
WUBM-273ACN SparkLAN
  • 802.11ac/b/g/n USB module
  • MediaTek MT7612U
  • 2T2R
Data Sheet Design-In Support

Wi-Fi Gateways and Routers

ZigBee to Wi-Fi Gateways

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support

Wi-Fi ICs

Wi-Fi IoT Modules

Product Supplier Key Features
WSDQ-103GNI SparkLAN 802.11b/g/n Industrial-Grade IOT Module, Qualcomm Atheros QCA4010 , 1T1R
  • Standard: 802.11b/g/n
  • Host interface: UART, SPI/SDIO, I2C/I2S, USB, ADC
  • Chipset: Qualcomm Atheros QCA4010
  • Antenna: PCB Printed ANT, 1T1R
Data Sheet Design-In Support
SX-ULPGN Silex Technology
  • IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)
  • Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 Radio
  • Single Stream System (1x1), 20 MHz
  • Integrated RF front end and PCB trace antenna
  • Hostless IoT application development platform with large internal memory
  • UART AT command set for optional external MCU host
  • AllJoyn support
  • Wi-Fi Protected Setup Support
  • IPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host Controller
  • Ideal for cost effective Internet of Things (IoT) Applications
Design-In Support Data Sheet

Wi-Fi ICs

Product Supplier Key Features
QCA4531 Qualcomm
  • 650 MHz MIPS 24Kc CPU
  • Externer Speicherunterstützung für bis zu
    64 MB/128 MB DDR2 RAM
  • 128 MB SPI NOR Flash
  • 1 GB SPI NAND Flash
  • 2x2 11n Wi-Fi 2.4GHz Tx/Rx Antennenempfang
  • Große Auswahl an Peripheriegeräten SPI, GPIO, UART,
    Ethernet USB 2.0 Host, PCIe RC
  • Open Source Software QSDK, OpenWRT
  • Unterstützt AllJoyn®, HomeKit®, Weave
Data Sheet Design-In Support
QCA4012 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet
QCA4010 Qualcomm
  • 802.11a/b/g/n 1x1 Dual-Band Wi-Fi (QCA4012)
  • Leistungsstarke integrierte MCU und ein großer Speicher eliminieren
  • die Notwendigkeit für eine zusätzliche MCU, niedrigere Systemkosten
  • On-chip 130 MHz Prozessor
  • Große Auswahl an Peripheriegeräten: SPI, GPIO, I2C, I2S, UART, 6 PWM-I/F für Antriebsmotoren und LEDs 8-Kanal-ADC
  • Niedriger Stromverbrauch <9µA Off Power
  • Unterstützt AllJoyn®, HomeKit®, Weave
  • Integrierter IPv4/IPv6 Netzwerk-Stack
  • HW Crypto-Beschleuniger (AES 128/256, DES, SHA1/256)
Design-In Support Data Sheet

Wi-Fi/ Bluetooth Combos Solution

Wi-Fi / BT Combo ICs

Product Supplier Key Features
QCA402x Qualcomm
  • QCA4020 tri-mode SoC integrates Bluetooth 5 low energy, dual-band Wi-Fi, and 802.15.4 technologies
  • QCA4024 dual-mode SoC integrates Bluetooth 5 low energy and 802.15.4
    Isolated low power processors for connectivity
  • 15.4 SW MAC, 15.4 and BLE drivers, coex management
  • Wi-Fi operations (QCA4020 only)
  • Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and wireless protocol security
  • Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
  • Integrated sensor hub for post-processing designed to enable low power sensor use cases
  • Small package size allows for optimized form factors
Design-In Support Data Sheet
WNFQ-255ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • Host interface: NGFF (PCIe: WLAN; USB: Bluetooth)
  • Qualcomm Atheros QCA6174
    • Antenna: 2 x IPEX MHF4 connector, 2T2R
    • Concurrent Wi-Fi and BT co-existence
    • Data rate up to 867Mbps (MCS9)
    • Support Win7/Win8.1
Data Sheet Design-In Support
WNFQ-158ACN(BT) SparkLAN
  • 802.11ac/b/g/n
  • M.2 (PCIe: WLAN; USB2.0: Bluetooth)
  • Qualcomm Atheros QCA9377
    • Antenna: 2 x IPEX MHF4 connector, 1T1R with RX diversity
    • Concurrent Wi-Fi and BT co-existence
    • 802.11ac 2.0 with MU-MIMO
    • Data rate up to 433Mbps
    • Support Windows
Data Sheet Design-In Support
CSRC9x00 Qualcomm
  • BT4.0 with support for BT4.0+HS
  • 802.11a/b/g/n (Dual Band 2.4 GHz & 5 GHz support)
  • Flexible antenna configuration for BT/ Wi-Fi, single and dual antenna supported
  • Integrated 2.4 & 5 GHz PAs
  • Integrated DSP for host CPU off-loading
  • On chip wideband speech and AV decoding including aptX and SBC
  • Bluetooth stereo streaming with aptX
  • RAM based Wi-Fi firmware
  • Excellent Wi-Fi throughput performance, >80 Mbps
  • BGA and WLCSP
  • WFA-certified
  • Industrial and automotive version available
Design-In Support

Wi-Fi IoT Module

Product Supplier Key Features
XPico 200 Lantronix
  • 802.11a/b/g/n WLAN, entweder mit integrierter Antenne, oder mit zwei U.FL-Anschlüssen
  • Ein 10/100 Mbps Ethernet MAC (RMII)
  • USB 2.0 high Speed Schnittstelle  (Host- oder Devicemodus)
  • Eine TTL-UART-Schnittstelle mit RTS / CTS
  • Eine Master / Slave-SDIO-Schnittstelle
  • Eine SPI-Schnittstelle (nur Master-Modus, 24 MHz)
  • Bis zu 10 konfigurierbare GPIO-Pins
  • 3,3-V-Stromanschluss und Logik-IO
  • Interner Reset-Schaltkreis
  • Integrierte wake up / shutdown Logik  für Sleep / Standby 
Design-In Support Data Sheet

ZigBee

ZigBee Embedded Modules

XBee ZigBee Modules

Product Supplier Key Features
XBee Cellular NB-IoT Digi International
  • Extremely low power consumption for battery life of 10+ years
  • Excellent coverage and building penetration
  • Reduced hardware complexity with only 1 antenna required
  • Transparent and API modes simplify software integration
  • Integrated MicroPython programmability
  • Enhanced with Digi TrustFence™ security framework
  • CE/RED certified and network tested
  • Manage and configure with XCTU and Digi Remote Manager®
  • Available with Digi provided SIM cards and data plans
Data Sheet Design-In Support
XBee ZB Digi International
  • IEEE 802.15.4
  • ZigBee/ZigBee PRO
  • Digi Mesh
  • 2,4GHz/920MHz/900MHz/868MHz
  • Point-to-Point
  • Point-to-Multipoint
  • Mesh network
  • Through-Hole & SMT
Data Sheet Design-In Support

Zigbee Gateway-Solutions

Product Supplier Key Features
ConnectPort X2 family Digi International
  • HF to Internet Gateways for ZigBee and more HF products
  • Convient programming with Python scrips
  • Digi Device Cloud ready
  • Multiple types and configuration options:
    • XBee (ZigBee) to Ethernet/WiFi/Cellular
    • XBee-PRO 900HP to Ethernet
    • XBee (802.15.4) to Ethernet
    • XBee (ZigBee) Cloud Kit
Data Sheet Design-In Support
ConnectPort X4/X4H family Digi International
  • High-Speed connection to the internet via 2G/3G/Gobi GSM/EDGE/HSPA+/CMDA, EV-DO
  • Metal- or NEMA 4x/IP66 housing
  • Full routing functionality incl. IPsec/SSL, VPN with DES, 3DES or AES encryption
  • Easy development with DIA & Python scripts
  • Digi Device Cloud ready
  • Multiple configuration and connection options (among them: WiFi, Zigbee & Ethernet)
Data Sheet Design-In Support
ConnectPort X2e family Digi International ZigBee SE Router/Coordinator to Ethernet/3G/CDMA
  • Smart Energy Gateway
  • Certified according to ZigBee Allianz Smart Energy Public Application Profile 1.1
  • Device Cloud enables remote control of connectivity configuration, software updates & applications
Data Sheet Design-In Support